Profile information

Prof. Dr.  Marc Christopher Wurz

https://orcid.org/0000-0002-2066-8142
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Publications

  1. 2019
  2. Published

    AMR-based mechanical pressure sensors: a proof of concept

    Prediger, M. S., Rechel, M. & Wurz, M. C., Mar 2019.

    Research output: Contribution to conference › Paper › Research

  3. Published

    AMR Sensoren auf flexiblem substrat zur Messung von Verformungen eines hartmagnetischen Partikel-Elastomerverbunds

    Prediger, M. S., Wittek, C. G. R., Owiss, G. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. 1. ed. VDE Verlag GmbH, p. 111-114 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  4. Published

    Atomchips mit integrierten optischen Gittern zur Erzeugung von Bose-Einstein-Kondensaten

    Kassner, A., Dencker, F., Künzler, C., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M. & Wurz, M., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 541-544 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  5. Published

    Atom chip technology for use under UHV conditions

    Kassner, A., Rechel, M., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M. & Wurz, M. C., 2019, Smart Systems Integration 2019: International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2019. Otto, T. (ed.). VDE Verlag GmbH, p. 69-75 7 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  6. Published

    Elektrische Kontaktierung bauteilinhärenter Dehnungsmesssensorik mithilfe des Transient Liquid Phase (TLP) Bonding

    Ottermann, R., Knöpke, R. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 263-266 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  7. Published

    Fertigung und Charakterisierung von in Leiterplatten integrierten Mikrotransformatoren

    Fischer, E., Cromwell, K. & Wurz, M., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 569-572 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  8. Published

    MEMS basierte magnetische passive Mikrobauteile für Hochfrequenz-Leistungsanwendungen

    Dinulovic, D., Shousha, M., El Shafey, K., Haug, M. & Wurz, M., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 32-35 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  9. Published

    Microfabricated Magnetics on Silicon for Point of Load High-Frequency DC-DC Converter Applications

    Dinulovic, D., Shousha, M., Haug, M., Gerfer, A., Beringer, S., Wurz, M. C., Thone, J. & Wens, M., 2019, In: IEEE Transactions on Industry Applications. 55, 5, p. 5068-5077 10 p., 8732443.

    Research output: Contribution to journal › Article › Research › peer review

  10. Published

    Simulationsgestützte Auslegung und Fertigung von werkzeugintegrierten induktiven Sensoren

    Arndt, M., Dencker, F. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 673-676 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  11. Published

    The concept of a large working stroke reluctance zipper actuator

    Glukhovskoy, A. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 506-509 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  12. Published

    Vibro-tactile displays for stimulating surface impressions

    Schmelt, A. S., Fischer, E. C., Hofmann, V., Twiefel, J. & Wurz, M. C., 2019, Proceedings of the 23rd International Congress on Acoustics: Integrating 4th EAA Euroregio 2019. Ochmann, M., Vorländer, M. & Fels, J. (eds.). p. 1000-1007 8 p. (Proceedings of the International Congress on Acoustics; vol. 2019-September).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  13. 2018
  14. Published

    Elektrische Schaltungsstruktur und Verfahren zu deren Herstellung

    Maier, H. J. (Inventor), Wurz, M. (Inventor) & Beringer, S. (Inventor), 25 Oct 2018, IPC No. H05K 3/ 40 A I, Patent No. DE102017108437, Priority date 20 Apr 2017, Priority No. DE201710108437

    Research output: Patent

  15. Published

    Verfahren und Anlage zur Herstellung eines elektrischen Bauteils sowie Computerprogramm

    Klaas, D. (Inventor), Wurz, M. C. (Inventor) & Maier, H. J. (Inventor), 11 Oct 2018, IPC No. C23C 16/ 04 A I, Patent No. DE102017113212, Priority date 15 Jun 2017, Priority No. DE201710113212

    Research output: Patent

  16. Published

    Revealing of ultrasonic wire bonding mechanisms via metal-glass bonding

    Long, Y., Dencker, F., Isaak, A., Li, C., Schneider, F., Hermsdorf, J., Wurz, M., Twiefel, J. & Wallaschek, J., Oct 2018, In: Materials Science and Engineering B: Solid-State Materials for Advanced Technology. 236-237, p. 189-196 8 p.

    Research output: Contribution to journal › Article › Research › peer review

  17. Published

    Design and characterization of the lateral actuator of a bimodal tactile display with two excitation directions

    Schmelt, A. S., Hofmann, V., Fischer, E. C., Wurz, M. C. & Twiefel, J., Sept 2018, In: Displays. 54, p. 34-46 13 p.

    Research output: Contribution to journal › Article › Research › peer review

  18. Published

    Concept for Using MID Technology for Advanced Packaging

    Wurz, M. C., Roesener, B., Bengsch, S. & Beringer, S., 7 Aug 2018, Proceedings: IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., p. 932-939 8 p. 8429656. (Proceedings - Electronic Components and Technology Conference; vol. 2018-May).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  19. Published

    Structuring methods of polymers for low cost sensor manufacturing

    Bengsch, S., Wurz, M. C., Aue, M. & De Wall, S., 7 Aug 2018, Proceedings: IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1396-1401 6 p. 8429726. (Proceedings - Electronic Components and Technology Conference; vol. 2018-May).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  20. Published

    Self-cleaning mechanisms in ultrasonic bonding of Al wire

    Long, Y., Dencker, F., Isaak, A., Hermsdorf, J., Wurz, M. & Twiefel, J., Aug 2018, In: Journal of Materials Processing Technology. 258, p. 58-66 9 p.

    Research output: Contribution to journal › Article › Research › peer review

  21. Published

    Verfahren zur Anbringung einer elektrischen Mikrostruktur sowie Elastomerstruktur, Faserverbundbauteil und Reifen

    Maier, H. J. (Inventor), Wurz, M. (Inventor) & Bengsch, S. (Inventor), 14 Jun 2018, IPC No. H05K 3/ 20 A I, Patent No. DE102016123795, Priority date 8 Dec 2016, Priority No. DE201610123795

    Research output: Patent

  22. Published

    The mechanism of charge carrier generation at the TiO2—n-Si heterojunction activated by gold nanoparticles

    Mishin, M. V., Vorobyev, A. A., Kondrateva, A. S., Koroleva, E. Y., Karaseov, P. A., Bespalova, P. G., Shakhmin, A. L., Glukhovskoy, A. V., Wurz, M. C. & Filimonov, A. V., 11 Jun 2018, In: Semiconductor Science and Technology. 33, 7, 075014.

    Research output: Contribution to journal › Article › Research › peer review

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