Profile information

Rico Ottermann

https://orcid.org/0000-0003-2870-2541
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Publications

  1. 2021
  2. Published

    Direktabgeschiedene Dünnfilmsensorik mithilfe einer neuartigen Beschichtungsanlage

    Ottermann, R., Klaas, D., Dencker, F. E. & Wurz, M., 2021, 27. NDVaK-Kolloquium. Dresden

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research

  3. Published

    Investigations on Silver Sintering using an Ultrasonic Transient Liquid Phase Sintering Process

    Hadeler, S., Seefisch, H., Ottermann, R., Long, Y., Dencker, F., Wurz, M. C. & Twiefel, J., 2021, 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). Institute of Electrical and Electronics Engineers Inc., p. 288-291 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  4. 2020
  5. Published

    Development, characterisation and high-temperature suitability of thin-film strain gauges directly deposited with a new sputter coating system

    Klaas, D., Ottermann, R., Dencker, F. & Wurz, M. C., 10 Jun 2020, In: Sensors (Switzerland). 20, 11, p. 1-15 15 p., 3294.

    Research output: Contribution to journal › Article › Research › peer review

  6. Published

    Direct Deposition of Thin-Film Strain Gauges with a New Coating System for Elevated Temperatures

    Ottermann, R., Klaas, D., Dencker, F., Wurz, M. C., Hoheisel, D., Rottengatter, P. & Kruspe, T., 2020, IEEE Sensors, SENSORS 2020: Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 9278661

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  7. 2019
  8. Published

    Elektrische Kontaktierung bauteilinhärenter Dehnungsmesssensorik mithilfe des Transient Liquid Phase (TLP) Bonding

    Ottermann, R., Knöpke, R. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 263-266 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

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