Publications
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Development, micro fabrication, and test of flexible magnetic write head for gentelligent applications
Belski, A., Wurz, M. C., Rittinger, J. & Rissing, L., 26 Feb 2013, In: Microelectronic Engineering. 110, p. 315-319 5 p.Research output: Contribution to journal › Article › Research › peer review
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High permeability flexible bulk material for magnetic micro head applications
Belski, A., Taptimthong, P., Wurz, M. C. & Rissing, L., 14 Jan 2013, JEMS 2012 – Joint European Magnetic Symposia . Tiberto, P., Affronte, M., Casoli, F., de Julián Fernández, C., Gubbiotti, G., Marquina, C., Pratt, F., Solzi, M., Tacchi, S. & Vavassori, P. (eds.). EDP Sciences, (EPJ Web of Conferences; vol. 40).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Optical Platform for Highly Precise Optical Components
Bengsch, S., Fischer, E., De Wall, S., Schelm, T., Arndt, M. & Wurz, M. C., 2020, Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 2191-2196 6 p. 9159477. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Thin Film Transferring via PVA Substrate and Contacting of Sensor inside Elastomer Matrix
Bengsch, S., Giese, U., Fischer, E. & Wurz, M. C., 2020, IEEE Sensors, SENSORS 2020: Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 9278876. (Proceedings of IEEE Sensors; vol. 2020-October).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates
Bengsch, S. & Wurz, M. C., 2020, 2020 IEEE Photonics Conference, IPC 2020. Institute of Electrical and Electronics Engineers Inc., 9252383Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Structuring of laser activated polymers for sensor applications
Bengsch, S., Aue, M., Cromwell, K. & Wurz, M. C., May 2019, IEEE 69th Electronic Components and Technology Conference (ECTC): Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 1883-1888 6 p. 8811368. (Proceedings - Electronic Components and Technology Conference; vol. 2019-May).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Structuring methods of polymers for low cost sensor manufacturing
Bengsch, S., Wurz, M. C., Aue, M. & De Wall, S., 7 Aug 2018, Proceedings: IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1396-1401 6 p. 8429726. (Proceedings - Electronic Components and Technology Conference; vol. 2018-May).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Structuring methods of plastic substrates for electroplating applications
Bengsch, S., Rechel, M., Asadi, E. & Wurz, M. C., 2016, Magnetic Materials Processes and Devices 14. Bonhote, C., Zangari, G., Kitamoto, Y., Osaka, T. & Gatzen, H. H. (eds.). 2 ed. Electrochemical Society, Inc., Vol. 75. p. 67-73 7 p. (MAGNETIC MATERIALS PROCESSES AND DEVICES 14).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Anodische auflösung von aluminium als downsizing technik für mikro-induktivitäten
Beringer, S., Dinulovic, D., Bengsch, S., Haug, M. & Wurz, M. C., 2017, MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings. VDE Verlag GmbH, p. 624-627 4 p. (MikroSystemTechnik Kongress 2017 "MEMS, Mikroelektronik, Systeme", Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Development and optimization of thin-film technology based micro-inductors and transformers
Beringer, S., Dinulovic, D., Haug, M., Rissing, L. & Wurz, M., 2016, 2nd Joint ISTDM/ICSI 2019 Conference. Eriksson, M. A. & Lagally, M. G. (eds.). Curran Associates Inc., p. 51-58 8 p. (ECS Transactions; vol. 75, no. 2).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Fabrication Method and Characterization of Molded Interconnect Device Micro Transformer in Planar Form by Embedding Sintered Ferrite Cores
Bierwirth, T. N., Fischer, E. C., Prediger, M. S., Le, T. M., Dencker, F. & Wurz, M. C., Oct 2023, MikroSystemTechnik Kongress 2023: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 599-604 6 p.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
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Fabrication of a Low Profile Planar Transformer Using Molded Interconnect Device Technology
Bierwirth, T. N., Dencker, F., Fischer, E. C. & Wurz, M. C., Sept 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 129-133 5 p. (2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
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Manufacturing and Characterization of Planar Transformers as Molded Interconnect Device Technology Component for an Industrial Production
Bierwirth, T. N., Bengsch, S., Werner, M., Wachs, R., Henne, C., Bur, S., Dencker, F. & Wurz, M. C., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 2172-2177 6 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Studium Initiale: Übergangsmanagement und Integration beruflich Qualifizierter in das Hochschulstudium: Schlussbericht des Teilvorhabens der Gottfried Wilhelm Leibniz Universität Hannover zum Verbundprojekt Mobilitätswirtschaft: Bund-Länder-Wettbewerb: "Aufstieg durch Bildung: Offene Hochschulen": 1. Wettbewerbsrunde, erste Förderphase vom 01.10.2011-31.03.2015
Billmann-Mahecha, E., Beyersdorf, M., Rissing, L., Wurz, M. C., Staecker, B., Holz, S. & Jahn, B., 2015Research output: Book/Report › Project report/research report › Research
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Studium Initiale: Übergangsmanagement und Integration beruflich Qualifizierter in das Hochschulstudium : Schlussbericht des Teilvorhabens der Gottfried Wilhelm Leibniz Universität Hannover zum Verbundprojekt Mobilitätswirtschaft : Bund-Länder-Wettbewerb: "Aufstieg durch Bildung: Offene Hochschulen" : 1. Wettbewerbsrunde, erste Förderphase vom 01.10.2011-31.03.2015 = Final report of the undertakings of the Gottfried Wilhelm Leibniz Universität Hannover in the scope of the joint research project: "Mobility management STUDIUM INITIALE - Transition management and integration of qualified professionals in the university education"
Billmann-Mahecha, E., Beyersdorf, M., Rissing, L., Wurz, M. C., Staecker, B., Holz, S. & Jahn, B., 2015, HannoverResearch output: Other contribution › Other publication › Research › peer review
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Sensors, data storage and communication technologies: Optoelectronic integration of radiofrequency communication systems in metalcomponents
Breidenstein, B., Mörke, T., Hockauf, R., Ostermann, J., Spitschan, B., Schmidt, C., Barton, S., Mroz, G., Reimche, W., Maier, H. J., Behrens, B. A., Bonhage, M., Malik, I. Y., Demminger, C., Klose, C., Taptimthong, P., Wurz, M. C., Jogschies, L., Klaas, D., Düsing, J. F., Koch, J., Suttmann, O., Overmeyer, L., Dao, Q. H., von der Ahe, C., von Witzendorff, P., Geck, B. & Hachicha, B., 23 Jun 2017, Cyber-Physical and Gentelligent Systems in Manufacturing and Life Cycle: Genetics and Intelligence - Keys to Industry 4.0. 1 ed. Elsevier Inc., p. 7-278 272 p.Research output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research › peer review
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Novel Glass-Silicon Emitter Chip for Field Emission Applications
Buchta, A. M., Kassner, A., Voß, J., Leopold, T., Petring, J., Diekmann, L., Dencker, F. & Wurz, M. C., 27 Jul 2023, 2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC). p. 207-209 3 p. ( International Vacuum Nanoelectronics Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Glass-Extraction Electrode for Field Emission Applications
Buchta, A. M., Kassner, A., Dencker, F. & Wurz, M. C., 2024, 2024 37th International Vacuum Nanoelectronics Conference (IVNC). (International Vacuum Nanoelectronics Conference proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Pulsed electron source for atmospheric pressure chemical ionization in ion mobility spectrometry
Bunert, E., Heptner, A., Kirk, A. T., Käbein, O., Zimmermann, S., Kusch, A. & Wurz, M. C., 2017, 2017 30th International Vacuum Nanoelectronics Conference (IVNC). Langer, C. & Lawrowski, R. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 102-103 2 p. 8051563. (International Vacuum Nanoelectronics Conference).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
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Designs and characterizations of soft magnetic flux guides in a 3-D magnetic field sensor
Chen, J., Wurz, M. C., Belski, A. & Rissing, L., Apr 2012, In: IEEE transactions on magnetics. 48, 4, p. 1481-1484 4 p., 6172423.Research output: Contribution to journal › Article › Research › peer review