Publications
- 2008
- Published
Simulation of migration effects in solder bumps
Weide-Zaage, K., Sept 2008, In: IEEE Transactions on Device and Materials Reliability. 8, 3, p. 442-448 7 p., 4595633.Research output: Contribution to journal › Article › Research › peer review
- Published
Determination of migration effects in Cu-via structures with respect to process-induced stress
Weide-Zaage, K., Zhao, J., Ciptokusumo, J. & Aubel, O., Aug 2008, In: Microelectronics reliability. 48, 8-9, p. 1393-1397 5 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Simulation of migration effects in nanoscaled copper metallizations
Weide-Zaage, K., Kashanchi, F. & Aubel, O., Aug 2008, In: Microelectronics reliability. 48, 8-9, p. 1398-1402 5 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Comprehensive reliability analysis of CoWP metal Cap unit processes for high volume production in sub-μm dimensions
Aubel, O., Thierbach, S., Seidel, R., Freudenberg, B., Meyer, M. A., Feustel, F., Poppe, J., Nopper, M., Preusse, A., Zistl, C. & Weide-Zaage, K., 2008, 46th Annual 2008 IEEE International Reliability Physics Symposium Proceedings, IRPS. p. 675-676 2 p. 4558983. (IEEE International Reliability Physics Symposium Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Simulation of migration effects in PoP
Weide-Zaage, K., Fremont, H. & Wang, L., 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems. 4525074. (EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- 2007
- Published
Dynamic void formation in a DD-copper-structure with different metallization geometry
Weide-Zaage, K., Dalleau, D., Danto, Y. & Fremont, H., Feb 2007, In: Microelectronics reliability. 47, 2-3, p. 319-325 7 p.Research output: Contribution to journal › Article › Research › peer review
- 2006
- Published
Measurements and FE-simulations of moisture distribution in FR4 based printed circuit boards
Frémont, H., Horaud, W. & Weide-Zaage, K., 2006, 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. 1643964. (7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006; vol. 2006).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- 2005
- Published
Moisture diffusion in printed circuit boards: Measurements and finite- element- simulations
Weide-Zaage, K., Horaud, W. & Frémont, H., Sept 2005, In: Microelectronics reliability. 45, 9-11, p. 1662-1667 6 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Simulation of mass flux divergence distributions for an evaluation of commercial test structures with tungsten-plugs
Weide-Zaage, K. & Hein, V., 2005, Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. p. 353-358 6 p. 1502827. (Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005; vol. 2005).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- 2004
- Published
How to study delamination in plastic encapsulated devices
Frémont, H., Delétage, J. Y., Weide-Zaage, K. & Danto, Y., Sept 2004, In: Microelectronics reliability. 44, 9-11 SPEC. ISS., p. 1311-1316 6 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Effect of thermal gradients on the electromigration life-time in power electronics
Nguyen, H. V., Salm, C., Krabbenborg, B., Weide-Zaage, K., Bisschop, J., Mouthaan, A. J. & Kuper, F. G., 2004, 2004 IEEE International Reliability Physics Symposium: Proceedings. January ed. Vol. 2004-January. p. 619-620 2 p. (IEEE International Reliability Physics Symposium Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Effect of thermal gradients on the electromigration lifetime in power electronics
Nguyen, H. V., Salm, C., Krabbenborg, B., Weide-Zaage, K., Bisschop, J., Mouthaan, A. J. & Kuper, F. G., 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings. p. 619-620 2 p. (Annual Proceedings - Reliability Physics (Symposium)).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Void formation in a copper-via-structure depending on the stress free temperature and metallization geometry
Weide-Zaage, K., Dalleau, D., Danto, Y. & Fremont, H., 2004, Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004. Ernst, L. J., Zhang, G. Q., Rodgers, P. & Saint Leger, O. (eds.). p. 367-372 6 p. (Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- 2003
- Published
Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures
Dalleau, D., Weide-Zaage, K. & Danto, Y., Sept 2003, In: Microelectronics reliability. 43, 9-11, p. 1821-1826 6 p.Research output: Contribution to journal › Conference article › Research › peer review
- Published
Static and dynamic analysis of failure locations and void formation in interconnects due to various migration mechanisms
Weide-Zaage, K., Dalleau, D. & Yu, X., Feb 2003, In: Materials Science in Semiconductor Processing. 6, 1-3, p. 85-92 8 p.Research output: Contribution to journal › Article › Research › peer review
- 2001
- Published
Three-dimensional voids simulation in chip metallization structures: A contribution to reliability evaluation
Dalleau, D. & Weide-Zaage, K., Sept 2001, In: Microelectronics reliability. 41, 9-10, p. 1625-1630 6 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Vergleich industrieller entwicklungswerkzeuge für elektrothermische schaltungssimulation
Willemen, J., Soppa, W., Pieper, K. W., Weide, K. & Gärtner, R., 2001, In: ITG-Fachbericht. 164, p. 143 1 p.Research output: Contribution to journal › Conference article › Research › peer review
- Published
Verifikation der layout getreuen FE-simulation eines MO-166 gehäuses mittels elektrischer messung und IR-untersuchung
Weide-Zaage, K., Keck, C. & Willemen, J., 2001, In: ITG-Fachbericht. 164, p. 219 1 p.Research output: Contribution to journal › Conference article › Research › peer review
- 2000
- Published
3-D time-depending electro- and thermomigration simulation of metallization structures
Dalleau, D. & Weide-Zaage, K., 2000, In: Advanced Metallization Conference (AMC). p. 477-481 5 p.Research output: Contribution to journal › Conference article › Research › peer review
- 1999
- Published
Finite element analysis of thermal-mechanical stress induced failure in interconnects
Yu, X. & Weide, K., 1999, In: Materials Research Society Symposium - Proceedings. 539, p. 269-274 6 p.Research output: Contribution to journal › Conference article › Research › peer review