Publications
2023
- Published
Force sensing linear rolling guides based on modified metal strain gauges
Denkena, B., Klemme, H., Kowalke, D., Korbacher, M., Ottermann, R., Dencker, F. & Wurz, M., 2023, European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 23rd International Conference and Exhibition, EUSPEN 2023. Riemer, O., Nisbet, C. & Phillips, D. (eds.). p. 207-210 4 p. (European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 23rd International Conference and Exhibition, EUSPEN 2023).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Influence of oxide layers on the mechanical properties of copper
Raumel, S., Wolf, A., Dencker, F. & Wurz, M., 2023, Tagungsband, 5. Symposium Materialtechnik : Fortschrittbericht der Materialforschung und Werkstofftechnik . p. 149-159 (Fortschrittsberichte der Materialforschung und Werkstofftechnik; vol. 12).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Integration of film-based sensor technology in additively manufactured components
Basten, R. G., Bengsch, S. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 154-161 8 p. (MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Manufacture and application of a sensor inlet for high-temperature measurements in the frictional zone of an extrusion die
Raumel, S., Moradi, A. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 672-675 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Manufacturing and Characterization of Piezoelectric Force Sensor Arrays for Investigation of Ultrasonic Wire Bonding
Arndt, M., Long, Y., Hu, C., Dencker, F., Twiefel, J. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 462-465 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Measurement of the Ultrasound Induced Temperature Change in an Ultrasonic Assisted Silver Sintering Process
Hadeler, S., Long, Y., Twiefel, J. & Wurz, M. C., 2023, IEEE Sensors 2023 Conference Proceedings. (Proceedings of IEEE Sensors).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Microtechnological Production of Integrated Optical Gratings Using Laser Beam Lithography for Atomic Interferometers
de Wall, S., Kassner, A., Dencker, F. & Wurz, M., 2023, Tagungsband MikroSystemTechnik Kongress 2023. 3 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
- Published
Miniaturized quantum systems for inertial measurement units
Kassner, A., Diekmann, L., Künzler, C., Petring, J., Droese, N., Dencker, F., Heine, H., Abend, S., Gersemann, M., Rasel, E. M., Herr, W., Schubert, C. & Wurz, M. C., 2023, 2023 DGON Inertial Sensors and Systems (ISS). Hecker, P. (ed.). (International Symposium on Inertial Sensors and Systems).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Oxygen-free resistance heating with nitrogen and silane as an energy-efficient heating process for hot stamping
Behrens, B., Hübner, S., Holländer, U., Langohr, A., Albracht, L. F. J., Faramand, E., Wehmeyer, J., Yarcu, S., Raumel, S. & Wurz, M., 2023, In: IOP Conference Series: Materials Science and Engineering. 1284, 012007.Research output: Contribution to journal › Conference article › Research › peer review
- E-pub ahead of print
Performance Comparison of MR Sensors on Silicon and Bare PEEK (Polyether Ether Ketone) Wafers
de Wall, S., Bierwirth, T. N., Wurz, M. & Bengsch, S., 2023, (E-pub ahead of print).Research output: Contribution to conference › Poster › Research
- Published
Physical Sensors: Magnetic Sensors
Prediger, M. S. & Wurz, M., 2023, Encyclopedia of Sensors and Biosensors. Elsevier Inc., Vol. 1. p. 97-110 14 p.Research output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research
- Published
Sensor Inserts on Spherical Surfaces for Temperature Measurement in Wear Contacts
Raumel, S. & Wurz, M. C., 2023, 2023 IEEE SENSORS. p. 1-4 (Proceedings of IEEE Sensors).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Setup of an ultra-high vacuum bonder for the encapsulation of quantum systems
Droese, N., Petring, J., Hadeler, S., Kassner, A., Dencker, F. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 763-766 4 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Simulation-based Design of a Magnetostrictive Middle Ear Actuator
Adamscheck, M., Fischer, E., Müller, E., Glukhovskoy, A., Prediger, M. S., Dencker, F. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 503-508 6 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Simulation, Manufacturing and Evaluation of a Transformer Eddy-Current Sensor for Deep-Drawing Processes
Kamrani, S., Ottermann, R., Dencker, F. & Wurz, M., 2023, SMSI 2023. p. 284 -285Research output: Chapter in book/report/conference proceeding › Other contribution in a book, report, anthology or conference proceeding › Research
- Published
Monitoring of the Flange Draw-In During Deep Drawing Processes Using a Thin-Film Inductive Sensor
Fünfkirchler, T., Arndt, M., Hübner, S., Dencker, F., Wurz, M. C. & Behrens, B. A., 2 Feb 2023, Lecture Notes in Production Engineering. Springer Nature, p. 111-121 11 p. (Lecture Notes in Production Engineering; vol. Part F1163).Research output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research › peer review
- Published
Process Development for Batch Production of Micro-Milling Tools Made of Silicon Carbide by Means of the Dry Etching Process
Wittek, C. R., Steinhoff, L., Raumel, S., Reißfelder, M., Dencker, F. & Wurz, M. C., 28 Feb 2023, In: Micromachines. 14, 3, 580.Research output: Contribution to journal › Article › Research › peer review
- Published
Detection of joining mechanisms at different locations of the wire/substrate interface during ultrasonic wire bonding via a PZT-based sensor array
Long, Y., Arndt, M., Sun, C., Dencker, F., Wurz, M. & Twiefel, J., Mar 2023, In: Journal of Materials Processing Technology. 312, 117826.Research output: Contribution to journal › Article › Research › peer review
- Published
Application of batch manufactured flexible micro-grinding tools on copper and oxidized copper surfaces
Steinhoff, L., Dencker, F. & Wurz, M. C., 27 Mar 2023, In: Tribologie und Schmierungstechnik. 70, 1, p. 5-10 6 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Influence of Microscale Tin Particles on Mechanical Properties of Silver Sintering Joints with Reduced Processing Parameters
Hadeler, S., Long, Y., Ottermann, R., Dencker, F., Twiefel, J. & Wurz, M. C., May 2023, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC): Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 676-681 6 p. (Proceedings - Electronic Components Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review