Publications
2019
- Published
Structuring of laser activated polymers for sensor applications
Bengsch, S., Aue, M., Cromwell, K. & Wurz, M. C., May 2019, IEEE 69th Electronic Components and Technology Conference (ECTC): Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 1883-1888 6 p. 8811368. (Proceedings - Electronic Components and Technology Conference; vol. 2019-May).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Herstellung induktiver elektrischer Bauelemente
Wurz, M. C. (Inventor), Maier, H. J. (Inventor) & Beringer, S. (Inventor), 25 Apr 2019, IPC No. H01F27/32 A I, H01F5/00, Patent No. DE102017124675A1, 23 Oct 2017, Priority date 23 Oct 2017, Priority No. DE102017124675AResearch output: Patent
- Published
AMR-based mechanical pressure sensors: a proof of concept
Prediger, M. S., Rechel, M. & Wurz, M. C., Mar 2019.Research output: Contribution to conference › Paper › Research
- Published
AMR Sensoren auf flexiblem substrat zur Messung von Verformungen eines hartmagnetischen Partikel-Elastomerverbunds
Prediger, M. S., Wittek, C. G. R., Owiss, G. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. 1. ed. VDE Verlag GmbH, p. 111-114 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Atomchips mit integrierten optischen Gittern zur Erzeugung von Bose-Einstein-Kondensaten
Kassner, A., Dencker, F., Künzler, C., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M. & Wurz, M., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 541-544 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Atom chip technology for use under UHV conditions
Kassner, A., Rechel, M., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M. & Wurz, M. C., 2019, Smart Systems Integration 2019: International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2019. Otto, T. (ed.). VDE Verlag GmbH, p. 69-75 7 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Elektrische Kontaktierung bauteilinhärenter Dehnungsmesssensorik mithilfe des Transient Liquid Phase (TLP) Bonding
Ottermann, R., Knöpke, R. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 263-266 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Fertigung und Charakterisierung von in Leiterplatten integrierten Mikrotransformatoren
Fischer, E., Cromwell, K. & Wurz, M., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 569-572 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
MEMS basierte magnetische passive Mikrobauteile für Hochfrequenz-Leistungsanwendungen
Dinulovic, D., Shousha, M., El Shafey, K., Haug, M. & Wurz, M., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 32-35 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Microfabricated Magnetics on Silicon for Point of Load High-Frequency DC-DC Converter Applications
Dinulovic, D., Shousha, M., Haug, M., Gerfer, A., Beringer, S., Wurz, M. C., Thone, J. & Wens, M., 2019, In: IEEE Transactions on Industry Applications. 55, 5, p. 5068-5077 10 p., 8732443.Research output: Contribution to journal › Article › Research › peer review
- Published
Simulationsgestützte Auslegung und Fertigung von werkzeugintegrierten induktiven Sensoren
Arndt, M., Dencker, F. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 673-676 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
The concept of a large working stroke reluctance zipper actuator
Glukhovskoy, A. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 506-509 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Vibro-tactile displays for stimulating surface impressions
Schmelt, A. S., Fischer, E. C., Hofmann, V., Twiefel, J. & Wurz, M. C., 2019, Proceedings of the 23rd International Congress on Acoustics: Integrating 4th EAA Euroregio 2019. Ochmann, M., Vorländer, M. & Fels, J. (eds.). p. 1000-1007 8 p. (Proceedings of the International Congress on Acoustics; vol. 2019-September).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2018
- Published
Elektrische Schaltungsstruktur und Verfahren zu deren Herstellung
Maier, H. J. (Inventor), Wurz, M. (Inventor) & Beringer, S. (Inventor), 25 Oct 2018, IPC No. H05K 3/ 40 A I, Patent No. DE102017108437, Priority date 20 Apr 2017, Priority No. DE201710108437Research output: Patent
- Published
Verfahren und Anlage zur Herstellung eines elektrischen Bauteils sowie Computerprogramm
Klaas, D. (Inventor), Wurz, M. C. (Inventor) & Maier, H. J. (Inventor), 11 Oct 2018, IPC No. C23C 16/ 04 A I, Patent No. DE102017113212, Priority date 15 Jun 2017, Priority No. DE201710113212Research output: Patent
- Published
Revealing of ultrasonic wire bonding mechanisms via metal-glass bonding
Long, Y., Dencker, F., Isaak, A., Li, C., Schneider, F., Hermsdorf, J., Wurz, M., Twiefel, J. & Wallaschek, J., Oct 2018, In: Materials Science and Engineering B: Solid-State Materials for Advanced Technology. 236-237, p. 189-196 8 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Design and characterization of the lateral actuator of a bimodal tactile display with two excitation directions
Schmelt, A. S., Hofmann, V., Fischer, E. C., Wurz, M. C. & Twiefel, J., Sept 2018, In: Displays. 54, p. 34-46 13 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Concept for Using MID Technology for Advanced Packaging
Wurz, M. C., Roesener, B., Bengsch, S. & Beringer, S., 7 Aug 2018, Proceedings: IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., p. 932-939 8 p. 8429656. (Proceedings - Electronic Components and Technology Conference; vol. 2018-May).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Structuring methods of polymers for low cost sensor manufacturing
Bengsch, S., Wurz, M. C., Aue, M. & De Wall, S., 7 Aug 2018, Proceedings: IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1396-1401 6 p. 8429726. (Proceedings - Electronic Components and Technology Conference; vol. 2018-May).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Self-cleaning mechanisms in ultrasonic bonding of Al wire
Long, Y., Dencker, F., Isaak, A., Hermsdorf, J., Wurz, M. & Twiefel, J., Aug 2018, In: Journal of Materials Processing Technology. 258, p. 58-66 9 p.Research output: Contribution to journal › Article › Research › peer review