Publications
2024
- Published
Directly Deposited Thin-Film Strain Gauges for Force Measurement at Guide Carriages
Ottermann, R., Kowalke, D., Denkena, B., Korbacher, M., Müller, M. & Wurz, M. C., 15 Dec 2024, In: IEEE sensors journal. 24, 24, p. 40471-40484 14 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Propriozeption in der Soft Robotics
Müller, E., Cao, B., Peters, J., Raatz, A. & Wurz, M., 11 Dec 2024, In: WT Werkstattstechnik. 114, 11-12, p. 735-740 6 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Laser Direct Structuring of Millable BN‐AlN Ceramic for Three‐Dimensional (3D) Components
Raumel, S., Xiao, X., Bengsch, S. & Wurz, M. C., 4 Dec 2024, In: Advanced engineering materials. 26, 23, 2401271.Research output: Contribution to journal › Article › Research › peer review
- Published
Compensation of strain gauge signal changes due to position-based internal changes in sensory linear guides
Denkena, B., Buhl, H., Kowalke, D., Ottermann, R. & Wurz, M., 23 Oct 2024, ICPE2024: The 20th International Conference on Precision Engineering. 6 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Polymer-Free Batch Production and Application of Metal Foil-Based Thin-Film Strain Gauges
Ottermann, R., Müller, E., Keßler, M., Dencker, F., Klaas, D. & Wurz, M. C., 20 Oct 2024, 2024 IEEE Sensors, SENSORS 2024 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., (Proceedings of IEEE Sensors).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Waveguides Written by Femtosecond Laser in CVD Diamonds
Perevoznik, D., Locmelis, J., Zuber, D., Glukhovskoy, A., Afentaki, A., Hinkelmann, M., Dencker, F., Wurz, M. & Morgner, U., 18 Oct 2024, In: EPJ Web of Conferences. 307, 2 p., 02034.Research output: Contribution to journal › Conference article › Research › peer review
- Published
Miniaturized Rubidium Source for Generating Vapor Phase Atoms for Magneto Optical Traps
Koch, J., Diekmann, L. F., Kassner, A., Dencker, F. & Wurz, M. C., 15 Jul 2024, 2024 37th International Vacuum Nanoelectronics Conference, IVNC 2024. Institute of Electrical and Electronics Engineers Inc., (International Vacuum Nanoelectronics Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- E-pub ahead of print
Design and Manufacture of Face Grinding Wheels with Micro-Structured Channels
Steinhoff, L., Tubbe, E., Dencker, F., Denmark, T., Kausch, L. & Wurz, M. C., 11 Jun 2024, (E-pub ahead of print) 24th International Conference & Exhibition.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Modification of glass by a laser for the use in micro-electric systems and quantum devices
Keinert, L., Koch, J. (Contributor), Künzler, C. (Contributor), Dehning, K. J. (Contributor), Kassner, A. (Contributor), Dencker, F. (Contributor), Zimmermann, S. (Contributor) & Wurz, M. (Contributor), 11 Mar 2024, Book of abstracts for the EQTC 2023. Schnitger, A., Husemann, R. & Liebisch, T. (eds.). Hannover, p. 91Research output: Chapter in book/report/conference proceeding › Conference abstract › Research
- Published
Integrated multimode optical waveguides in glass using laser induced deep etching
Reitz, B., Evertz, A., Basten, R., Wurz, M. C. & Overmeyer, L., 1 Feb 2024, In: Applied optics. 63, 4, p. 895-903 9 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Femtosecond Laser Written Waveguides in CVD Diamonds
Perevoznik, D., Locmelis, J., Zuber, D., Glukhovskoy, A., Afentaki, A., Hinkelmann, M., Dencker, F., Wurz, M. & Morgner, U., 2024.Research output: Contribution to conference › Paper › Research › peer review
- Published
Glass-Extraction Electrode for Field Emission Applications
Buchta, A. M., Kassner, A., Dencker, F. & Wurz, M. C., 2024, 2024 37th International Vacuum Nanoelectronics Conference (IVNC). (International Vacuum Nanoelectronics Conference proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Manufacturing and Characterization of Planar Transformers as Molded Interconnect Device Technology Component for an Industrial Production
Bierwirth, T. N., Bengsch, S., Werner, M., Wachs, R., Henne, C., Bur, S., Dencker, F. & Wurz, M. C., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 2172-2177 6 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Push-Button Rotational Energy Harvester for Wireless Sensor Nodes
Adamscheck, M., Wurz, M. C. & Klaas, D., 2024, EASS 2024: Energieautonome Sensorsysteme 2024 - 12. GMM-Fachtagung. VDE Verlag GmbH, p. 57-59 3 p. (GMM-Fachberichte; vol. 109).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Silicon-based membrane pressure sensor for inline monitoring of pressure and hermeticity of small-volume bonded packages
Koch, J., Brinkmann, L. M., Kassner, A., Dencker, F. & Wurz, M. C., 2024, 2024 IEEE 74th Electronic Components and Technology Conference : (ECTC). Institute of Electrical and Electronics Engineers Inc., p. 193-200 8 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2023
- Published
Manufacturing of a Reluctance Actuator for Use as a Hearing Implant in the Middle Ear
Müller, E., Adamscheck, M., Fischer, E. C., Glukhovskoy, A., Prediger, M. S., Dencker, F. & Wurz, M., 23 Nov 2023, MikroSystemTechnik Kongress 2023.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Sensoren richtig positioniert
Denkena, B., Klemme, H., Kowalke, D., Wurz, M., Ottermann, R., Korbacher, M. & Müller, M., 7 Nov 2023, Konstruktion und Entwicklung, 2023, 6, p. 42-45 4 p.Research output: Contribution to specialist publication › Contribution in popular science journal › Transfer
- Published
Fabrication Method and Characterization of Molded Interconnect Device Micro Transformer in Planar Form by Embedding Sintered Ferrite Cores
Bierwirth, T. N., Fischer, E. C., Prediger, M. S., Le, T. M., Dencker, F. & Wurz, M. C., Oct 2023, MikroSystemTechnik Kongress 2023: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 599-604 6 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
- Published
Detailed characterisation of batch-manufactured flexible micro-grinding tools for electrochemical assisted grinding of copper surfaces
Steinhoff, L., Ottermann, R., Dencker, F. & Wurz, M. C., Sept 2023, In: The International Journal of Advanced Manufacturing Technology. 128, 5-6, p. 2301-2310 10 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Direct Sensor Integration on the Raceway of Roller Bearings
Pape, F., Konopka, D., Coors, T., Poll, G., Steppeler, T., Ottermann, R., Dencker, F. & Wurz, M., Sept 2023, 9 p.Research output: Book/Report › Conference proceeding › Research
- Published
Characterization of the tribologically relevant cover layers formed on copper in oxygen and oxygen-free conditions
Raumel, S., Barienti, K., Luu, H. T., Merkert, N., Dencker, F., Nürnberger, F., Maier, H. J. & Wurz, M. C., Aug 2023, In: Friction. 11, 8, p. 1505–1521 17 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Novel Glass-Silicon Emitter Chip for Field Emission Applications
Buchta, A. M., Kassner, A., Voß, J., Leopold, T., Petring, J., Diekmann, L., Dencker, F. & Wurz, M. C., 27 Jul 2023, 2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC). p. 207-209 3 p. ( International Vacuum Nanoelectronics Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Micro-integrated optical systems and qualification of adhesive integration technologies for cold atomic quantum sensors
Christ, M., Stiekel, A., Stölmacker, C., Zimmermann, C., Kassner, A., Wurz, M. & Krutzik, M., 12 Jul 2023, International Conference on Space Optics, ICSO 2022. Minoglou, K., Karafolas, N. & Cugny, B. (eds.). SPIE, 1277718. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12777).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Enhanced findability and reusability of engineering data by contextual metadata
Altun, O., Oladazimi, P., Wawer, M. L., Raumel, S., Wurz, M., Barienti, K., Nürnberger, F., Lachmayer, R., Mozgova, I., Koepler, O. & Auer, S., 19 Jun 2023, In: Proceedings of the Design Society. 3, p. 1635-1644 10 p.Research output: Contribution to journal › Conference article › Research › peer review
- Published
Soliton compression and supercontinuum spectra in nonlinear diamond photonics
Melchert, O., Kinnewig, S., Dencker, F., Perevoznik, D., Willms, S., Babushkin, I., Wurz, M., Kues, M., Beuchler, S., Wick, T., Morgner, U. & Demircan, A., Jun 2023, In: Diamond and Related Materials. 136, 109939.Research output: Contribution to journal › Article › Research › peer review
- Published
Influence of Microscale Tin Particles on Mechanical Properties of Silver Sintering Joints with Reduced Processing Parameters
Hadeler, S., Long, Y., Ottermann, R., Dencker, F., Twiefel, J. & Wurz, M. C., May 2023, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC): Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 676-681 6 p. (Proceedings - Electronic Components Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Application of batch manufactured flexible micro-grinding tools on copper and oxidized copper surfaces
Steinhoff, L., Dencker, F. & Wurz, M. C., 27 Mar 2023, In: Tribologie und Schmierungstechnik. 70, 1, p. 5-10 6 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Detection of joining mechanisms at different locations of the wire/substrate interface during ultrasonic wire bonding via a PZT-based sensor array
Long, Y., Arndt, M., Sun, C., Dencker, F., Wurz, M. & Twiefel, J., Mar 2023, In: Journal of Materials Processing Technology. 312, 117826.Research output: Contribution to journal › Article › Research › peer review
- Published
Process Development for Batch Production of Micro-Milling Tools Made of Silicon Carbide by Means of the Dry Etching Process
Wittek, C. R., Steinhoff, L., Raumel, S., Reißfelder, M., Dencker, F. & Wurz, M. C., 28 Feb 2023, In: Micromachines. 14, 3, 580.Research output: Contribution to journal › Article › Research › peer review
- Published
Monitoring of the Flange Draw-In During Deep Drawing Processes Using a Thin-Film Inductive Sensor
Fünfkirchler, T., Arndt, M., Hübner, S., Dencker, F., Wurz, M. C. & Behrens, B. A., 2 Feb 2023, Lecture Notes in Production Engineering. Springer Nature, p. 111-121 11 p. (Lecture Notes in Production Engineering; vol. Part F1163).Research output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research › peer review
- Published
Advancements in monitoring of tribological stress in bearings using thin-film strain gauges
Konopka, D., Steppeler, T., Ottermann, R., Pape, F., Dencker, F., Poll, G. & Wurz, M., 2023, p. 1623-1634.Research output: Contribution to conference › Paper › Research › peer review
- Published
Development and Characterization of transferable Thin Film Sensor Technology on Carbon Fibre reinforced Plastics
Hadeler, S., Vogt, F. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 113-116 4 p. (MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Force sensing linear rolling guides based on modified metal strain gauges
Denkena, B., Klemme, H., Kowalke, D., Korbacher, M., Ottermann, R., Dencker, F. & Wurz, M., 2023, European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 23rd International Conference and Exhibition, EUSPEN 2023. Riemer, O., Nisbet, C. & Phillips, D. (eds.). p. 207-210 4 p. (European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 23rd International Conference and Exhibition, EUSPEN 2023).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Influence of oxide layers on the mechanical properties of copper
Raumel, S., Wolf, A., Dencker, F. & Wurz, M., 2023, Tagungsband, 5. Symposium Materialtechnik : Fortschrittbericht der Materialforschung und Werkstofftechnik . p. 149-159 (Fortschrittsberichte der Materialforschung und Werkstofftechnik; vol. 12).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Integration of film-based sensor technology in additively manufactured components
Basten, R. G., Bengsch, S. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 154-161 8 p. (MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Manufacture and application of a sensor inlet for high-temperature measurements in the frictional zone of an extrusion die
Raumel, S., Moradi, A. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 672-675 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Manufacturing and Characterization of Piezoelectric Force Sensor Arrays for Investigation of Ultrasonic Wire Bonding
Arndt, M., Long, Y., Hu, C., Dencker, F., Twiefel, J. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 462-465 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Measurement of the Ultrasound Induced Temperature Change in an Ultrasonic Assisted Silver Sintering Process
Hadeler, S., Long, Y., Twiefel, J. & Wurz, M. C., 2023, IEEE Sensors 2023 Conference Proceedings. (Proceedings of IEEE Sensors).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Microtechnological Production of Integrated Optical Gratings Using Laser Beam Lithography for Atomic Interferometers
de Wall, S., Kassner, A., Dencker, F. & Wurz, M., 2023, Tagungsband MikroSystemTechnik Kongress 2023. 3 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
- Published
Miniaturized quantum systems for inertial measurement units
Kassner, A., Diekmann, L., Künzler, C., Petring, J., Droese, N., Dencker, F., Heine, H., Abend, S., Gersemann, M., Rasel, E. M., Herr, W., Schubert, C. & Wurz, M. C., 2023, 2023 DGON Inertial Sensors and Systems (ISS). Hecker, P. (ed.). (International Symposium on Inertial Sensors and Systems).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review