Profile information

apl. Prof. Dr.-Ing. Dipl.-Phys.  Kirsten Weide-Zaage

https://orcid.org/0000-0003-3438-210X
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Publications

  1. 2013
  2. Published

    Simulation and measurement of the solder bumps with a plastic core

    Schlobohm, J., Weide-Zaage, K., Rongen, R., Voogt, F. & Roucou, R., 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 6529979. (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  3. 2012
  4. Published

    Electro- and thermo-migration induced failure mechanisms in Package on Package

    Meinshausen, L., Weide-Zaage, K. & Frémont, H., Dec 2012, In: Microelectronics reliability. 52, 12, p. 2889-2906 18 p.

    Research output: Contribution to journal › Review article › Research › peer review

  5. Published

    A design for robust wide metal tracks

    Ackermann, M., Hein, V., Kovács, C. & Weide-Zaage, K., Sept 2012, In: Microelectronics reliability. 52, 9-10, p. 2447-2451 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  6. Published

    Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers

    Meinshausen, L., Frémont, H. & Weide-Zaage, K., Sept 2012, In: Microelectronics reliability. 52, 9-10, p. 1827-1832 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  7. Published

    Simulation of the influence of TiAl 3 layers on the thermal-electrical and mechanical behaviour of Al metallizations

    Kludt, J., Weide-Zaage, K., Ackermann, M. & Hein, V., Sept 2012, In: Microelectronics reliability. 52, 9-10, p. 1987-1992 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  8. Published

    Influence of the barrier properties on the mechanical stress and migration distribution in a copper metallization

    Kludt, J., Ciptokusumo, J. & Weide-Zaage, K., 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012. 6191701. (2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  9. Published

    Simulation-based prediction of reliability and robustness of interconnect systems for semiconductor applications

    Ackermann, M., Hein, V. & Weide-Zaage, K., 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012. 6191800. (2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  10. Published

    Thermal management for stackable packages with stacked ICs

    Meinshausen, L., Weide-Zaage, K. & Frémont, H., 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012. 6191700. (2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  11. 2011
  12. Published

    Influence of air gaps on the thermal-electrical-mechanical behavior of a copper metallization

    Bauer, I., Weide-Zaage, K. & Meinshausen, L., Sept 2011, In: Microelectronics reliability. 51, 9-11, p. 1587-1591 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  13. Published

    Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps

    Meinshausen, L., Weide-Zaage, K. & Frémont, H., Sept 2011, In: Microelectronics reliability. 51, 9-11, p. 1860-1864 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  14. Published

    Electro- and thermomigration in micro bump interconnects for 3D integration

    Meinshausen, L., Weide-Zaage, K. & Petzold, M., 2011, 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011. p. 1444-1451 8 p. 5898701. (Proceedings - Electronic Components and Technology Conference).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  15. 2010
  16. Published

    Exemplified calculation of stress migration in a 90nm node via structure

    Weide-Zaage, K., 2010, 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. 5464542. (2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  17. Published

    Influence of the activation energy of the different migration effects on failure locations in metallization

    Weide-Zaage, K., Ciptokusumo, J. & Aubel, O., 2010, Stress-Induced Phenomena in Metallization - Eleventh International Workshop on Stress-Induced Phenomena in Metallization. p. 85-90 6 p. (AIP Conference Proceedings; vol. 1300).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  18. Published

    Mechanical characterization of copper based metallizations with different via-bottom geometries

    Ciptokusumo, J., Weide-Zaage, K. & Aubel, O., 2010, IPFA 2010 - 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits. 5532227. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  19. Published

    PoP prototyping by determination of matter transport effects

    Meinshausen, L., Weide-Zaage, K., Feng, W. & Frémont, H., 2010, 2010 IEEE CPMT Symposium Japan, ICSJ10. 5679664. (2010 IEEE CPMT Symposium Japan, ICSJ10).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  20. Published

    Principles for simulation of barrier cracking due to high stress

    Ciptokusumo, J., Weide-Zaage, K. & Aubel, O., 2010, 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. 5464617. (2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  21. Published

    Underfill and mold compound influence on PoP aging under high current and high temperature stress

    Meinshausen, L., Weide-Zaage, K. & Frémont, H., 2010, Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. 5642803. (Electronics System Integration Technology Conference, ESTC 2010 - Proceedings).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  22. Published

    Virtual prototyping of PoP interconnections regarding electrically activated mechanisms

    Meinshausen, L., Weide-Zaage, K., Frémont, H. & Feng, W., 2010, 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. 5464618. (2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  23. 2009
  24. Published

    Investigation of stress distribution in via bottom of Cu-via structures with different via form by means of submodeling

    Ciptokusumo, J., Weide-Zaage, K. & Aubel, O., Sept 2009, In: Microelectronics reliability. 49, 9-11, p. 1090-1095 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  25. Published

    Electrically driven matter transport effects in PoP interconnections

    Feng, W., Weide-Zaage, K., Verdier, F., Plano, B., Guédon-Gracia, A. & Frémont, H., 2009, 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. 4938457. (2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

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