Profile information

apl. Prof. Dr.-Ing. Dipl.-Phys.  Kirsten Weide-Zaage

https://orcid.org/0000-0003-3438-210X
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Publications

  1. 2018
  2. Published

    'New automotive' - Considerations for reliability, robustness and resilience for CMOS interconnects

    Weide-Zaage, K., Fremont, H. & Hein, V., 15 Mar 2018, 2018 Pan Pacific Microelectronics Symposium, Pan Pacific 2018. Institute of Electrical and Electronics Engineers Inc., p. 1-6 6 p. (2018 Pan Pacific Microelectronics Symposium, Pan Pacific 2018; vol. 2018-January).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  3. Published

    Process, geometry and stack related reliability of thick ALCU-metal-tracks

    Weide-Zaage, K. & Hein, V., 15 Mar 2018, 2018 Pan Pacific Microelectronics Symposium, Pan Pacific 2018. Institute of Electrical and Electronics Engineers Inc., p. 1-7 7 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  4. Published

    Electromigration and morphological changes in Ag nanostructures

    Chatterjee, A., Bai, T., Edler, F., Tegenkamp, C., Weide-Zaage, K. & Pfnür, H., 31 Jan 2018, In: Journal of Physics Condensed Matter. 30, 8, 084002.

    Research output: Contribution to journal › Article › Research › peer review

  5. 2017
  6. Published

    Simulation of packaging under harsh environment conditions (temperature, pressure, corrosion and radiation)

    Weide-Zaage, K., Sept 2017, In: Microelectronics reliability. 76-77, p. 6-12 7 p.

    Research output: Contribution to journal › Article › Research › peer review

  7. Published

    Differences in reliability effects for thick copper and thick aluminium metallizations

    Pohl, M., Erstling, M., Hein, V., Weide-Zaage, K. & Chen, T., 30 May 2017, 2017 International Reliability Physics Symposium, IRPS 2017. Institute of Electrical and Electronics Engineers Inc., p. MR2.1-MR2.7 7936377. (IEEE International Reliability Physics Symposium Proceedings).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  8. Published

    Simulation investigations for the comparison of standard and highly robust AlCu thick metal tracks

    Sethu, R. S., Hein, V., Erstling, M. & Weide-Zaage, K., 10 May 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Institute of Electrical and Electronics Engineers Inc., 7926226

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  9. Published

    COTS-radiation effects approaches and considerations

    Weide-Zaage, K., Eichin, P., Chen, C., Zhao, Y. & Zhao, L., 21 Feb 2017, 2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017. Institute of Electrical and Electronics Engineers Inc., 7859581. (2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  10. Published

    COTS - Harsh condition effects considerations from technology to user level

    Weide-Zaage, K. & Payá-Vayá, G., 2017, In: Advances in Science, Technology and Engineering Systems. 2, 3, p. 1592-1598 7 p.

    Research output: Contribution to journal › Article › Research › peer review

  11. Published

    Study of Corrosion in BGA solder balls

    Weide-Zaage, K., Fremont, H., Guedon-Gracia, A., Feng, Y. & Chen, A., 2017.

    Research output: Contribution to conference › Paper › Research › peer review

  12. 2016
  13. Published

    Preface

    Chrzanowska-Jeske, M. & Weide-Zaage, K., 25 Nov 2016, Semiconductor Devices in Harsh Conditions. p. xiii-xvii

    Research output: Chapter in book/report/conference proceeding › Foreword/postscript › Research › peer review

  14. Published

    Semiconductor devices in harsh conditions

    Weide-Zaage, K. & Chrzanowska-Jeske, M., 25 Nov 2016, 234 p.

    Research output: Book/Report › Monograph › Research › peer review

  15. Published

    Effects of salt spray test on lead-free solder alloy

    Guédon-Gracia, A., Frémont, H., Plano, B., Delétage, J. Y. & Weide-Zaage, K., 1 Sept 2016, In: Microelectronics reliability. 64, p. 242-247 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  16. Published

    Reliability evaluation of tungsten donut-via as an element of the highly robust metallization

    Hein, V., Erstling, M., Sethu, R. S., Weide-Zaage, K. & Bai, T., 1 Sept 2016, In: Microelectronics reliability. 64, p. 259-265 7 p.

    Research output: Contribution to journal › Article › Research › peer review

  17. Published

    Thermal-electric-mechanical simulation of a multilevel metallization system

    Liu, Y. & Weide-Zaage, K., 29 Apr 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016. Institute of Electrical and Electronics Engineers Inc., 7463354

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  18. Published

    A design for highly robust ALCU-W-PLUG-metallization stack

    Hein, V., Ackermann, M., Erstling, M., Liew, J. & Weide-Zaage, K., 7 Mar 2016, 2016 Pan Pacific Microelectronics Symposium, Pan Pacific 2016. Institute of Electrical and Electronics Engineers Inc., 7428423

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  19. Published

    Corrosion study on BGA assemblies

    Guedon-Gracia, A., Fremont, H., Deletage, J. Y. & Weide-Zaage, K., 7 Mar 2016, 2016 Pan Pacific Microelectronics Symposium, Pan Pacific 2016. Institute of Electrical and Electronics Engineers Inc., 7428402

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  20. Published

    Simulation of needle bumps in a package-on-package structure

    Weide-Zaage, K. & Xu, P., 2016, IMAPS Nordic Annual Conference 2016 Proceedings. Kutilainen, J. (ed.). IMAPS-International Microelectronics and Packaging Society, (IMAPS Nordic Annual Conference 2016 Proceedings).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  21. 2015
  22. Published

    How SI/EMC and reliability issues could interact together in embedded electronic systems?

    Weide-Zaage, K., Moujbani, A., Duchamp, G., Dubois, T., Verdier, F. & Fremont, H., 10 Sept 2015, 2015 IEEE International Symposium on Electromagnetic Compatibility, EMC 2015. Institute of Electrical and Electronics Engineers Inc., p. 1323-1328 6 p. 7256363. (IEEE International Symposium on Electromagnetic Compatibility; vol. 2015-Septmber).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  23. Published

    Dynamical IMC-growth calculation

    Meinshausen, L., Weide-Zaage, K. & Frémont, H., Aug 2015, In: Microelectronics reliability. 55, 9-10, p. 1832-1837 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  24. Published

    Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys

    Sabri, M. F. M., Nordin, N. I. M., Said, S. M., Amin, N. A. A. M., Arof, H., Jauhari, I., Ramli, R. & Weide-Zaage, K., Aug 2015, In: Microelectronics reliability. 55, 9-10, p. 1882-1885 4 p.

    Research output: Contribution to journal › Article › Research › peer review

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