Publications
2024
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Directly Deposited Thin-Film Strain Gauges for Force Measurement at Guide Carriages
Ottermann, R., Kowalke, D., Denkena, B., Korbacher, M., Müller, M. & Wurz, M. C., 15 Dec 2024, In: IEEE sensors journal. 24, 24, p. 40471-40484 14 p.Research output: Contribution to journal › Article › Research › peer review
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Propriozeption in der Soft Robotics
Müller, E., Cao, B., Peters, J., Raatz, A. & Wurz, M., 11 Dec 2024, In: WT Werkstattstechnik. 114, 11-12, p. 735-740 6 p.Research output: Contribution to journal › Article › Research › peer review
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Laser Direct Structuring of Millable BN‐AlN Ceramic for Three‐Dimensional (3D) Components
Raumel, S., Xiao, X., Bengsch, S. & Wurz, M. C., 4 Dec 2024, In: Advanced engineering materials. 26, 23, 2401271.Research output: Contribution to journal › Article › Research › peer review
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Compensation of strain gauge signal changes due to position-based internal changes in sensory linear guides
Denkena, B., Buhl, H., Kowalke, D., Ottermann, R. & Wurz, M., 23 Oct 2024, ICPE2024: The 20th International Conference on Precision Engineering. 6 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Polymer-Free Batch Production and Application of Metal Foil-Based Thin-Film Strain Gauges
Ottermann, R., Müller, E., Keßler, M., Dencker, F., Klaas, D. & Wurz, M. C., 20 Oct 2024, 2024 IEEE Sensors, SENSORS 2024 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., (Proceedings of IEEE Sensors).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Waveguides Written by Femtosecond Laser in CVD Diamonds
Perevoznik, D., Locmelis, J., Zuber, D., Glukhovskoy, A., Afentaki, A., Hinkelmann, M., Dencker, F., Wurz, M. & Morgner, U., 18 Oct 2024, In: EPJ Web of Conferences. 307, 2 p., 02034.Research output: Contribution to journal › Conference article › Research › peer review
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Miniaturized Rubidium Source for Generating Vapor Phase Atoms for Magneto Optical Traps
Koch, J., Diekmann, L. F., Kassner, A., Dencker, F. & Wurz, M. C., 15 Jul 2024, 2024 37th International Vacuum Nanoelectronics Conference, IVNC 2024. Institute of Electrical and Electronics Engineers Inc., (International Vacuum Nanoelectronics Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- E-pub ahead of print
Design and Manufacture of Face Grinding Wheels with Micro-Structured Channels
Steinhoff, L., Tubbe, E., Dencker, F., Denmark, T., Kausch, L. & Wurz, M. C., 11 Jun 2024, (E-pub ahead of print) 24th International Conference & Exhibition.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Modification of glass by a laser for the use in micro-electric systems and quantum devices
Keinert, L., Koch, J. (Contributor), Künzler, C. (Contributor), Dehning, K. J. (Contributor), Kassner, A. (Contributor), Dencker, F. (Contributor), Zimmermann, S. (Contributor) & Wurz, M. (Contributor), 11 Mar 2024, Book of abstracts for the EQTC 2023. Schnitger, A., Husemann, R. & Liebisch, T. (eds.). Hannover, p. 91Research output: Chapter in book/report/conference proceeding › Conference abstract › Research
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Integrated multimode optical waveguides in glass using laser induced deep etching
Reitz, B., Evertz, A., Basten, R., Wurz, M. C. & Overmeyer, L., 1 Feb 2024, In: Applied optics. 63, 4, p. 895-903 9 p.Research output: Contribution to journal › Article › Research › peer review
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Femtosecond Laser Written Waveguides in CVD Diamonds
Perevoznik, D., Locmelis, J., Zuber, D., Glukhovskoy, A., Afentaki, A., Hinkelmann, M., Dencker, F., Wurz, M. & Morgner, U., 2024.Research output: Contribution to conference › Paper › Research › peer review
- Published
Glass-Extraction Electrode for Field Emission Applications
Buchta, A. M., Kassner, A., Dencker, F. & Wurz, M. C., 2024, 2024 37th International Vacuum Nanoelectronics Conference (IVNC). (International Vacuum Nanoelectronics Conference proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Manufacturing and Characterization of Planar Transformers as Molded Interconnect Device Technology Component for an Industrial Production
Bierwirth, T. N., Bengsch, S., Werner, M., Wachs, R., Henne, C., Bur, S., Dencker, F. & Wurz, M. C., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 2172-2177 6 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Push-Button Rotational Energy Harvester for Wireless Sensor Nodes
Adamscheck, M., Wurz, M. C. & Klaas, D., 2024, EASS 2024: Energieautonome Sensorsysteme 2024 - 12. GMM-Fachtagung. VDE Verlag GmbH, p. 57-59 3 p. (GMM-Fachberichte; vol. 109).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Silicon-based membrane pressure sensor for inline monitoring of pressure and hermeticity of small-volume bonded packages
Koch, J., Brinkmann, L. M., Kassner, A., Dencker, F. & Wurz, M. C., 2024, 2024 IEEE 74th Electronic Components and Technology Conference : (ECTC). Institute of Electrical and Electronics Engineers Inc., p. 193-200 8 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2023
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Manufacturing of a Reluctance Actuator for Use as a Hearing Implant in the Middle Ear
Müller, E., Adamscheck, M., Fischer, E. C., Glukhovskoy, A., Prediger, M. S., Dencker, F. & Wurz, M., 23 Nov 2023, MikroSystemTechnik Kongress 2023.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Sensoren richtig positioniert
Denkena, B., Klemme, H., Kowalke, D., Wurz, M., Ottermann, R., Korbacher, M. & Müller, M., 7 Nov 2023, Konstruktion und Entwicklung, 2023, 6, p. 42-45 4 p.Research output: Contribution to specialist publication › Contribution in popular science journal › Transfer
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Fabrication Method and Characterization of Molded Interconnect Device Micro Transformer in Planar Form by Embedding Sintered Ferrite Cores
Bierwirth, T. N., Fischer, E. C., Prediger, M. S., Le, T. M., Dencker, F. & Wurz, M. C., Oct 2023, MikroSystemTechnik Kongress 2023: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 599-604 6 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
- Published
Detailed characterisation of batch-manufactured flexible micro-grinding tools for electrochemical assisted grinding of copper surfaces
Steinhoff, L., Ottermann, R., Dencker, F. & Wurz, M. C., Sept 2023, In: The International Journal of Advanced Manufacturing Technology. 128, 5-6, p. 2301-2310 10 p.Research output: Contribution to journal › Article › Research › peer review
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Direct Sensor Integration on the Raceway of Roller Bearings
Pape, F., Konopka, D., Coors, T., Poll, G., Steppeler, T., Ottermann, R., Dencker, F. & Wurz, M., Sept 2023, 9 p.Research output: Book/Report › Conference proceeding › Research
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Characterization of the tribologically relevant cover layers formed on copper in oxygen and oxygen-free conditions
Raumel, S., Barienti, K., Luu, H. T., Merkert, N., Dencker, F., Nürnberger, F., Maier, H. J. & Wurz, M. C., Aug 2023, In: Friction. 11, 8, p. 1505–1521 17 p.Research output: Contribution to journal › Article › Research › peer review
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Novel Glass-Silicon Emitter Chip for Field Emission Applications
Buchta, A. M., Kassner, A., Voß, J., Leopold, T., Petring, J., Diekmann, L., Dencker, F. & Wurz, M. C., 27 Jul 2023, 2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC). p. 207-209 3 p. ( International Vacuum Nanoelectronics Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Micro-integrated optical systems and qualification of adhesive integration technologies for cold atomic quantum sensors
Christ, M., Stiekel, A., Stölmacker, C., Zimmermann, C., Kassner, A., Wurz, M. & Krutzik, M., 12 Jul 2023, International Conference on Space Optics, ICSO 2022. Minoglou, K., Karafolas, N. & Cugny, B. (eds.). SPIE, 1277718. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12777).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Enhanced findability and reusability of engineering data by contextual metadata
Altun, O., Oladazimi, P., Wawer, M. L., Raumel, S., Wurz, M., Barienti, K., Nürnberger, F., Lachmayer, R., Mozgova, I., Koepler, O. & Auer, S., 19 Jun 2023, In: Proceedings of the Design Society. 3, p. 1635-1644 10 p.Research output: Contribution to journal › Conference article › Research › peer review
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Soliton compression and supercontinuum spectra in nonlinear diamond photonics
Melchert, O., Kinnewig, S., Dencker, F., Perevoznik, D., Willms, S., Babushkin, I., Wurz, M., Kues, M., Beuchler, S., Wick, T., Morgner, U. & Demircan, A., Jun 2023, In: Diamond and Related Materials. 136, 109939.Research output: Contribution to journal › Article › Research › peer review
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Influence of Microscale Tin Particles on Mechanical Properties of Silver Sintering Joints with Reduced Processing Parameters
Hadeler, S., Long, Y., Ottermann, R., Dencker, F., Twiefel, J. & Wurz, M. C., May 2023, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC): Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 676-681 6 p. (Proceedings - Electronic Components Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Application of batch manufactured flexible micro-grinding tools on copper and oxidized copper surfaces
Steinhoff, L., Dencker, F. & Wurz, M. C., 27 Mar 2023, In: Tribologie und Schmierungstechnik. 70, 1, p. 5-10 6 p.Research output: Contribution to journal › Article › Research › peer review
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Detection of joining mechanisms at different locations of the wire/substrate interface during ultrasonic wire bonding via a PZT-based sensor array
Long, Y., Arndt, M., Sun, C., Dencker, F., Wurz, M. & Twiefel, J., Mar 2023, In: Journal of Materials Processing Technology. 312, 117826.Research output: Contribution to journal › Article › Research › peer review
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Process Development for Batch Production of Micro-Milling Tools Made of Silicon Carbide by Means of the Dry Etching Process
Wittek, C. R., Steinhoff, L., Raumel, S., Reißfelder, M., Dencker, F. & Wurz, M. C., 28 Feb 2023, In: Micromachines. 14, 3, 580.Research output: Contribution to journal › Article › Research › peer review
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Monitoring of the Flange Draw-In During Deep Drawing Processes Using a Thin-Film Inductive Sensor
Fünfkirchler, T., Arndt, M., Hübner, S., Dencker, F., Wurz, M. C. & Behrens, B. A., 2 Feb 2023, Lecture Notes in Production Engineering. Springer Nature, p. 111-121 11 p. (Lecture Notes in Production Engineering; vol. Part F1163).Research output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research › peer review
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Advancements in monitoring of tribological stress in bearings using thin-film strain gauges
Konopka, D., Steppeler, T., Ottermann, R., Pape, F., Dencker, F., Poll, G. & Wurz, M., 2023, p. 1623-1634.Research output: Contribution to conference › Paper › Research › peer review
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Development and Characterization of transferable Thin Film Sensor Technology on Carbon Fibre reinforced Plastics
Hadeler, S., Vogt, F. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 113-116 4 p. (MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Force sensing linear rolling guides based on modified metal strain gauges
Denkena, B., Klemme, H., Kowalke, D., Korbacher, M., Ottermann, R., Dencker, F. & Wurz, M., 2023, European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 23rd International Conference and Exhibition, EUSPEN 2023. Riemer, O., Nisbet, C. & Phillips, D. (eds.). p. 207-210 4 p. (European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 23rd International Conference and Exhibition, EUSPEN 2023).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Influence of oxide layers on the mechanical properties of copper
Raumel, S., Wolf, A., Dencker, F. & Wurz, M., 2023, Tagungsband, 5. Symposium Materialtechnik : Fortschrittbericht der Materialforschung und Werkstofftechnik . p. 149-159 (Fortschrittsberichte der Materialforschung und Werkstofftechnik; vol. 12).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Integration of film-based sensor technology in additively manufactured components
Basten, R. G., Bengsch, S. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 154-161 8 p. (MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Manufacture and application of a sensor inlet for high-temperature measurements in the frictional zone of an extrusion die
Raumel, S., Moradi, A. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 672-675 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Manufacturing and Characterization of Piezoelectric Force Sensor Arrays for Investigation of Ultrasonic Wire Bonding
Arndt, M., Long, Y., Hu, C., Dencker, F., Twiefel, J. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 462-465 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Measurement of the Ultrasound Induced Temperature Change in an Ultrasonic Assisted Silver Sintering Process
Hadeler, S., Long, Y., Twiefel, J. & Wurz, M. C., 2023, IEEE Sensors 2023 Conference Proceedings. (Proceedings of IEEE Sensors).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Microtechnological Production of Integrated Optical Gratings Using Laser Beam Lithography for Atomic Interferometers
de Wall, S., Kassner, A., Dencker, F. & Wurz, M., 2023, Tagungsband MikroSystemTechnik Kongress 2023. 3 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
- Published
Miniaturized quantum systems for inertial measurement units
Kassner, A., Diekmann, L., Künzler, C., Petring, J., Droese, N., Dencker, F., Heine, H., Abend, S., Gersemann, M., Rasel, E. M., Herr, W., Schubert, C. & Wurz, M. C., 2023, 2023 DGON Inertial Sensors and Systems (ISS). Hecker, P. (ed.). (International Symposium on Inertial Sensors and Systems).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Oxygen-free resistance heating with nitrogen and silane as an energy-efficient heating process for hot stamping
Behrens, B., Hübner, S., Holländer, U., Langohr, A., Albracht, L. F. J., Faramand, E., Wehmeyer, J., Yarcu, S., Raumel, S. & Wurz, M., 2023, In: IOP Conference Series: Materials Science and Engineering. 1284, 012007.Research output: Contribution to journal › Conference article › Research › peer review
- E-pub ahead of print
Performance Comparison of MR Sensors on Silicon and Bare PEEK (Polyether Ether Ketone) Wafers
de Wall, S., Bierwirth, T. N., Wurz, M. & Bengsch, S., 2023, (E-pub ahead of print).Research output: Contribution to conference › Poster › Research
- Published
Physical Sensors: Magnetic Sensors
Prediger, M. S. & Wurz, M., 2023, Encyclopedia of Sensors and Biosensors. Elsevier Inc., Vol. 1. p. 97-110 14 p.Research output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research
- Published
Sensor Inserts on Spherical Surfaces for Temperature Measurement in Wear Contacts
Raumel, S. & Wurz, M. C., 2023, 2023 IEEE SENSORS. p. 1-4 (Proceedings of IEEE Sensors).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Setup of an ultra-high vacuum bonder for the encapsulation of quantum systems
Droese, N., Petring, J., Hadeler, S., Kassner, A., Dencker, F. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 763-766 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Simulation-based Design of a Magnetostrictive Middle Ear Actuator
Adamscheck, M., Fischer, E., Müller, E., Glukhovskoy, A., Prediger, M. S., Dencker, F. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 503-508 6 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Simulation, Manufacturing and Evaluation of a Transformer Eddy-Current Sensor for Deep-Drawing Processes
Kamrani, S., Ottermann, R., Dencker, F. & Wurz, M., 2023, SMSI 2023. p. 284 -285Research output: Chapter in book/report/conference proceeding › Other contribution in a book, report, anthology or conference proceeding › Research
2022
- Published
Development and investigation of tin coatings for increased bone cement detachment at implant interfaces
Prediger, M. S., Müller, E., Reulbach, M., Wurz, M. & Jakubowitz, E., 8 Dec 2022.Research output: Contribution to conference › Poster › Research
- Published
Young’s Modulus and Residual Stresses of Oxide-Free Wire Arc Sprayed Copper Coatings
Rodriguez Diaz, M., Raumel, S., Wurz, M. C., Szafarska, M., Gustus, R., Möhwald, K. & Maier, H. J., 6 Oct 2022, In: COATINGS. 12, 10, 1482.Research output: Contribution to journal › Article › Research › peer review
- Published
Degeneration Effects of Thin-Film Sensors after Critical Load Conditions of Machine Components
Ottermann, R., Steppeler, T., Dencker, F. & Wurz, M. C., 27 Sept 2022, In: Machines. 10, 10, 15 p., 870.Research output: Contribution to journal › Article › Research › peer review
- Published
Fabrication of a Low Profile Planar Transformer Using Molded Interconnect Device Technology
Bierwirth, T. N., Dencker, F., Fischer, E. C. & Wurz, M. C., Sept 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 129-133 5 p. (2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
- Published
Impact of surface texture on ultrasonic wire bonding process
Long, Y., Arndt, M., Dencker, F., Wurz, M., Twiefel, J. & Wallaschek, J., Sept 2022, In: Journal of Materials Research and Technology. 20, p. 1828-1838 11 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Nonevaporable getter-MEMS for generating UHV conditions in small volumina
Diekmann, L. F., Kassner, A., Dencker, F. & Wurz, M. C., Sept 2022, In: Journal of Vacuum Science and Technology B. 40, 5, 054202.Research output: Contribution to journal › Article › Research › peer review
- Published
Nanoindentation in alumina coated Al: Molecular dynamics simulations and experiments
Luu, H. T., Raumel, S., Dencker, F., Wurz, M. & Merkert, N., 15 May 2022, In: Surface and Coatings Technology. 437, 128342.Research output: Contribution to journal › Article › Research › peer review
- Published
Characterization of Microtransformers with Magnetic Ni-Fe-W alloy Cores Plated at Two Different Substrate Temperatures
Mundotiya, B. M., Dinulovic, D., Rissing, L. & Wurz, M. C., 1 May 2022, In: Sensors and Actuators A: Physical. 338, 113454.Research output: Contribution to journal › Article › Research › peer review
- Published
Residual Stresses from Incremental Hole Drilling Using Directly Deposited Thin Film Strain Gauges
Heikebrügge, S., Ottermann, R., Breidenstein, B., Wurz, M. C. & Dencker, F., Apr 2022, In: Experimental mechanics. 62, 4, p. 701-713 13 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Effect of PEG functionalization on the saturation magnetization of magnetic nanoporous core-shell nanoparticles
Herrmann, T., Schierz, A. K., Prediger, M., Reifenrath, J., Meißner, J., Wurz, M. C. & Behrens, P., 21 Mar 2022, In: International Journal on Magnetic Particle Imaging. 8, 1, 4 p., 2203009.Research output: Contribution to journal › Article › Research › peer review
- Published
Approaches for a Solely Electroless Metallization of Through-Glass Vias
Zawacka, A. M., Prediger, M. S., Kassner, A., Dencker, F. E. & Wurz, M., 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). p. 889-897 9 p. (Proceedings - Electronic Components and Technology Conference; vol. 2022-May).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
In Situ Resistance Trimming of Directly Deposited Thin-Film Strain Gauges
Ottermann, R., Zhang, S., Denkena, B., Klemme, H., Kowalke, D., Korbacher, M., Dencker, F. & Wurz, M. C., 2022, 2022 IEEE Sensors, SENSORS 2022 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., (Proceedings of IEEE Sensors; vol. 2022-October).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Production and characterisation of batch manufactured flexible micro-grinding tools for finishing metallic surfaces
Steinhoff, L., Dencker, F. & Wurz, M. C., 2022, European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 22nd International Conference and Exhibition, EUSPEN 2022. Leach, R. K., Akrofi-Ayesu, A., Nisbet, C. & Phillips, D. (eds.). p. 77-80 4 p. (European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 22nd International Conference and Exhibition, EUSPEN 2022).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2021
- Published
Werkzeugmaschinen werden intelligent
Klaproth, M. S., Denkena, B., Bergmann, B., Ottermann, R., Dencker, F. & Wurz, M., 27 Oct 2021, Werkzeugmaschinen.Research output: Contribution to specialist publication › Contribution in non-scientific journal › Transfer
- Published
Experimental Investigation of the Rapid Fabrication of Micronand Submicron Structures on Polymers Utilizing Ultrasonic Assisted Embossing
Zhu, Y., Bengsch, S., Zheng, L., Long, Y., Roth, B. W., Wurz, M. C., Twiefel, J. & Wallaschek, J., 1 Aug 2021, In: Polymers. 13, 15, 2417.Research output: Contribution to journal › Article › Research › peer review
- Published
Towards a Highly Sensitive Piezoelectric Nano-Mass Detection: A Model-Based Concept Study
Twiefel, J., Glukhovskoy, A., de Wall, S., Wurz, M. C., Sehlmeyer, M., Hitzemann, M. & Zimmermann, S., 4 Apr 2021, In: Sensors. 21, 7, 15 p., 2533.Research output: Contribution to journal › Article › Research › peer review
- Published
Einfluss von Silan-dotierten Umgebungsatmosphären auf tribologischen Eigenschaften von Titan
Raumel, S., Barienti, K., Dencker, F., Nuernberger, F. & Wurz, M., 22 Mar 2021, In: Tribologie und Schmierungstechnik. 68, 1, p. 5-13 9 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Verfahren zur Herstellung von Diamantspitzen
Dencker, F. (Inventor), Wurz, M. C. (Inventor) & Maier, H. J. (Inventor), 4 Mar 2021, IPC No. G01Q 70/ 16 A I, Patent No. DE102019213043, Priority date 29 Aug 2019, Priority No. DE201910213043Research output: Patent
- Published
Einfluss von Silan-dotierten Umgebungsatmosphären auf tribologischen Eigenschaften von Titan
Raumel, S., Barienti, K., Dencker, F., Nürnberger, F. & Wurz, M. C., Mar 2021, In: Tribologie und Schmierungstechnik. 68, 1, p. 5-13 9 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Sensorbauteil, Halbzeug, Verfahren zur Anbringung und zur Herstellung eines Sensorbauteils
Dencker, F. (Inventor), Wurz, M. C. (Inventor), Maier, H. J. (Inventor), Ottermann, R. (Inventor), Kassner, A. (Inventor) & Klaas, D. (Inventor), 25 Feb 2021, IPC No. G01N 27/ 04 A I, Patent No. DE102019122623, Priority date 22 Aug 2019, Priority No. DE201910122623Research output: Patent
- Published
Anisotropic Magneto-Resistive Sensor Effect based Sensor using Daisy Chain on Polyether Ether Ketone Substrate
De Wall, S., Bengsch, S., Fischer, E., Dencker, F. & Wurz, M. C., 2021, 2021 IEEE Sensors. Institute of Electrical and Electronics Engineers Inc., (Proceedings of IEEE Sensors; vol. 2021-October).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Combination of Additive and Thin-Film Technological Manufacturing for the Realization of a Pressure Sensor for Biomedical Applications
Prediger, M. S., Müller, E., Bengsch, S. & Wurz, M. C., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 578-581 4 p. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Development of a Polyimid Membrane for Electromagnetic Middle-Ear Actuators
Glukhovskoy, A., Müller, E., Prediger, M. S., Maier, H. & Wurz, M. C., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 186-189 4 p. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Directly Deposited Thin-Film Strain Gauges on Curved Metallic Surfaces
Ottermann, R., Klaas, D., Dencker, F., Hoheisel, D., Jung, S., Wienke, A., Dusing, J. F., Koch, J. & Wurz, M. C., 2021, 2021 IEEE Sensors, SENSORS 2021 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., (Proceedings of IEEE Sensors; vol. 2021-October).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Direktabgeschiedene Dünnfilm-Dehnungsmessstreifen für erhöhte Temperaturen
Ottermann, R., Klaas, D., Dencker, F. E., Hoheisel, D., Rottengatter, P., Kruspe, T., Jung, S. & Wurz, M., 2021, MikroSystemTechnik Kongress 2021: Proceedings. Berlin: VDE Verlag GmbH, p. 315-316 2 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Direktabgeschiedene Dünnfilmsensorik mithilfe einer neuartigen Beschichtungsanlage
Ottermann, R., Klaas, D., Dencker, F. E. & Wurz, M., 2021, 27. NDVaK-Kolloquium. DresdenResearch output: Chapter in book/report/conference proceeding › Conference contribution › Research
- Published
Fabrication of a Low Profile Planar Transformer Using a Dual PCB Approach
Fischer, E. C., Bierwirth, T. N., Dencker, F. & Wurz, M. C., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 483-486 4 p. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
- Published
Film transfer from thin films to metal surfaces using sol-gels, self-assembling monolayers and water glass
Basten, R. G., Zawacka, A. M., Bengsch, S., Prediger, M. S. & Wurz, M. C., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 27-30 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Investigation of tribologically relevant surface layers formed on non-ferrous metals in oxygen-free conditions
Raumel, S., Dencker, F. & Wurz, M., 2021.Research output: Contribution to conference › Abstract › Research
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Investigations on Silver Sintering using an Ultrasonic Transient Liquid Phase Sintering Process
Hadeler, S., Seefisch, H., Ottermann, R., Long, Y., Dencker, F., Wurz, M. C. & Twiefel, J., 2021, 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). Institute of Electrical and Electronics Engineers Inc., p. 288-291 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Mikrotechnologische Fertigung von integrierten optischen Gittern mittels Lift-Off-Prozess für den Einsatz in Atominterferometern
de Wall, S., Kassner, A., Dencker, F., Künzler, C., Diekmann, L. & Würz, M. C., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 466-468 3 p. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Proof of Concept: Glass-Membrane Based Differential Pressure Sensor
Glukhovskoy, A., Prediger, M. S., Schäfer, J., Ambrosio, A., Ambrosius, N., Vogt, A., Santos, R., Ostholt, R. & Wurz, M., 2021, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC). p. 1563-1570 8 p. (Proceedings - Electronic Components and Technology Conference; vol. 2021-June).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Simulationsgestützte Auslegung und Fertigung von piezoelektrischen Kraftsensor-Arrays zur Untersuchung des Ultraschall-Drahtbondprozesses
Arndt, M., Wurz, M. C., Dencker, F., Long, Y. & Twiefel, J., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 742-745 4 p. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review