Profile information

apl. Prof. Dr.-Ing. Dipl.-Phys.  Kirsten Weide-Zaage

https://orcid.org/0000-0003-3438-210X
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Publications

  1. 2015
  2. Published

    GEANT4 simulations in terms of radiation hardness of commercially available SRAM

    Moujbani, A., Weide-Zaage, K., Romer, B. & Sabath, F., 6 May 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers Inc., 7103106

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  3. Published

    Life time characterization for a highly robust metallization

    Weide-Zaage, K., Kludt, Ackermann, M., Hein, V. & Erstling, M., 6 May 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers Inc., 7103123

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  4. Published

    Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps

    Meinshausen, L., Frémont, H., Weide-Zaage, K. & Plano, B., 1 Jan 2015, In: Microelectronics reliability. 55, 1, p. 192-200 9 p.

    Research output: Contribution to journal › Article › Research › peer review

  5. Published

    Impact of aluminium addition on the corrosion behaviour of Sn-1.0Ag-0.5Cu lead-free solder

    Nordin, N. I. M., Said, S. M., Ramli, R., Weide-Zaage, K., Sabri, M. F. M., Mamat, A., Ibrahim, N. N. S., Mainal, A. & Datta, R. S., 2015, In: RSC Advances. 5, 120, p. 99058-99064 7 p.

    Research output: Contribution to journal › Article › Research › peer review

  6. 2014
  7. Published

    Degradation behavior in upstream/downstream via test structures

    Kludt, J., Weide-Zaage, K., Ackermann, M., Hein, V. & Kovács, C., 1 Sept 2014, In: Microelectronics reliability. 54, 9-10, p. 1724-1728 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  8. Published

    Evaluation new corner stress relief structure layout for high robust metallization

    Hein, V., Kludt, J. & Weide-Zaage, K., 1 Sept 2014, In: Microelectronics reliability. 54, 9-10, p. 1977-1981 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  9. Published

    Qualification procedure for moisture in embedded capacitors

    Frémont, H., Kludt, J., Wade, M., Weide-Zaage, K., Bord-Majek, I. & Duchamp, G., 1 Sept 2014, In: Microelectronics reliability. 54, 9-10, p. 2013-2016 4 p.

    Research output: Contribution to journal › Article › Research › peer review

  10. Published

    Reliability of wafer level chip scale packages

    Rongen, R., Roucou, R., Vd Wel, P. J., Voogt, F., Swartjes, F. & Weide-Zaage, K., 1 Sept 2014, In: Microelectronics reliability. 54, 9-10, p. 1988-1994 7 p.

    Research output: Contribution to journal › Article › Research › peer review

  11. Published

    Electromigration reliability of cylindrical Cu pillar SnAg 3.0Cu0.5 bumps

    Meinshausen, L., Weide-Zaage, K., Goldbeck, B., Moujbani, A., Kludt, J. & Fremont, H., 2014, 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014. IEEE Computer Society, 6813775. (2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  12. Published

    Reliability performance of different layouts of wide metal tracks

    Kludt, J., Weide-Zaage, K., Ackermann, M., Kovacs, C. & Hein, V., 2014, 2014 IEEE International Reliability Physics Symposium, IRPS 2014. Institute of Electrical and Electronics Engineers Inc., p. IT.4.1-IT.4.4 6861153. (IEEE International Reliability Physics Symposium Proceedings).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  13. Published

    Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core

    Weide-Zaage, K., Schlobohm, J., Rongen, R. T. H., Voogt, F. C. & Roucou, R., 2014, In: Microelectronics reliability. 54, 6-7, p. 1206-1211 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  14. Published

    Simulation in 3D integration and TSV

    Weide-Zaage, K., Moujbani, A. & Kludt, J., 2014, 2014 IEEE 5th Latin American Symposium on Circuits and Systems, LASCAS 2014 - Conference Proceedings. IEEE Computer Society, 6820324

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  15. 2013
  16. Published

    Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects

    Moujbani, A., Kludt, J., Weide-Zaage, K., Ackermann, M., Hein, V. & Meinshausen, L., Sept 2013, In: Microelectronics reliability. 53, 9-11, p. 1365-1369 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  17. Published

    Dynamic simulation of octahedron slotted metal structures

    Kludt, J., Weide-Zaage, K., Ackermann, M. & Hein, V., Sept 2013, In: Microelectronics reliability. 53, 9-11, p. 1606-1610 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  18. Published

    Electro- and thermomigration-induced IMC formation in SnAg 3.0Cu0.5 solder joints on nickel gold pads

    Meinshausen, L., Frémont, H., Weide-Zaage, K. & Plano, B., Sept 2013, In: Microelectronics reliability. 53, 9-11, p. 1575-1580 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  19. Published

    Characterization of a new designed octahedron slotted metal track by simulations

    Kludt, J., Weide-Zaage, K., Ackermann, M. & Hein, V., 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 6529907. (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  20. Published

    Deformation of octahedron slotted metal tracks

    Kludt, J., Weide-Zaage, K., Ackermann, M. & Hein, V., 2013, 2013 IEEE International Integrated Reliability Workshop Final Report, IIRW 2013. Institute of Electrical and Electronics Engineers Inc., p. 161-165 5 p. 6804184. (IEEE International Integrated Reliability Workshop Final Report).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  21. Published

    Influence of contact geometry variations on the lifetime distribution of IC packages during electromigration testing

    Meinshausen, L., Weide-Zaage, K. & Frémont, H., 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 6529895. (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  22. Published

    Investigation of temperature gradients with regard to thermomigration in aluminium metallizations

    Kludt, J., Weide-Zaage, K., Ackermann, M. & Hein, V., 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 6529896. (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  23. Published

    Overlap design for higher tungsten via robustness in AlCu metallizations

    Kludt, J., Weide-Zaage, K., Ackermann, M. & Hein, V., 2013, 2013 IEEE International Integrated Reliability Workshop Final Report, IIRW 2013. Institute of Electrical and Electronics Engineers Inc., p. 137-141 5 p. 6804178. (IEEE International Integrated Reliability Workshop Final Report).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

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