Profile information

apl. Prof. Dr.-Ing. Dipl.-Phys.  Kirsten Weide-Zaage

https://orcid.org/0000-0003-3438-210X
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Publications

  1. 1999
  2. Published

    Impact of FEM simulation on reliability improvement of packaging

    Weide, K., 1999, In: Microelectronics reliability. 39, 6-7, p. 1079-1088 10 p.

    Research output: Contribution to journal › Conference article › Research › peer review

  3. 1998
  4. Published

    Influence of the material properties on the thermal behaviour of a package

    Weide, K., Keck, C. & Yu, X., 28 Aug 1998, Microelectronic manufacturing, yield, reliability, and failure analysis IV: 23 - 24 September 1998, Santa Clara, California. Bellingham: SPIE, p. 112-121 10 p. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 3510).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  5. 1997
  6. Published

    Investigations of mechanical stress and electromigration in an aluminum meander structure

    Yu, X. & Weide, K., 11 Sept 1997, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III: 1 - 2 October 1997, Austin, Texas. Bellingham: SPIE, p. 160-166 7 p. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 3216).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  7. Published

    A study of the thermal - electrical- and mechanical influence on degradation in an aluminum - pad structure

    Yu, X. & Weide, K., 1997, In: Microelectronics reliability. 37, 10-11, p. 1545-1548 4 p.

    Research output: Contribution to journal › Article › Research › peer review

  8. 1996
  9. Published

    Finite element investigations of mechanical stress in metallization structures

    Weide, K., Yu, X. & Menhorn, F., 1996, In: Microelectronics reliability. 36, 11-12 SPEC. ISS., p. 1703-1706 4 p.

    Research output: Contribution to journal › Article › Research › peer review

  10. 1995
  11. Published

    Model calculations on a bipolar transistor emitter interconnection with different contact shapes

    Weide, K., Ullmann, J. & Hasse, W., 2 Oct 1995, In: Applied surface science. 91, 1-4, p. 234-238 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  12. 1992
  13. Published

    3-dimensional simulations of temperature and current density distribution in a via structure

    Weide, K. & Hasse, W., 1992, Annual Proceedings - Reliability Physics (Symposium). p. 361-365 5 p. (Annual Proceedings - Reliability Physics (Symposium)).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

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