Publications
2024
- Published
Directly Deposited Thin-Film Strain Gauges for Force Measurement at Guide Carriages
Ottermann, R., Kowalke, D., Denkena, B., Korbacher, M., Müller, M. & Wurz, M. C., 15 Dec 2024, In: IEEE sensors journal. 24, 24, p. 40471-40484 14 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Propriozeption in der Soft Robotics
Müller, E., Cao, B., Peters, J., Raatz, A. & Wurz, M., 11 Dec 2024, In: WT Werkstattstechnik. 114, 11-12, p. 735-740 6 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Laser Direct Structuring of Millable BN‐AlN Ceramic for Three‐Dimensional (3D) Components
Raumel, S., Xiao, X., Bengsch, S. & Wurz, M. C., 4 Dec 2024, In: Advanced engineering materials. 26, 23, 2401271.Research output: Contribution to journal › Article › Research › peer review
- Published
Compensation of strain gauge signal changes due to position-based internal changes in sensory linear guides
Denkena, B., Buhl, H., Kowalke, D., Ottermann, R. & Wurz, M., 23 Oct 2024, ICPE2024: The 20th International Conference on Precision Engineering. 6 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Polymer-Free Batch Production and Application of Metal Foil-Based Thin-Film Strain Gauges
Ottermann, R., Müller, E., Keßler, M., Dencker, F., Klaas, D. & Wurz, M. C., 20 Oct 2024, 2024 IEEE Sensors, SENSORS 2024 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., (Proceedings of IEEE Sensors).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Waveguides Written by Femtosecond Laser in CVD Diamonds
Perevoznik, D., Locmelis, J., Zuber, D., Glukhovskoy, A., Afentaki, A., Hinkelmann, M., Dencker, F., Wurz, M. & Morgner, U., 18 Oct 2024, In: EPJ Web of Conferences. 307, 2 p., 02034.Research output: Contribution to journal › Conference article › Research › peer review
- Published
Miniaturized Rubidium Source for Generating Vapor Phase Atoms for Magneto Optical Traps
Koch, J., Diekmann, L. F., Kassner, A., Dencker, F. & Wurz, M. C., 15 Jul 2024, 2024 37th International Vacuum Nanoelectronics Conference, IVNC 2024. Institute of Electrical and Electronics Engineers Inc., (International Vacuum Nanoelectronics Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- E-pub ahead of print
Design and Manufacture of Face Grinding Wheels with Micro-Structured Channels
Steinhoff, L., Tubbe, E., Dencker, F., Denmark, T., Kausch, L. & Wurz, M. C., 11 Jun 2024, (E-pub ahead of print) 24th International Conference & Exhibition.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Modification of glass by a laser for the use in micro-electric systems and quantum devices
Keinert, L., Koch, J. (Contributor), Künzler, C. (Contributor), Dehning, K. J. (Contributor), Kassner, A. (Contributor), Dencker, F. (Contributor), Zimmermann, S. (Contributor) & Wurz, M. (Contributor), 11 Mar 2024, Book of abstracts for the EQTC 2023. Schnitger, A., Husemann, R. & Liebisch, T. (eds.). Hannover, p. 91Research output: Chapter in book/report/conference proceeding › Conference abstract › Research
- Published
Integrated multimode optical waveguides in glass using laser induced deep etching
Reitz, B., Evertz, A., Basten, R., Wurz, M. C. & Overmeyer, L., 1 Feb 2024, In: Applied optics. 63, 4, p. 895-903 9 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Femtosecond Laser Written Waveguides in CVD Diamonds
Perevoznik, D., Locmelis, J., Zuber, D., Glukhovskoy, A., Afentaki, A., Hinkelmann, M., Dencker, F., Wurz, M. & Morgner, U., 2024.Research output: Contribution to conference › Paper › Research › peer review
- Published
Glass-Extraction Electrode for Field Emission Applications
Buchta, A. M., Kassner, A., Dencker, F. & Wurz, M. C., 2024, 2024 37th International Vacuum Nanoelectronics Conference (IVNC). (International Vacuum Nanoelectronics Conference proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Manufacturing and Characterization of Planar Transformers as Molded Interconnect Device Technology Component for an Industrial Production
Bierwirth, T. N., Bengsch, S., Werner, M., Wachs, R., Henne, C., Bur, S., Dencker, F. & Wurz, M. C., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 2172-2177 6 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Push-Button Rotational Energy Harvester for Wireless Sensor Nodes
Adamscheck, M., Wurz, M. C. & Klaas, D., 2024, EASS 2024: Energieautonome Sensorsysteme 2024 - 12. GMM-Fachtagung. VDE Verlag GmbH, p. 57-59 3 p. (GMM-Fachberichte; vol. 109).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Silicon-based membrane pressure sensor for inline monitoring of pressure and hermeticity of small-volume bonded packages
Koch, J., Brinkmann, L. M., Kassner, A., Dencker, F. & Wurz, M. C., 2024, 2024 IEEE 74th Electronic Components and Technology Conference : (ECTC). Institute of Electrical and Electronics Engineers Inc., p. 193-200 8 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2023
- Published
Manufacturing of a Reluctance Actuator for Use as a Hearing Implant in the Middle Ear
Müller, E., Adamscheck, M., Fischer, E. C., Glukhovskoy, A., Prediger, M. S., Dencker, F. & Wurz, M., 23 Nov 2023, MikroSystemTechnik Kongress 2023.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Sensoren richtig positioniert
Denkena, B., Klemme, H., Kowalke, D., Wurz, M., Ottermann, R., Korbacher, M. & Müller, M., 7 Nov 2023, Konstruktion und Entwicklung, 2023, 6, p. 42-45 4 p.Research output: Contribution to specialist publication › Contribution in popular science journal › Transfer
- Published
Fabrication Method and Characterization of Molded Interconnect Device Micro Transformer in Planar Form by Embedding Sintered Ferrite Cores
Bierwirth, T. N., Fischer, E. C., Prediger, M. S., Le, T. M., Dencker, F. & Wurz, M. C., Oct 2023, MikroSystemTechnik Kongress 2023: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 599-604 6 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
- Published
Detailed characterisation of batch-manufactured flexible micro-grinding tools for electrochemical assisted grinding of copper surfaces
Steinhoff, L., Ottermann, R., Dencker, F. & Wurz, M. C., Sept 2023, In: The International Journal of Advanced Manufacturing Technology. 128, 5-6, p. 2301-2310 10 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Direct Sensor Integration on the Raceway of Roller Bearings
Pape, F., Konopka, D., Coors, T., Poll, G., Steppeler, T., Ottermann, R., Dencker, F. & Wurz, M., Sept 2023, 9 p.Research output: Book/Report › Conference proceeding › Research
- Published
Characterization of the tribologically relevant cover layers formed on copper in oxygen and oxygen-free conditions
Raumel, S., Barienti, K., Luu, H. T., Merkert, N., Dencker, F., Nürnberger, F., Maier, H. J. & Wurz, M. C., Aug 2023, In: Friction. 11, 8, p. 1505–1521 17 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Novel Glass-Silicon Emitter Chip for Field Emission Applications
Buchta, A. M., Kassner, A., Voß, J., Leopold, T., Petring, J., Diekmann, L., Dencker, F. & Wurz, M. C., 27 Jul 2023, 2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC). p. 207-209 3 p. ( International Vacuum Nanoelectronics Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Micro-integrated optical systems and qualification of adhesive integration technologies for cold atomic quantum sensors
Christ, M., Stiekel, A., Stölmacker, C., Zimmermann, C., Kassner, A., Wurz, M. & Krutzik, M., 12 Jul 2023, International Conference on Space Optics, ICSO 2022. Minoglou, K., Karafolas, N. & Cugny, B. (eds.). SPIE, 1277718. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12777).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Enhanced findability and reusability of engineering data by contextual metadata
Altun, O., Oladazimi, P., Wawer, M. L., Raumel, S., Wurz, M., Barienti, K., Nürnberger, F., Lachmayer, R., Mozgova, I., Koepler, O. & Auer, S., 19 Jun 2023, In: Proceedings of the Design Society. 3, p. 1635-1644 10 p.Research output: Contribution to journal › Conference article › Research › peer review
- Published
Soliton compression and supercontinuum spectra in nonlinear diamond photonics
Melchert, O., Kinnewig, S., Dencker, F., Perevoznik, D., Willms, S., Babushkin, I., Wurz, M., Kues, M., Beuchler, S., Wick, T., Morgner, U. & Demircan, A., Jun 2023, In: Diamond and Related Materials. 136, 109939.Research output: Contribution to journal › Article › Research › peer review
- Published
Influence of Microscale Tin Particles on Mechanical Properties of Silver Sintering Joints with Reduced Processing Parameters
Hadeler, S., Long, Y., Ottermann, R., Dencker, F., Twiefel, J. & Wurz, M. C., May 2023, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC): Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 676-681 6 p. (Proceedings - Electronic Components Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Application of batch manufactured flexible micro-grinding tools on copper and oxidized copper surfaces
Steinhoff, L., Dencker, F. & Wurz, M. C., 27 Mar 2023, In: Tribologie und Schmierungstechnik. 70, 1, p. 5-10 6 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Detection of joining mechanisms at different locations of the wire/substrate interface during ultrasonic wire bonding via a PZT-based sensor array
Long, Y., Arndt, M., Sun, C., Dencker, F., Wurz, M. & Twiefel, J., Mar 2023, In: Journal of Materials Processing Technology. 312, 117826.Research output: Contribution to journal › Article › Research › peer review
- Published
Process Development for Batch Production of Micro-Milling Tools Made of Silicon Carbide by Means of the Dry Etching Process
Wittek, C. R., Steinhoff, L., Raumel, S., Reißfelder, M., Dencker, F. & Wurz, M. C., 28 Feb 2023, In: Micromachines. 14, 3, 580.Research output: Contribution to journal › Article › Research › peer review
- Published
Monitoring of the Flange Draw-In During Deep Drawing Processes Using a Thin-Film Inductive Sensor
Fünfkirchler, T., Arndt, M., Hübner, S., Dencker, F., Wurz, M. C. & Behrens, B. A., 2 Feb 2023, Lecture Notes in Production Engineering. Springer Nature, p. 111-121 11 p. (Lecture Notes in Production Engineering; vol. Part F1163).Research output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research › peer review
- Published
Advancements in monitoring of tribological stress in bearings using thin-film strain gauges
Konopka, D., Steppeler, T., Ottermann, R., Pape, F., Dencker, F., Poll, G. & Wurz, M., 2023, p. 1623-1634.Research output: Contribution to conference › Paper › Research › peer review
- Published
Development and Characterization of transferable Thin Film Sensor Technology on Carbon Fibre reinforced Plastics
Hadeler, S., Vogt, F. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 113-116 4 p. (MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Force sensing linear rolling guides based on modified metal strain gauges
Denkena, B., Klemme, H., Kowalke, D., Korbacher, M., Ottermann, R., Dencker, F. & Wurz, M., 2023, European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 23rd International Conference and Exhibition, EUSPEN 2023. Riemer, O., Nisbet, C. & Phillips, D. (eds.). p. 207-210 4 p. (European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 23rd International Conference and Exhibition, EUSPEN 2023).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Influence of oxide layers on the mechanical properties of copper
Raumel, S., Wolf, A., Dencker, F. & Wurz, M., 2023, Tagungsband, 5. Symposium Materialtechnik : Fortschrittbericht der Materialforschung und Werkstofftechnik . p. 149-159 (Fortschrittsberichte der Materialforschung und Werkstofftechnik; vol. 12).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Integration of film-based sensor technology in additively manufactured components
Basten, R. G., Bengsch, S. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 154-161 8 p. (MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Manufacture and application of a sensor inlet for high-temperature measurements in the frictional zone of an extrusion die
Raumel, S., Moradi, A. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 672-675 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Manufacturing and Characterization of Piezoelectric Force Sensor Arrays for Investigation of Ultrasonic Wire Bonding
Arndt, M., Long, Y., Hu, C., Dencker, F., Twiefel, J. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 462-465 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Measurement of the Ultrasound Induced Temperature Change in an Ultrasonic Assisted Silver Sintering Process
Hadeler, S., Long, Y., Twiefel, J. & Wurz, M. C., 2023, IEEE Sensors 2023 Conference Proceedings. (Proceedings of IEEE Sensors).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Microtechnological Production of Integrated Optical Gratings Using Laser Beam Lithography for Atomic Interferometers
de Wall, S., Kassner, A., Dencker, F. & Wurz, M., 2023, Tagungsband MikroSystemTechnik Kongress 2023. 3 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
- Published
Miniaturized quantum systems for inertial measurement units
Kassner, A., Diekmann, L., Künzler, C., Petring, J., Droese, N., Dencker, F., Heine, H., Abend, S., Gersemann, M., Rasel, E. M., Herr, W., Schubert, C. & Wurz, M. C., 2023, 2023 DGON Inertial Sensors and Systems (ISS). Hecker, P. (ed.). (International Symposium on Inertial Sensors and Systems).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Oxygen-free resistance heating with nitrogen and silane as an energy-efficient heating process for hot stamping
Behrens, B., Hübner, S., Holländer, U., Langohr, A., Albracht, L. F. J., Faramand, E., Wehmeyer, J., Yarcu, S., Raumel, S. & Wurz, M., 2023, In: IOP Conference Series: Materials Science and Engineering. 1284, 012007.Research output: Contribution to journal › Conference article › Research › peer review
- E-pub ahead of print
Performance Comparison of MR Sensors on Silicon and Bare PEEK (Polyether Ether Ketone) Wafers
de Wall, S., Bierwirth, T. N., Wurz, M. & Bengsch, S., 2023, (E-pub ahead of print).Research output: Contribution to conference › Poster › Research
- Published
Physical Sensors: Magnetic Sensors
Prediger, M. S. & Wurz, M., 2023, Encyclopedia of Sensors and Biosensors. Elsevier Inc., Vol. 1. p. 97-110 14 p.Research output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research
- Published
Sensor Inserts on Spherical Surfaces for Temperature Measurement in Wear Contacts
Raumel, S. & Wurz, M. C., 2023, 2023 IEEE SENSORS. p. 1-4 (Proceedings of IEEE Sensors).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Setup of an ultra-high vacuum bonder for the encapsulation of quantum systems
Droese, N., Petring, J., Hadeler, S., Kassner, A., Dencker, F. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 763-766 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Simulation-based Design of a Magnetostrictive Middle Ear Actuator
Adamscheck, M., Fischer, E., Müller, E., Glukhovskoy, A., Prediger, M. S., Dencker, F. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 503-508 6 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Simulation, Manufacturing and Evaluation of a Transformer Eddy-Current Sensor for Deep-Drawing Processes
Kamrani, S., Ottermann, R., Dencker, F. & Wurz, M., 2023, SMSI 2023. p. 284 -285Research output: Chapter in book/report/conference proceeding › Other contribution in a book, report, anthology or conference proceeding › Research
2022
- Published
Development and investigation of tin coatings for increased bone cement detachment at implant interfaces
Prediger, M. S., Müller, E., Reulbach, M., Wurz, M. & Jakubowitz, E., 8 Dec 2022.Research output: Contribution to conference › Poster › Research
- Published
Young’s Modulus and Residual Stresses of Oxide-Free Wire Arc Sprayed Copper Coatings
Rodriguez Diaz, M., Raumel, S., Wurz, M. C., Szafarska, M., Gustus, R., Möhwald, K. & Maier, H. J., 6 Oct 2022, In: COATINGS. 12, 10, 1482.Research output: Contribution to journal › Article › Research › peer review
- Published
Degeneration Effects of Thin-Film Sensors after Critical Load Conditions of Machine Components
Ottermann, R., Steppeler, T., Dencker, F. & Wurz, M. C., 27 Sept 2022, In: Machines. 10, 10, 15 p., 870.Research output: Contribution to journal › Article › Research › peer review
- Published
Fabrication of a Low Profile Planar Transformer Using Molded Interconnect Device Technology
Bierwirth, T. N., Dencker, F., Fischer, E. C. & Wurz, M. C., Sept 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 129-133 5 p. (2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
- Published
Impact of surface texture on ultrasonic wire bonding process
Long, Y., Arndt, M., Dencker, F., Wurz, M., Twiefel, J. & Wallaschek, J., Sept 2022, In: Journal of Materials Research and Technology. 20, p. 1828-1838 11 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Nonevaporable getter-MEMS for generating UHV conditions in small volumina
Diekmann, L. F., Kassner, A., Dencker, F. & Wurz, M. C., Sept 2022, In: Journal of Vacuum Science and Technology B. 40, 5, 054202.Research output: Contribution to journal › Article › Research › peer review
- Published
Nanoindentation in alumina coated Al: Molecular dynamics simulations and experiments
Luu, H. T., Raumel, S., Dencker, F., Wurz, M. & Merkert, N., 15 May 2022, In: Surface and Coatings Technology. 437, 128342.Research output: Contribution to journal › Article › Research › peer review
- Published
Characterization of Microtransformers with Magnetic Ni-Fe-W alloy Cores Plated at Two Different Substrate Temperatures
Mundotiya, B. M., Dinulovic, D., Rissing, L. & Wurz, M. C., 1 May 2022, In: Sensors and Actuators A: Physical. 338, 113454.Research output: Contribution to journal › Article › Research › peer review
- Published
Residual Stresses from Incremental Hole Drilling Using Directly Deposited Thin Film Strain Gauges
Heikebrügge, S., Ottermann, R., Breidenstein, B., Wurz, M. C. & Dencker, F., Apr 2022, In: Experimental mechanics. 62, 4, p. 701-713 13 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Effect of PEG functionalization on the saturation magnetization of magnetic nanoporous core-shell nanoparticles
Herrmann, T., Schierz, A. K., Prediger, M., Reifenrath, J., Meißner, J., Wurz, M. C. & Behrens, P., 21 Mar 2022, In: International Journal on Magnetic Particle Imaging. 8, 1, 4 p., 2203009.Research output: Contribution to journal › Article › Research › peer review
- Published
Approaches for a Solely Electroless Metallization of Through-Glass Vias
Zawacka, A. M., Prediger, M. S., Kassner, A., Dencker, F. E. & Wurz, M., 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). p. 889-897 9 p. (Proceedings - Electronic Components and Technology Conference; vol. 2022-May).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
In Situ Resistance Trimming of Directly Deposited Thin-Film Strain Gauges
Ottermann, R., Zhang, S., Denkena, B., Klemme, H., Kowalke, D., Korbacher, M., Dencker, F. & Wurz, M. C., 2022, 2022 IEEE Sensors, SENSORS 2022 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., (Proceedings of IEEE Sensors; vol. 2022-October).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Production and characterisation of batch manufactured flexible micro-grinding tools for finishing metallic surfaces
Steinhoff, L., Dencker, F. & Wurz, M. C., 2022, European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 22nd International Conference and Exhibition, EUSPEN 2022. Leach, R. K., Akrofi-Ayesu, A., Nisbet, C. & Phillips, D. (eds.). p. 77-80 4 p. (European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 22nd International Conference and Exhibition, EUSPEN 2022).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2021
- Published
Werkzeugmaschinen werden intelligent
Klaproth, M. S., Denkena, B., Bergmann, B., Ottermann, R., Dencker, F. & Wurz, M., 27 Oct 2021, Werkzeugmaschinen.Research output: Contribution to specialist publication › Contribution in non-scientific journal › Transfer
- Published
Experimental Investigation of the Rapid Fabrication of Micronand Submicron Structures on Polymers Utilizing Ultrasonic Assisted Embossing
Zhu, Y., Bengsch, S., Zheng, L., Long, Y., Roth, B. W., Wurz, M. C., Twiefel, J. & Wallaschek, J., 1 Aug 2021, In: Polymers. 13, 15, 2417.Research output: Contribution to journal › Article › Research › peer review
- Published
Towards a Highly Sensitive Piezoelectric Nano-Mass Detection: A Model-Based Concept Study
Twiefel, J., Glukhovskoy, A., de Wall, S., Wurz, M. C., Sehlmeyer, M., Hitzemann, M. & Zimmermann, S., 4 Apr 2021, In: Sensors. 21, 7, 15 p., 2533.Research output: Contribution to journal › Article › Research › peer review
- Published
Einfluss von Silan-dotierten Umgebungsatmosphären auf tribologischen Eigenschaften von Titan
Raumel, S., Barienti, K., Dencker, F., Nuernberger, F. & Wurz, M., 22 Mar 2021, In: Tribologie und Schmierungstechnik. 68, 1, p. 5-13 9 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Verfahren zur Herstellung von Diamantspitzen
Dencker, F. (Inventor), Wurz, M. C. (Inventor) & Maier, H. J. (Inventor), 4 Mar 2021, IPC No. G01Q 70/ 16 A I, Patent No. DE102019213043, Priority date 29 Aug 2019, Priority No. DE201910213043Research output: Patent
- Published
Einfluss von Silan-dotierten Umgebungsatmosphären auf tribologischen Eigenschaften von Titan
Raumel, S., Barienti, K., Dencker, F., Nürnberger, F. & Wurz, M. C., Mar 2021, In: Tribologie und Schmierungstechnik. 68, 1, p. 5-13 9 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Sensorbauteil, Halbzeug, Verfahren zur Anbringung und zur Herstellung eines Sensorbauteils
Dencker, F. (Inventor), Wurz, M. C. (Inventor), Maier, H. J. (Inventor), Ottermann, R. (Inventor), Kassner, A. (Inventor) & Klaas, D. (Inventor), 25 Feb 2021, IPC No. G01N 27/ 04 A I, Patent No. DE102019122623, Priority date 22 Aug 2019, Priority No. DE201910122623Research output: Patent
- Published
Anisotropic Magneto-Resistive Sensor Effect based Sensor using Daisy Chain on Polyether Ether Ketone Substrate
De Wall, S., Bengsch, S., Fischer, E., Dencker, F. & Wurz, M. C., 2021, 2021 IEEE Sensors. Institute of Electrical and Electronics Engineers Inc., (Proceedings of IEEE Sensors; vol. 2021-October).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Combination of Additive and Thin-Film Technological Manufacturing for the Realization of a Pressure Sensor for Biomedical Applications
Prediger, M. S., Müller, E., Bengsch, S. & Wurz, M. C., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 578-581 4 p. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Development of a Polyimid Membrane for Electromagnetic Middle-Ear Actuators
Glukhovskoy, A., Müller, E., Prediger, M. S., Maier, H. & Wurz, M. C., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 186-189 4 p. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Directly Deposited Thin-Film Strain Gauges on Curved Metallic Surfaces
Ottermann, R., Klaas, D., Dencker, F., Hoheisel, D., Jung, S., Wienke, A., Dusing, J. F., Koch, J. & Wurz, M. C., 2021, 2021 IEEE Sensors, SENSORS 2021 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., (Proceedings of IEEE Sensors; vol. 2021-October).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Direktabgeschiedene Dünnfilm-Dehnungsmessstreifen für erhöhte Temperaturen
Ottermann, R., Klaas, D., Dencker, F. E., Hoheisel, D., Rottengatter, P., Kruspe, T., Jung, S. & Wurz, M., 2021, MikroSystemTechnik Kongress 2021: Proceedings. Berlin: VDE Verlag GmbH, p. 315-316 2 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Direktabgeschiedene Dünnfilmsensorik mithilfe einer neuartigen Beschichtungsanlage
Ottermann, R., Klaas, D., Dencker, F. E. & Wurz, M., 2021, 27. NDVaK-Kolloquium. DresdenResearch output: Chapter in book/report/conference proceeding › Conference contribution › Research
- Published
Fabrication of a Low Profile Planar Transformer Using a Dual PCB Approach
Fischer, E. C., Bierwirth, T. N., Dencker, F. & Wurz, M. C., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 483-486 4 p. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
- Published
Film transfer from thin films to metal surfaces using sol-gels, self-assembling monolayers and water glass
Basten, R. G., Zawacka, A. M., Bengsch, S., Prediger, M. S. & Wurz, M. C., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 27-30 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Investigation of tribologically relevant surface layers formed on non-ferrous metals in oxygen-free conditions
Raumel, S., Dencker, F. & Wurz, M., 2021.Research output: Contribution to conference › Abstract › Research
- Published
Investigations on Silver Sintering using an Ultrasonic Transient Liquid Phase Sintering Process
Hadeler, S., Seefisch, H., Ottermann, R., Long, Y., Dencker, F., Wurz, M. C. & Twiefel, J., 2021, 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). Institute of Electrical and Electronics Engineers Inc., p. 288-291 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Mikrotechnologische Fertigung von integrierten optischen Gittern mittels Lift-Off-Prozess für den Einsatz in Atominterferometern
de Wall, S., Kassner, A., Dencker, F., Künzler, C., Diekmann, L. & Würz, M. C., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 466-468 3 p. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Proof of Concept: Glass-Membrane Based Differential Pressure Sensor
Glukhovskoy, A., Prediger, M. S., Schäfer, J., Ambrosio, A., Ambrosius, N., Vogt, A., Santos, R., Ostholt, R. & Wurz, M., 2021, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC). p. 1563-1570 8 p. (Proceedings - Electronic Components and Technology Conference; vol. 2021-June).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Simulationsgestützte Auslegung und Fertigung von piezoelektrischen Kraftsensor-Arrays zur Untersuchung des Ultraschall-Drahtbondprozesses
Arndt, M., Wurz, M. C., Dencker, F., Long, Y. & Twiefel, J., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 742-745 4 p. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2020
- Published
VERFAHREN UND VORRICHTUNG ZUM BESTIMMEN EINER KONZENTRATION
WURZ, Marc, C. (Inventor), Glukhovskoy, A. (Inventor), Schnebeck, T. (Inventor) & MAIER, Hans, J. (Inventor), 9 Dec 2020, IPC No. G01N 21/ 31 A I, Patent No. EP3746773, Priority date 30 Jan 2019, Priority No. WO2019EP52291Research output: Patent
- Published
Verfahren zur Herstellung eines Formkörpers und Bauteil mit elektrischer Funktionalität
Maier, H. J. (Inventor), Wurz, M. C. (Inventor) & Bengsch, S. (Inventor), 26 Nov 2020, IPC No. H05K 3/ 00 A I, Patent No. DE102019113973, Priority date 24 May 2019, Priority No. DE201910113973Research output: Patent
- Published
Transfer Printing of Conductive Thin-Films on PDMS with Soluble Substrates for Flexible Biosensors
Hadeler, S., Bengsch, S., Prediger, M. & Wurz, M., 14 Nov 2020, In: Engineering Proceedings. 2, 1, p. 8181Research output: Contribution to journal › Conference article › Research › peer review
- Published
Development, characterisation and high-temperature suitability of thin-film strain gauges directly deposited with a new sputter coating system
Klaas, D., Ottermann, R., Dencker, F. & Wurz, M. C., 10 Jun 2020, In: Sensors (Switzerland). 20, 11, p. 1-15 15 p., 3294.Research output: Contribution to journal › Article › Research › peer review
- Published
Magnetkopf, Verfahren zur Speicherung von Information sowie Erzeugnis
Rechel, M. (Inventor), Taptimthong, P. (Inventor) & Wurz, M. C. (Inventor), 16 Jan 2020, IPC No. G11B 5/ 235 A I, Patent No. DE102018116896, Priority date 12 Jul 2018, Priority No. DE201810116896Research output: Patent
- Published
Einrichtung mit einem elektrischen Bauteil sowie Verfahren zu deren Herstellung
Maier, H. J. (Inventor), Wurz, M. C. (Inventor), Bengsch, S. (Inventor), Giese, U. (Inventor) & Omelan, M. (Inventor), 9 Jan 2020, IPC No. B60C 23/ 04 A I, Patent No. DE102018116182, Priority date 4 Jul 2018, Priority No. DE201810116182Research output: Patent
- Published
Direct Deposition of Thin-Film Strain Gauges with a New Coating System for Elevated Temperatures
Ottermann, R., Klaas, D., Dencker, F., Wurz, M. C., Hoheisel, D., Rottengatter, P. & Kruspe, T., 2020, IEEE Sensors, SENSORS 2020: Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 9278661Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Flexibel und druckempfindlich: Sensoren für die Insertionsüberwachung in der Cochlea
Prediger, M. & Wurz, M. C., 2020, HannoverResearch output: Other contribution › Other publication › Research › peer review
- Published
Giant Magneto-Resistive Effect based Sensor on Laser Direct Structured MID Substrates
Fischer, E. C., Bengsch, S., De Wall, S. & Wurz, M. C., 2020, Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 439-444 6 p. 9159426. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Mikrotechnologische Fertigung von integrierten optischen Gittern für den Einsatz in Atominterferometern
de Wall, S., Kassner, A., Dencker, F., Künzler, C., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M. & Wurz, M. C., 2020, GMM-Fb. 97: Mikro-Nano-Integration. Berlin: VDE Verlag GmbH, p. 56-59 4 p. (GMM-Fachberichte).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Novel Piezoelectric Force Sensor Array for Investigation of Ultrasonic Wire Bonding
Arndt, M., Long, Y., Dencker, F., Reimann, J., Twiefel, J. & Wurz, M. C., 2020, Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 276-283 8 p. 9159495. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Optical Platform for Highly Precise Optical Components
Bengsch, S., Fischer, E., De Wall, S., Schelm, T., Arndt, M. & Wurz, M. C., 2020, Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 2191-2196 6 p. 9159477. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates
Bengsch, S. & Wurz, M. C., 2020, 2020 IEEE Photonics Conference, IPC 2020. Institute of Electrical and Electronics Engineers Inc., 9252383Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Selbstschärfende Mikroschleifwerkzeuge
Asadi, E., Hockauf, R. & Wurz, M. C., 2020, Jahrbuch Schleifen, Honen, Läppen und Polieren. EssenResearch output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research › peer review
- Published
Thin Film Transferring via PVA Substrate and Contacting of Sensor inside Elastomer Matrix
Bengsch, S., Giese, U., Fischer, E. & Wurz, M. C., 2020, IEEE Sensors, SENSORS 2020: Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 9278876. (Proceedings of IEEE Sensors; vol. 2020-October).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2019
- Published
Integrated atomic quantum technologies in demanding environments: development and qualification of miniaturized optical setups and integration technologies for UHV and space operation
Christ, M., Kassner, A., Smol, R., Bawamia, A., Heine, H., Herr, W., Peters, A., Wurz, M. C., Rasel, E. M., Wicht, A. & Krutzik, M., 1 Dec 2019, In: CEAS Space Journal. 11, 4, p. 561-566 6 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Novel Eddy-Current Sensor for Industrial Deep-Drawing Applications
Arndt, M., Dencker, F. & Wurz, M. C., Oct 2019, 2019 IEEE Sensors, SENSORS 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 4 p. 8956948. (Proceedings of IEEE Sensors; vol. 2019-October).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- E-pub ahead of print
„Hai-Tech“ spanend fertigen: Mikroschleifen – funktionalisierte Oberflächen – selbstschärfende Werkzeuge
Wurz, M. C., Denkena, B., Asadi, E. & Hockauf, R., 23 Jul 2019, (E-pub ahead of print) In: WB Werkstatt und Betrieb. 2019, 6, p. 48-51Research output: Contribution to journal › Article › Research
- Published
Integrated Atomic Quantum Technologies in Demanding Environments:: Development and Qualification of Miniaturized Optical Setups and Integration Technologies for UHV and Space Operation
Christ, M., Kassner, A., Smol, R., Bawamia, A. I., Peters, A., Wurz, M. C., Rasel, E. M., Wicht, A. & Krutzik, M., 12 Jul 2019, International Conference on Space Optics, ICSO 2018: Proceedings. Sodnik, Z., Karafolas, N. & Cugny, B. (eds.). SPIE, 8 p. 1118088. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 11180).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Substrate modification influence on properties of nanocomposite based on TiO2 and gold nanoparticles
Mishin, M. V., Vorobyev, A. A., Kondrateva, A. S., Koroleva, E. Y., Karaseov, P. A., Bespalova, P. G., Shakhmin, A. L., Glukhovskoy, A., Wurz, M. C. & Filimonov, A. V., Jun 2019, In: Journal of Physics: Conference Series. 1236, 1, 012025.Research output: Contribution to journal › Conference article › Research › peer review
- Published
Structuring of laser activated polymers for sensor applications
Bengsch, S., Aue, M., Cromwell, K. & Wurz, M. C., May 2019, IEEE 69th Electronic Components and Technology Conference (ECTC): Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 1883-1888 6 p. 8811368. (Proceedings - Electronic Components and Technology Conference; vol. 2019-May).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Herstellung induktiver elektrischer Bauelemente
Wurz, M. C. (Inventor), Maier, H. J. (Inventor) & Beringer, S. (Inventor), 25 Apr 2019, IPC No. H01F27/32 A I, H01F5/00, Patent No. DE102017124675A1, 23 Oct 2017, Priority date 23 Oct 2017, Priority No. DE102017124675AResearch output: Patent
- Published
AMR-based mechanical pressure sensors: a proof of concept
Prediger, M. S., Rechel, M. & Wurz, M. C., Mar 2019.Research output: Contribution to conference › Paper › Research
- Published
AMR Sensoren auf flexiblem substrat zur Messung von Verformungen eines hartmagnetischen Partikel-Elastomerverbunds
Prediger, M. S., Wittek, C. G. R., Owiss, G. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. 1. ed. VDE Verlag GmbH, p. 111-114 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Atomchips mit integrierten optischen Gittern zur Erzeugung von Bose-Einstein-Kondensaten
Kassner, A., Dencker, F., Künzler, C., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M. & Wurz, M., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 541-544 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Atom chip technology for use under UHV conditions
Kassner, A., Rechel, M., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M. & Wurz, M. C., 2019, Smart Systems Integration 2019: International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2019. Otto, T. (ed.). VDE Verlag GmbH, p. 69-75 7 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Elektrische Kontaktierung bauteilinhärenter Dehnungsmesssensorik mithilfe des Transient Liquid Phase (TLP) Bonding
Ottermann, R., Knöpke, R. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 263-266 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Fertigung und Charakterisierung von in Leiterplatten integrierten Mikrotransformatoren
Fischer, E., Cromwell, K. & Wurz, M., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 569-572 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
MEMS basierte magnetische passive Mikrobauteile für Hochfrequenz-Leistungsanwendungen
Dinulovic, D., Shousha, M., El Shafey, K., Haug, M. & Wurz, M., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 32-35 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Microfabricated Magnetics on Silicon for Point of Load High-Frequency DC-DC Converter Applications
Dinulovic, D., Shousha, M., Haug, M., Gerfer, A., Beringer, S., Wurz, M. C., Thone, J. & Wens, M., 2019, In: IEEE Transactions on Industry Applications. 55, 5, p. 5068-5077 10 p., 8732443.Research output: Contribution to journal › Article › Research › peer review
- Published
Simulationsgestützte Auslegung und Fertigung von werkzeugintegrierten induktiven Sensoren
Arndt, M., Dencker, F. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 673-676 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
The concept of a large working stroke reluctance zipper actuator
Glukhovskoy, A. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 506-509 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Vibro-tactile displays for stimulating surface impressions
Schmelt, A. S., Fischer, E. C., Hofmann, V., Twiefel, J. & Wurz, M. C., 2019, Proceedings of the 23rd International Congress on Acoustics: Integrating 4th EAA Euroregio 2019. Ochmann, M., Vorländer, M. & Fels, J. (eds.). p. 1000-1007 8 p. (Proceedings of the International Congress on Acoustics; vol. 2019-September).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2018
- Published
Elektrische Schaltungsstruktur und Verfahren zu deren Herstellung
Maier, H. J. (Inventor), Wurz, M. (Inventor) & Beringer, S. (Inventor), 25 Oct 2018, IPC No. H05K 3/ 40 A I, Patent No. DE102017108437, Priority date 20 Apr 2017, Priority No. DE201710108437Research output: Patent
- Published
Verfahren und Anlage zur Herstellung eines elektrischen Bauteils sowie Computerprogramm
Klaas, D. (Inventor), Wurz, M. C. (Inventor) & Maier, H. J. (Inventor), 11 Oct 2018, IPC No. C23C 16/ 04 A I, Patent No. DE102017113212, Priority date 15 Jun 2017, Priority No. DE201710113212Research output: Patent
- Published
Revealing of ultrasonic wire bonding mechanisms via metal-glass bonding
Long, Y., Dencker, F., Isaak, A., Li, C., Schneider, F., Hermsdorf, J., Wurz, M., Twiefel, J. & Wallaschek, J., Oct 2018, In: Materials Science and Engineering B: Solid-State Materials for Advanced Technology. 236-237, p. 189-196 8 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Design and characterization of the lateral actuator of a bimodal tactile display with two excitation directions
Schmelt, A. S., Hofmann, V., Fischer, E. C., Wurz, M. C. & Twiefel, J., Sept 2018, In: Displays. 54, p. 34-46 13 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Concept for Using MID Technology for Advanced Packaging
Wurz, M. C., Roesener, B., Bengsch, S. & Beringer, S., 7 Aug 2018, Proceedings: IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., p. 932-939 8 p. 8429656. (Proceedings - Electronic Components and Technology Conference; vol. 2018-May).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Structuring methods of polymers for low cost sensor manufacturing
Bengsch, S., Wurz, M. C., Aue, M. & De Wall, S., 7 Aug 2018, Proceedings: IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1396-1401 6 p. 8429726. (Proceedings - Electronic Components and Technology Conference; vol. 2018-May).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Self-cleaning mechanisms in ultrasonic bonding of Al wire
Long, Y., Dencker, F., Isaak, A., Hermsdorf, J., Wurz, M. & Twiefel, J., Aug 2018, In: Journal of Materials Processing Technology. 258, p. 58-66 9 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Verfahren zur Anbringung einer elektrischen Mikrostruktur sowie Elastomerstruktur, Faserverbundbauteil und Reifen
Maier, H. J. (Inventor), Wurz, M. (Inventor) & Bengsch, S. (Inventor), 14 Jun 2018, IPC No. H05K 3/ 20 A I, Patent No. DE102016123795, Priority date 8 Dec 2016, Priority No. DE201610123795Research output: Patent
- Published
The mechanism of charge carrier generation at the TiO2—n-Si heterojunction activated by gold nanoparticles
Mishin, M. V., Vorobyev, A. A., Kondrateva, A. S., Koroleva, E. Y., Karaseov, P. A., Bespalova, P. G., Shakhmin, A. L., Glukhovskoy, A. V., Wurz, M. C. & Filimonov, A. V., 11 Jun 2018, In: Semiconductor Science and Technology. 33, 7, 075014.Research output: Contribution to journal › Article › Research › peer review
- Published
Flexible mono- and multilayer micro grinding tools for ultra-high precision processing and micro machining
Asadi, E., Hockauf, R., Denkena, B., Grove, T. & Wurz, M., 5 Jun 2018, European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 18th International Conference and Exhibition, EUSPEN 2018. Riemer, O., Savio, E., Billington, D., Leach, R. K. & Phillips, D. (eds.). p. 151-152 2 p. (European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 18th International Conference and Exhibition, EUSPEN 2018).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Verfahren zum Verbinden eines Halbleiterbauelements mit einem Gegenstück sowie Anordnung mit einem Halbleiterbauelement
Wurz, M. C. (Inventor), Overmeyer, L. (Inventor), von Witzendorff, P. (Inventor), Hermsdorf, J. (Inventor) & Bengsch, S. (Inventor), 30 May 2018, IPC No. H01L 23/ 48 A I, Patent No. DE102016123180, Priority date 30 Nov 2016, Priority No. DE201610123180Research output: Patent
- Published
Magnetic Properties of Thermal Sprayed Tungsten Carbide–Cobalt Coatings
Angrisani, G. L., Taptimthong, P., Thürer, S. E., Klose, C., Maier, H. J., Wurz, M. C. & Möhwald, K., 11 May 2018, In: Advanced engineering materials. 20, 9, 1800102.Research output: Contribution to journal › Article › Research › peer review
- Published
Manufacturing and characterization of asymmetric evanescent field polished couplers for grating assisted mode selective fiber coupling
Schlangen, S., Bremer, K., Zheng, Y., Isaak, A., Wurz, M., Böhm, S., Wellmann, F., Steinke, M., Pelegrina Bonilla, G., Neumann, J., Kracht, D., Roth, B. & Overmeyer, L., 9 May 2018, Micro-Structured and Specialty Optical Fibres V. SPIE, 1068116. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 10681).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Fabrication and characterization of high-speed PZT sensors for the investigation of ultrasonic wire bonding process
Isaak, A., Long, Y., Asadi, E., Wurz, M., Twiefel, J. & Wallaschek, J., 1 Jan 2018, Proceedings of the 18 international conference of the european society for precision engineering and nanotechnology. Riemer, O., Savio, E., Billington, D., Leach, R. K. & Phillips, D. (eds.). p. 163-164 2 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
A laser-based, in-line chlorine dioxide concentration sensor
Wurz, M. C., Fischer, E. C., Holz, S., Glukhovskoy, A. & Schnebeck, T., 2018.Research output: Contribution to conference › Paper › Research
- Published
Grinding of riblets with "beaver tooth" multi-layer tools
Hockauf, R., Asadi, E., Denkena, B., Grove, T. & Wurz, M., 2018, In: Procedia CIRP. 71, p. 155-159 5 p.Research output: Contribution to journal › Conference article › Research › peer review
- Published
Mode-selective polished fiber couplers based on fiber gratings
Schlangen, S., Bremer, K., Isaak, A., Wurz, M. C., Bonilla, G. P., Neumann, J., Roth, B. W. & Overmeyer, L., 2018, Optical Fiber Communication Conference, OFC 2018. OSA - The Optical Society, (Optics InfoBase Conference Papers; vol. Part F84-OFC 2018).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Next Generation Atom Chip Development
Wurz, M. C., Papakonstantinou, A., Heine, H., Kassner, A., Rechel, M., Herr, W., Ertmer, W., Rasel, E. M. & Le Gonidec, M., 2018.Research output: Contribution to conference › Paper › Research
- Published
Solid state joint actuator for a vibro tactile line display
Schmelt, A., Fischer, E. C., Wurz, M. & Twiefel, J., 2018, ACTUATOR 2018: 16th International Conference and Exhibition on New Actuators and Drive Systems, Conference Proceedings. VDE Verlag GmbH, p. 284-287 4 p. (ACTUATOR 2018 - 16th International Conference and Exhibition on New Actuators and Drive Systems, Conference Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2017
- Published
Analysis of the Wire/Substrate Interface during Ultrasonic Bonding Process
Long, Y., Dencker, F., Isaak, A., Li, C., Wurz, M., Twiefel, J., Wallaschek, J., Schneider, F. & Hermsdorf, J., 28 Dec 2017, 2017 IEEE CPMT Symposium Japan (ICSJ). Institute of Electrical and Electronics Engineers Inc., p. 203-206 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Fabrication and characterization of a Ni-Fe-W core microtransformer for high-Frequency power applications
Mundotiya, B. M., Dinulovic, D., Rissing, L. & Wurz, M. C., 1 Nov 2017, In: Sensors and Actuators, A: Physical. 267, p. 42-47 6 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Comparative Study of Microfabricated Inductors/Transformers for High-Frequency Power Applications
Dinulovic, D., Shousha, M., Haug, M., Beringer, S. & Wurz, M. C., Nov 2017, In: IEEE transactions on magnetics. 53, 11, 8000366.Research output: Contribution to journal › Article › Research › peer review
- Published
Feasibility of Round Window Stimulation by a Novel Electromagnetic Microactuator
Van Drunen, W. J., Mueller, M., Glukhovskoy, A., Salcher, R., Wurz, M. C., Lenarz, T. & Maier, H., 29 Oct 2017, In: BioMed Research International. 2017, 6369247.Research output: Contribution to journal › Article › Research › peer review
- Published
Nanosecond miniature transmitters for pulsed optical radars
Filimonov, A. V., Zemlyakov, V. E., Egorkin, V. I., Maslevtsov, A. V., Wurz, M. C. & Vainshtein, S. N., 13 Sept 2017, Internet of Things, Smart Spaces, and Next Generation Networks and Systems - 17th International Conference, NEW2AN 2017, 10th Conference, ruSMART 2017, 3rd Workshop NsCC 2017, Proceedings. Springer Verlag, p. 490-497 8 p. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); vol. 10531 LNCS).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Investigation of intracochlear dual actuator stimulation in a scaled test rig
Van Drunen, W. J., Lachheb, S. K., Glukhovskoy, A., Twiefel, J., Wurz, M. C., Lenarz, T., Rau, T. S. & Majdani, O., Sept 2017, In: Current Directions in Biomedical Engineering. 3, 2, p. 119-122 4 p.Research output: Contribution to journal › Article › Research › peer review
- Published
A micromechanical gyroscope with bistable suspension of microdrive
Pyatishev, E., Enns, Y., Komarevtsev, I., Wurz, M. C. & Glukhovskoy, A., 28 Jul 2017, 2017 24th Saint Petersburg International Conference on Integrated Navigation Systems, ICINS 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 7995646Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Visualization of oxide removal during ultrasonic wire bonding process
Long, Y., Dencker, F., Isaak, A., Schneider, F., Hermsdorf, J., Wurz, M. & Twiefel, J., 2 Jul 2017, 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-4 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Sensors, data storage and communication technologies: Optoelectronic integration of radiofrequency communication systems in metalcomponents
Breidenstein, B., Mörke, T., Hockauf, R., Ostermann, J., Spitschan, B., Schmidt, C., Barton, S., Mroz, G., Reimche, W., Maier, H. J., Behrens, B. A., Bonhage, M., Malik, I. Y., Demminger, C., Klose, C., Taptimthong, P., Wurz, M. C., Jogschies, L., Klaas, D., Düsing, J. F., Koch, J., Suttmann, O., Overmeyer, L., Dao, Q. H., von der Ahe, C., von Witzendorff, P., Geck, B. & Hachicha, B., 23 Jun 2017, Cyber-Physical and Gentelligent Systems in Manufacturing and Life Cycle: Genetics and Intelligence - Keys to Industry 4.0. 1 ed. Elsevier Inc., p. 7-278 272 p.Research output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research › peer review
- Published
Mass production for micro end mills
Denkena, B., Wurz, M., Grove, T., Bouabid, A. & Asadi, E., 30 May 2017, Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017. Phillips, D. & Billington, D. (eds.). p. 245-246 2 p. (Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Chip bonding of low-melting eutectic alloys by transmitted laser radiation
Hoff, C., Venkatesh, A., Schneider, F., Hermsdorf, J., Bengsch, S., Wurz, M. C., Kaierle, S. & Overmeyer, L., 12 Apr 2017, In: Advanced Optical Technologies. 6, 3-4, p. 311-317 7 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Investigations on the oxide removal mechanism during ultrasonic wedge-wedge bonding process
Long, Y., Dencker, F., Schneider, F., Emde, B., Li, C., Hermsdorf, J., Wurz, M. C. & Twiefel, J., 21 Feb 2017, Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Institute of Electrical and Electronics Engineers Inc., p. 405-410 6 p. 7861512Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
New coating system for direct-deposition of sensors on components of arbitrary size: A novel approach allowing for thinner sensors with higher measuring accuracy
Klaas, D., Becker, J., Wurz, M. C., Schlosser, J. & Kunze, M., 5 Jan 2017, IEEE Sensors, SENSORS 2016: Proceedings. Institute of Electrical and Electronics Engineers Inc., 7808440. (Proceedings of IEEE Sensors).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Anodische auflösung von aluminium als downsizing technik für mikro-induktivitäten
Beringer, S., Dinulovic, D., Bengsch, S., Haug, M. & Wurz, M. C., 2017, MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings. VDE Verlag GmbH, p. 624-627 4 p. (MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Atom-Chip based BEC sources for compact and transportable experiments
Wurz, M. C., Heine, H., Matthias, J., Grove, N., Sahelgozin, M., Kassner, A., Rechel, M., Abend, S., Seidel, S. T., Herr, W., Wurz, M. C., Müller, J., Ertmer, W. & Rasel, E. M., 2017.Research output: Contribution to conference › Poster › Research
- Published
Comparative study of microfabricated inductors / transformers for high frequency power applications
Dinulovic, D., Shousha, M., Haug, M., Beringer, S., Wurz, M. & Rissing, L., 2017, 2017 IEEE International Magnetics Conference, INTERMAG 2017. Institute of Electrical and Electronics Engineers Inc., 8007782Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Dicing by "Crack-and-Fracture": Novel separation method for MEMS substrates
Stompe, M. & Wurz, M. C., 2017, Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017. p. 101-102 2 p. (Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Electrical feed through for tool integrated high temperature applications
Dencker, F., Kolodziejczyk, F. & Wurz, M. C., 2017, International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017. p. 50-56 7 p. (International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Elektromechanischer Mikro-Biegeaktor als optischer Shutte
Wurz, M. C., Pyatishev, E., Glukhovskoy, A., Fischer, E. C., Kleimanov, R., Odintsov, A. & Pyatishev, E., 2017, Proceedings of the MikroSystemTechnik Kongress 2017.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
- Published
Elektromechanischer Mikro-Biegeaktor als optischer Shutter
Pyatishev, E., Wurz, M., Enns, Y., Glukhovskoy, A., Fischer, E., Odintsov, A. & Kleimanov, R., 2017, MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings. VDE Verlag GmbH, p. 519-522 4 p. (MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Flexibles magnetisches Lese-/Schreibsystem: Einfluss von Wärme auf das Datenbit
Taptimthong, P. & Wurz, M. C., 2017, MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings. VDE Verlag GmbH, p. 586-589 4 p. (MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Hot stamping process reliability – Innovative sensor technology for inline quality assurance
Wurz, M. C., Behrens, B., Hübner, S., Moritz, J., Pfeffer, C., Wölki, K., Dencker, F., Wolter, B., Niemeyer, H. & Müller, T., 2017, Conference Strategies in Car Body Engineering.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
- Published
LED packaging with optimized heat dissipation for a micro LED array
Kusch, A., Wurz, M., Held, M. P., Wolf, A. & Lachmayer, R., 2017, International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017. Otto, T. (ed.). p. 399-402 4 p. (International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Mikroaktorik für ein Taktiles Display
Fischer, E., Glukhovskoy, A., Schmelt, A., Twiefel, J. & Wurz, M. C., 2017, MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings. VDE Verlag GmbH, p. 515-518 4 p. (MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Mikrofluidische Galvanik zur Herstellung magnetoresistiver Schichten
Rechel, M., Taptimthong, P., Arndt, M. & Wurz, M. C., 2017, MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings. VDE Verlag GmbH, p. 313-316 4 p. (MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Modeling and Characterization of a Bimodal Tactile Display
Wurz, M. C., Fischer, E. C., Twiefel, J., Hofmann, V. & Schmelt, A. S., 2017.Research output: Contribution to conference › Paper › Research
- Published
Press hardening tool integrated thin film temperature sensor
Dencker, F., Schlenkrich, A. & Wurz, M. C., 2017, Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017. p. 349-350 2 p. (Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Pulsed electron source for atmospheric pressure chemical ionization in ion mobility spectrometry
Bunert, E., Heptner, A., Kirk, A. T., Käbein, O., Zimmermann, S., Kusch, A. & Wurz, M. C., 2017, 2017 30th International Vacuum Nanoelectronics Conference (IVNC). Langer, C. & Lawrowski, R. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 102-103 2 p. 8051563. (International Vacuum Nanoelectronics Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review