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Folke Dencker

https://orcid.org/0000-0002-9917-0565
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Publications

  1. 2024

  2. Published

    Polymer-Free Batch Production and Application of Metal Foil-Based Thin-Film Strain Gauges

    Ottermann, R., Müller, E., Keßler, M., Dencker, F., Klaas, D. & Wurz, M. C., 20 Oct 2024, 2024 IEEE Sensors, SENSORS 2024 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., (Proceedings of IEEE Sensors).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  3. Published

    Waveguides Written by Femtosecond Laser in CVD Diamonds

    Perevoznik, D., Locmelis, J., Zuber, D., Glukhovskoy, A., Afentaki, A., Hinkelmann, M., Dencker, F., Wurz, M. & Morgner, U., 18 Oct 2024, In: EPJ Web of Conferences. 307, 2 p., 02034.

    Research output: Contribution to journal › Conference article › Research › peer review

  4. Published

    Miniaturized Rubidium Source for Generating Vapor Phase Atoms for Magneto Optical Traps

    Koch, J., Diekmann, L. F., Kassner, A., Dencker, F. & Wurz, M. C., 15 Jul 2024, 2024 37th International Vacuum Nanoelectronics Conference, IVNC 2024. Institute of Electrical and Electronics Engineers Inc., (International Vacuum Nanoelectronics Conference).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  5. E-pub ahead of print

    Design and Manufacture of Face Grinding Wheels with Micro-Structured Channels

    Steinhoff, L., Tubbe, E., Dencker, F., Denmark, T., Kausch, L. & Wurz, M. C., 11 Jun 2024, (E-pub ahead of print) 24th International Conference & Exhibition.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  6. Published

    Modification of glass by a laser for the use in micro-electric systems and quantum devices

    Keinert, L., Koch, J. (Contributor), Künzler, C. (Contributor), Dehning, K. J. (Contributor), Kassner, A. (Contributor), Dencker, F. (Contributor), Zimmermann, S. (Contributor) & Wurz, M. (Contributor), 11 Mar 2024, Book of abstracts for the EQTC 2023. Schnitger, A., Husemann, R. & Liebisch, T. (eds.). Hannover, p. 91

    Research output: Chapter in book/report/conference proceeding › Conference abstract › Research

  7. Published

    Femtosecond Laser Written Waveguides in CVD Diamonds

    Perevoznik, D., Locmelis, J., Zuber, D., Glukhovskoy, A., Afentaki, A., Hinkelmann, M., Dencker, F., Wurz, M. & Morgner, U., 2024.

    Research output: Contribution to conference › Paper › Research › peer review

  8. Published

    Glass-Extraction Electrode for Field Emission Applications

    Buchta, A. M., Kassner, A., Dencker, F. & Wurz, M. C., 2024, 2024 37th International Vacuum Nanoelectronics Conference (IVNC). (International Vacuum Nanoelectronics Conference proceedings).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  9. Published

    Manufacturing and Characterization of Planar Transformers as Molded Interconnect Device Technology Component for an Industrial Production

    Bierwirth, T. N., Bengsch, S., Werner, M., Wachs, R., Henne, C., Bur, S., Dencker, F. & Wurz, M. C., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 2172-2177 6 p. (Proceedings - Electronic Components and Technology Conference).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  10. Published

    Silicon-based membrane pressure sensor for inline monitoring of pressure and hermeticity of small-volume bonded packages

    Koch, J., Brinkmann, L. M., Kassner, A., Dencker, F. & Wurz, M. C., 2024, 2024 IEEE 74th Electronic Components and Technology Conference : (ECTC). Institute of Electrical and Electronics Engineers Inc., p. 193-200 8 p. (Proceedings - Electronic Components and Technology Conference).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  11. 2023

  12. Published

    Manufacturing of a Reluctance Actuator for Use as a Hearing Implant in the Middle Ear

    Müller, E., Adamscheck, M., Fischer, E. C., Glukhovskoy, A., Prediger, M. S., Dencker, F. & Wurz, M., 23 Nov 2023, MikroSystemTechnik Kongress 2023.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  13. Published

    Fabrication Method and Characterization of Molded Interconnect Device Micro Transformer in Planar Form by Embedding Sintered Ferrite Cores

    Bierwirth, T. N., Fischer, E. C., Prediger, M. S., Le, T. M., Dencker, F. & Wurz, M. C., Oct 2023, MikroSystemTechnik Kongress 2023: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 599-604 6 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research

  14. Published

    Detailed characterisation of batch-manufactured flexible micro-grinding tools for electrochemical assisted grinding of copper surfaces

    Steinhoff, L., Ottermann, R., Dencker, F. & Wurz, M. C., Sept 2023, In: The International Journal of Advanced Manufacturing Technology. 128, 5-6, p. 2301-2310 10 p.

    Research output: Contribution to journal › Article › Research › peer review

  15. Published

    Direct Sensor Integration on the Raceway of Roller Bearings

    Pape, F., Konopka, D., Coors, T., Poll, G., Steppeler, T., Ottermann, R., Dencker, F. & Wurz, M., Sept 2023, 9 p.

    Research output: Book/Report › Conference proceeding › Research

  16. Published

    Characterization of the tribologically relevant cover layers formed on copper in oxygen and oxygen-free conditions

    Raumel, S., Barienti, K., Luu, H. T., Merkert, N., Dencker, F., Nürnberger, F., Maier, H. J. & Wurz, M. C., Aug 2023, In: Friction. 11, 8, p. 1505–1521 17 p.

    Research output: Contribution to journal › Article › Research › peer review

  17. Published

    Novel Glass-Silicon Emitter Chip for Field Emission Applications

    Buchta, A. M., Kassner, A., Voß, J., Leopold, T., Petring, J., Diekmann, L., Dencker, F. & Wurz, M. C., 27 Jul 2023, 2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC). p. 207-209 3 p. ( International Vacuum Nanoelectronics Conference).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  18. Published

    Soliton compression and supercontinuum spectra in nonlinear diamond photonics

    Melchert, O., Kinnewig, S., Dencker, F., Perevoznik, D., Willms, S., Babushkin, I., Wurz, M., Kues, M., Beuchler, S., Wick, T., Morgner, U. & Demircan, A., Jun 2023, In: Diamond and Related Materials. 136, 109939.

    Research output: Contribution to journal › Article › Research › peer review

  19. Published

    Influence of Microscale Tin Particles on Mechanical Properties of Silver Sintering Joints with Reduced Processing Parameters

    Hadeler, S., Long, Y., Ottermann, R., Dencker, F., Twiefel, J. & Wurz, M. C., May 2023, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC): Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 676-681 6 p. (Proceedings - Electronic Components Conference).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  20. Published

    Application of batch manufactured flexible micro-grinding tools on copper and oxidized copper surfaces

    Steinhoff, L., Dencker, F. & Wurz, M. C., 27 Mar 2023, In: Tribologie und Schmierungstechnik. 70, 1, p. 5-10 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  21. Published

    Detection of joining mechanisms at different locations of the wire/substrate interface during ultrasonic wire bonding via a PZT-based sensor array

    Long, Y., Arndt, M., Sun, C., Dencker, F., Wurz, M. & Twiefel, J., Mar 2023, In: Journal of Materials Processing Technology. 312, 117826.

    Research output: Contribution to journal › Article › Research › peer review

  22. Published

    Process Development for Batch Production of Micro-Milling Tools Made of Silicon Carbide by Means of the Dry Etching Process

    Wittek, C. R., Steinhoff, L., Raumel, S., Reißfelder, M., Dencker, F. & Wurz, M. C., 28 Feb 2023, In: Micromachines. 14, 3, 580.

    Research output: Contribution to journal › Article › Research › peer review

  23. Published

    Monitoring of the Flange Draw-In During Deep Drawing Processes Using a Thin-Film Inductive Sensor

    Fünfkirchler, T., Arndt, M., Hübner, S., Dencker, F., Wurz, M. C. & Behrens, B. A., 2 Feb 2023, Lecture Notes in Production Engineering. Springer Nature, p. 111-121 11 p. (Lecture Notes in Production Engineering; vol. Part F1163).

    Research output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research › peer review

  24. Published

    Advancements in monitoring of tribological stress in bearings using thin-film strain gauges

    Konopka, D., Steppeler, T., Ottermann, R., Pape, F., Dencker, F., Poll, G. & Wurz, M., 2023, p. 1623-1634.

    Research output: Contribution to conference › Paper › Research › peer review

  25. Published

    Force sensing linear rolling guides based on modified metal strain gauges

    Denkena, B., Klemme, H., Kowalke, D., Korbacher, M., Ottermann, R., Dencker, F. & Wurz, M., 2023, European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 23rd International Conference and Exhibition, EUSPEN 2023. Riemer, O., Nisbet, C. & Phillips, D. (eds.). p. 207-210 4 p. (European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 23rd International Conference and Exhibition, EUSPEN 2023).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  26. Published

    Influence of oxide layers on the mechanical properties of copper

    Raumel, S., Wolf, A., Dencker, F. & Wurz, M., 2023, Tagungsband, 5. Symposium Materialtechnik : Fortschrittbericht der Materialforschung und Werkstofftechnik . p. 149-159 (Fortschrittsberichte der Materialforschung und Werkstofftechnik; vol. 12).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  27. Published

    Manufacturing and Characterization of Piezoelectric Force Sensor Arrays for Investigation of Ultrasonic Wire Bonding

    Arndt, M., Long, Y., Hu, C., Dencker, F., Twiefel, J. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 462-465 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  28. Published

    Microtechnological Production of Integrated Optical Gratings Using Laser Beam Lithography for Atomic Interferometers

    de Wall, S., Kassner, A., Dencker, F. & Wurz, M., 2023, Tagungsband MikroSystemTechnik Kongress 2023. 3 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research

  29. Published

    Miniaturized quantum systems for inertial measurement units

    Kassner, A., Diekmann, L., Künzler, C., Petring, J., Droese, N., Dencker, F., Heine, H., Abend, S., Gersemann, M., Rasel, E. M., Herr, W., Schubert, C. & Wurz, M. C., 2023, 2023 DGON Inertial Sensors and Systems (ISS). Hecker, P. (ed.). (International Symposium on Inertial Sensors and Systems).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  30. Published

    Setup of an ultra-high vacuum bonder for the encapsulation of quantum systems

    Droese, N., Petring, J., Hadeler, S., Kassner, A., Dencker, F. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 763-766 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  31. Published

    Simulation-based Design of a Magnetostrictive Middle Ear Actuator

    Adamscheck, M., Fischer, E., Müller, E., Glukhovskoy, A., Prediger, M. S., Dencker, F. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 503-508 6 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  32. Published

    Simulation, Manufacturing and Evaluation of a Transformer Eddy-Current Sensor for Deep-Drawing Processes

    Kamrani, S., Ottermann, R., Dencker, F. & Wurz, M., 2023, SMSI 2023. p. 284 -285

    Research output: Chapter in book/report/conference proceeding › Other contribution in a book, report, anthology or conference proceeding › Research

  33. 2022

  34. Published

    Degeneration Effects of Thin-Film Sensors after Critical Load Conditions of Machine Components

    Ottermann, R., Steppeler, T., Dencker, F. & Wurz, M. C., 27 Sept 2022, In: Machines. 10, 10, 15 p., 870.

    Research output: Contribution to journal › Article › Research › peer review

  35. Published

    Fabrication of a Low Profile Planar Transformer Using Molded Interconnect Device Technology

    Bierwirth, T. N., Dencker, F., Fischer, E. C. & Wurz, M. C., Sept 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 129-133 5 p. (2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research

  36. Published

    Impact of surface texture on ultrasonic wire bonding process

    Long, Y., Arndt, M., Dencker, F., Wurz, M., Twiefel, J. & Wallaschek, J., Sept 2022, In: Journal of Materials Research and Technology. 20, p. 1828-1838 11 p.

    Research output: Contribution to journal › Article › Research › peer review

  37. Published

    Nonevaporable getter-MEMS for generating UHV conditions in small volumina

    Diekmann, L. F., Kassner, A., Dencker, F. & Wurz, M. C., Sept 2022, In: Journal of Vacuum Science and Technology B. 40, 5, 054202.

    Research output: Contribution to journal › Article › Research › peer review

  38. Published

    High temperature nanoindentation of iron: Experimental and computational study

    Khvan, T., Noels, L., Terentyev, D., Dencker, F., Stauffer, D., Hangen, U. D., Van Renterghem, W., Cheng, C. & Zinovev, A., 15 Aug 2022, In: Journal of nuclear materials. 567, 153815.

    Research output: Contribution to journal › Article › Research › peer review

  39. Published

    Nanoindentation in alumina coated Al: Molecular dynamics simulations and experiments

    Luu, H. T., Raumel, S., Dencker, F., Wurz, M. & Merkert, N., 15 May 2022, In: Surface and Coatings Technology. 437, 128342.

    Research output: Contribution to journal › Article › Research › peer review

  40. Published

    Residual Stresses from Incremental Hole Drilling Using Directly Deposited Thin Film Strain Gauges

    Heikebrügge, S., Ottermann, R., Breidenstein, B., Wurz, M. C. & Dencker, F., Apr 2022, In: Experimental mechanics. 62, 4, p. 701-713 13 p.

    Research output: Contribution to journal › Article › Research › peer review

  41. Published

    Approaches for a Solely Electroless Metallization of Through-Glass Vias

    Zawacka, A. M., Prediger, M. S., Kassner, A., Dencker, F. E. & Wurz, M., 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). p. 889-897 9 p. (Proceedings - Electronic Components and Technology Conference; vol. 2022-May).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  42. Published

    In Situ Resistance Trimming of Directly Deposited Thin-Film Strain Gauges

    Ottermann, R., Zhang, S., Denkena, B., Klemme, H., Kowalke, D., Korbacher, M., Dencker, F. & Wurz, M. C., 2022, 2022 IEEE Sensors, SENSORS 2022 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., (Proceedings of IEEE Sensors; vol. 2022-October).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  43. Published

    Production and characterisation of batch manufactured flexible micro-grinding tools for finishing metallic surfaces

    Steinhoff, L., Dencker, F. & Wurz, M. C., 2022, European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 22nd International Conference and Exhibition, EUSPEN 2022. Leach, R. K., Akrofi-Ayesu, A., Nisbet, C. & Phillips, D. (eds.). p. 77-80 4 p. (European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 22nd International Conference and Exhibition, EUSPEN 2022).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  44. 2021

  45. Published

    Werkzeugmaschinen werden intelligent

    Klaproth, M. S., Denkena, B., Bergmann, B., Ottermann, R., Dencker, F. & Wurz, M., 27 Oct 2021, Werkzeugmaschinen.

    Research output: Contribution to specialist publication › Contribution in non-scientific journal › Transfer

  46. Published

    Einfluss von Silan-dotierten Umgebungsatmosphären auf tribologischen Eigenschaften von Titan

    Raumel, S., Barienti, K., Dencker, F., Nuernberger, F. & Wurz, M., 22 Mar 2021, In: Tribologie und Schmierungstechnik. 68, 1, p. 5-13 9 p.

    Research output: Contribution to journal › Article › Research › peer review

  47. Published

    Verfahren zur Herstellung von Diamantspitzen

    Dencker, F. (Inventor), Wurz, M. C. (Inventor) & Maier, H. J. (Inventor), 4 Mar 2021, IPC No. G01Q 70/ 16 A I, Patent No. DE102019213043, Priority date 29 Aug 2019, Priority No. DE201910213043

    Research output: Patent

  48. Published

    Einfluss von Silan-dotierten Umgebungsatmosphären auf tribologischen Eigenschaften von Titan

    Raumel, S., Barienti, K., Dencker, F., Nürnberger, F. & Wurz, M. C., Mar 2021, In: Tribologie und Schmierungstechnik. 68, 1, p. 5-13 9 p.

    Research output: Contribution to journal › Article › Research › peer review

  49. Published

    Sensorbauteil, Halbzeug, Verfahren zur Anbringung und zur Herstellung eines Sensorbauteils

    Dencker, F. (Inventor), Wurz, M. C. (Inventor), Maier, H. J. (Inventor), Ottermann, R. (Inventor), Kassner, A. (Inventor) & Klaas, D. (Inventor), 25 Feb 2021, IPC No. G01N 27/ 04 A I, Patent No. DE102019122623, Priority date 22 Aug 2019, Priority No. DE201910122623

    Research output: Patent

  50. Published

    Anisotropic Magneto-Resistive Sensor Effect based Sensor using Daisy Chain on Polyether Ether Ketone Substrate

    De Wall, S., Bengsch, S., Fischer, E., Dencker, F. & Wurz, M. C., 2021, 2021 IEEE Sensors. Institute of Electrical and Electronics Engineers Inc., (Proceedings of IEEE Sensors; vol. 2021-October).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  51. Published

    Directly Deposited Thin-Film Strain Gauges on Curved Metallic Surfaces

    Ottermann, R., Klaas, D., Dencker, F., Hoheisel, D., Jung, S., Wienke, A., Dusing, J. F., Koch, J. & Wurz, M. C., 2021, 2021 IEEE Sensors, SENSORS 2021 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., (Proceedings of IEEE Sensors; vol. 2021-October).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  52. Published

    Direktabgeschiedene Dünnfilm-Dehnungsmessstreifen für erhöhte Temperaturen

    Ottermann, R., Klaas, D., Dencker, F. E., Hoheisel, D., Rottengatter, P., Kruspe, T., Jung, S. & Wurz, M., 2021, MikroSystemTechnik Kongress 2021: Proceedings. Berlin: VDE Verlag GmbH, p. 315-316 2 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  53. Published

    Direktabgeschiedene Dünnfilmsensorik mithilfe einer neuartigen Beschichtungsanlage

    Ottermann, R., Klaas, D., Dencker, F. E. & Wurz, M., 2021, 27. NDVaK-Kolloquium. Dresden

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research

  54. Published

    Fabrication of a Low Profile Planar Transformer Using a Dual PCB Approach

    Fischer, E. C., Bierwirth, T. N., Dencker, F. & Wurz, M. C., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 483-486 4 p. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research

  55. Published

    Investigation of tribologically relevant surface layers formed on non-ferrous metals in oxygen-free conditions

    Raumel, S., Dencker, F. & Wurz, M., 2021.

    Research output: Contribution to conference › Abstract › Research

  56. Published

    Investigations on Silver Sintering using an Ultrasonic Transient Liquid Phase Sintering Process

    Hadeler, S., Seefisch, H., Ottermann, R., Long, Y., Dencker, F., Wurz, M. C. & Twiefel, J., 2021, 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). Institute of Electrical and Electronics Engineers Inc., p. 288-291 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  57. Published

    Mikrotechnologische Fertigung von integrierten optischen Gittern mittels Lift-Off-Prozess für den Einsatz in Atominterferometern

    de Wall, S., Kassner, A., Dencker, F., Künzler, C., Diekmann, L. & Würz, M. C., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 466-468 3 p. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  58. Published

    Simulationsgestützte Auslegung und Fertigung von piezoelektrischen Kraftsensor-Arrays zur Untersuchung des Ultraschall-Drahtbondprozesses

    Arndt, M., Wurz, M. C., Dencker, F., Long, Y. & Twiefel, J., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 742-745 4 p. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  59. 2020

  60. Published

    Development, characterisation and high-temperature suitability of thin-film strain gauges directly deposited with a new sputter coating system

    Klaas, D., Ottermann, R., Dencker, F. & Wurz, M. C., 10 Jun 2020, In: Sensors (Switzerland). 20, 11, p. 1-15 15 p., 3294.

    Research output: Contribution to journal › Article › Research › peer review

  61. Published

    Direct Deposition of Thin-Film Strain Gauges with a New Coating System for Elevated Temperatures

    Ottermann, R., Klaas, D., Dencker, F., Wurz, M. C., Hoheisel, D., Rottengatter, P. & Kruspe, T., 2020, IEEE Sensors, SENSORS 2020: Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 9278661

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  62. Published

    Mikrotechnologische Fertigung von integrierten optischen Gittern für den Einsatz in Atominterferometern

    de Wall, S., Kassner, A., Dencker, F., Künzler, C., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M. & Wurz, M. C., 2020, GMM-Fb. 97: Mikro-Nano-Integration. Berlin: VDE Verlag GmbH, p. 56-59 4 p. (GMM-Fachberichte).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  63. Published

    Novel Piezoelectric Force Sensor Array for Investigation of Ultrasonic Wire Bonding

    Arndt, M., Long, Y., Dencker, F., Reimann, J., Twiefel, J. & Wurz, M. C., 2020, Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 276-283 8 p. 9159495. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  64. 2019

  65. Published

    Novel Eddy-Current Sensor for Industrial Deep-Drawing Applications

    Arndt, M., Dencker, F. & Wurz, M. C., Oct 2019, 2019 IEEE Sensors, SENSORS 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 4 p. 8956948. (Proceedings of IEEE Sensors; vol. 2019-October).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  66. Published

    Atomchips mit integrierten optischen Gittern zur Erzeugung von Bose-Einstein-Kondensaten

    Kassner, A., Dencker, F., Künzler, C., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M. & Wurz, M., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 541-544 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  67. Published

    Simulationsgestützte Auslegung und Fertigung von werkzeugintegrierten induktiven Sensoren

    Arndt, M., Dencker, F. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 673-676 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  68. 2018

  69. Published

    Revealing of ultrasonic wire bonding mechanisms via metal-glass bonding

    Long, Y., Dencker, F., Isaak, A., Li, C., Schneider, F., Hermsdorf, J., Wurz, M., Twiefel, J. & Wallaschek, J., Oct 2018, In: Materials Science and Engineering B: Solid-State Materials for Advanced Technology. 236-237, p. 189-196 8 p.

    Research output: Contribution to journal › Article › Research › peer review

  70. Published

    Self-cleaning mechanisms in ultrasonic bonding of Al wire

    Long, Y., Dencker, F., Isaak, A., Hermsdorf, J., Wurz, M. & Twiefel, J., Aug 2018, In: Journal of Materials Processing Technology. 258, p. 58-66 9 p.

    Research output: Contribution to journal › Article › Research › peer review

  71. 2017

  72. Published

    Analysis of the Wire/Substrate Interface during Ultrasonic Bonding Process

    Long, Y., Dencker, F., Isaak, A., Li, C., Wurz, M., Twiefel, J., Wallaschek, J., Schneider, F. & Hermsdorf, J., 28 Dec 2017, 2017 IEEE CPMT Symposium Japan (ICSJ). Institute of Electrical and Electronics Engineers Inc., p. 203-206 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  73. Published

    Klimt artwork: red-pigment material investigation by backscattering Fe-57 Mössbauer spectroscopy, SEM and p-XRF

    Lehmann, R., Wengerowsky, D., Schmidt, H. J., Kumar, M., Niebur, A., Costa, B. F. O., Dencker, F. E., Klingelhöfer, G., Sindelar, R. & Renz, F., 15 Dec 2017, In: Science and Technology of Archaeological Research. 3, 2, p. 450-455 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  74. Published

    A silicone fiber coating as approach for the reduction of fibroblast growth on implant electrodes

    Dencker, F., Dreyer, L., Müller, D., Zernetsch, H., Paasche, G., Sindelar, R. & Glasmacher, B., Nov 2017, In: Journal of Biomedical Materials Research - Part B Applied Biomaterials. 105, 8, p. 2574-2580 7 p.

    Research output: Contribution to journal › Article › Research › peer review

  75. Published

    Kohlenstofffaser mit hoher Leitfähigkeit und Herstellungsverfahren hierfür

    Renz, F. (Inventor), Sindelar, R. (Inventor), Tegenkamp, C. (Inventor), Dreyer, B. (Inventor), Unruh, D. (Inventor) & Dencker, F. (Inventor), 21 Sept 2017, IPC No. D01D 5/ 00 A I, Patent No. WO2017158140, Priority date 18 Mar 2016, Priority No. DE201610105059

    Research output: Patent

  76. Published

    Visualization of oxide removal during ultrasonic wire bonding process

    Long, Y., Dencker, F., Isaak, A., Schneider, F., Hermsdorf, J., Wurz, M. & Twiefel, J., 2 Jul 2017, 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-4 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  77. Published

    Investigations on the oxide removal mechanism during ultrasonic wedge-wedge bonding process

    Long, Y., Dencker, F., Schneider, F., Emde, B., Li, C., Hermsdorf, J., Wurz, M. C. & Twiefel, J., 21 Feb 2017, Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Institute of Electrical and Electronics Engineers Inc., p. 405-410 6 p. 7861512

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  78. Published

    Electrical feed through for tool integrated high temperature applications

    Dencker, F., Kolodziejczyk, F. & Wurz, M. C., 2017, International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017. p. 50-56 7 p. (International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  79. Published

    Hot stamping process reliability – Innovative sensor technology for inline quality assurance

    Wurz, M. C., Behrens, B., Hübner, S., Moritz, J., Pfeffer, C., Wölki, K., Dencker, F., Wolter, B., Niemeyer, H. & Müller, T., 2017, Conference Strategies in Car Body Engineering.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research

  80. Published

    Press hardening tool integrated thin film temperature sensor

    Dencker, F., Schlenkrich, A. & Wurz, M. C., 2017, Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017. p. 349-350 2 p. (Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  81. 2016

  82. Published

    Klimt artwork (Part II): material investigation by backscattering Fe-57 Mössbauer- and Raman- spectroscopy, SEM and p-XRF

    Costa, B. F. O., Lehmann, R., Wengerowsky, D., Blumers, M., Sansano, A., Rull, F., Schmidt, H. J., Dencker, F., Niebur, A., Klingelhöfer, G., Sindelar, R. & Renz, F., Dec 2016, In: Hyperfine Interactions. 237, 1, 13 p., 92.

    Research output: Contribution to journal › Article › Research › peer review

  83. Published

    An application report: Protective thin film layers for high temperature sensor technology

    Dencker, F., Wurz, M., Dubrovskiy, S. & Koroleva, E., 5 Apr 2016, Proceedings of the 2016 IEEE North West Russia Section Young Researchers in Electrical and Electronic Engineering Conference, EIConRusNW 2016. Shaposhnikov, S. (ed.). Institute of Electrical and Electronics Engineers Inc., p. 32-36 5 p. 7448110

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review