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Folke Dencker

https://orcid.org/0000-0002-9917-0565
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Publications

  1. 2016

  2. Published

    An application report: Protective thin film layers for high temperature sensor technology

    Dencker, F., Wurz, M., Dubrovskiy, S. & Koroleva, E., 5 Apr 2016, Proceedings of the 2016 IEEE North West Russia Section Young Researchers in Electrical and Electronic Engineering Conference, EIConRusNW 2016. Shaposhnikov, S. (ed.). Institute of Electrical and Electronics Engineers Inc., p. 32-36 5 p. 7448110

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  3. Published

    Klimt artwork (Part II): material investigation by backscattering Fe-57 Mössbauer- and Raman- spectroscopy, SEM and p-XRF

    Costa, B. F. O., Lehmann, R., Wengerowsky, D., Blumers, M., Sansano, A., Rull, F., Schmidt, H. J., Dencker, F., Niebur, A., Klingelhöfer, G., Sindelar, R. & Renz, F., Dec 2016, In: Hyperfine Interactions. 237, 1, 13 p., 92.

    Research output: Contribution to journal › Article › Research › peer review

  4. 2017

  5. Published

    Electrical feed through for tool integrated high temperature applications

    Dencker, F., Kolodziejczyk, F. & Wurz, M. C., 2017, International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017. p. 50-56 7 p. (International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  6. Published

    Hot stamping process reliability – Innovative sensor technology for inline quality assurance

    Wurz, M. C., Behrens, B., Hübner, S., Moritz, J., Pfeffer, C., Wölki, K., Dencker, F., Wolter, B., Niemeyer, H. & Müller, T., 2017, Conference Strategies in Car Body Engineering.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research

  7. Published

    Press hardening tool integrated thin film temperature sensor

    Dencker, F., Schlenkrich, A. & Wurz, M. C., 2017, Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017. p. 349-350 2 p. (Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  8. Published

    Investigations on the oxide removal mechanism during ultrasonic wedge-wedge bonding process

    Long, Y., Dencker, F., Schneider, F., Emde, B., Li, C., Hermsdorf, J., Wurz, M. C. & Twiefel, J., 21 Feb 2017, Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Institute of Electrical and Electronics Engineers Inc., p. 405-410 6 p. 7861512

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  9. Published

    Visualization of oxide removal during ultrasonic wire bonding process

    Long, Y., Dencker, F., Isaak, A., Schneider, F., Hermsdorf, J., Wurz, M. & Twiefel, J., 2 Jul 2017, 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-4 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  10. Published

    Kohlenstofffaser mit hoher Leitfähigkeit und Herstellungsverfahren hierfür

    Renz, F. (Inventor), Sindelar, R. (Inventor), Tegenkamp, C. (Inventor), Dreyer, B. (Inventor), Unruh, D. (Inventor) & Dencker, F. (Inventor), 21 Sept 2017, IPC No. D01D 5/ 00 A I, Patent No. WO2017158140, Priority date 18 Mar 2016, Priority No. DE201610105059

    Research output: Patent

  11. Published

    A silicone fiber coating as approach for the reduction of fibroblast growth on implant electrodes

    Dencker, F., Dreyer, L., Müller, D., Zernetsch, H., Paasche, G., Sindelar, R. & Glasmacher, B., Nov 2017, In: Journal of Biomedical Materials Research - Part B Applied Biomaterials. 105, 8, p. 2574-2580 7 p.

    Research output: Contribution to journal › Article › Research › peer review

  12. Published

    Klimt artwork: red-pigment material investigation by backscattering Fe-57 Mössbauer spectroscopy, SEM and p-XRF

    Lehmann, R., Wengerowsky, D., Schmidt, H. J., Kumar, M., Niebur, A., Costa, B. F. O., Dencker, F. E., Klingelhöfer, G., Sindelar, R. & Renz, F., 15 Dec 2017, In: Science and Technology of Archaeological Research. 3, 2, p. 450-455 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  13. Published

    Analysis of the Wire/Substrate Interface during Ultrasonic Bonding Process

    Long, Y., Dencker, F., Isaak, A., Li, C., Wurz, M., Twiefel, J., Wallaschek, J., Schneider, F. & Hermsdorf, J., 28 Dec 2017, 2017 IEEE CPMT Symposium Japan (ICSJ). Institute of Electrical and Electronics Engineers Inc., p. 203-206 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  14. 2018

  15. Published

    Self-cleaning mechanisms in ultrasonic bonding of Al wire

    Long, Y., Dencker, F., Isaak, A., Hermsdorf, J., Wurz, M. & Twiefel, J., Aug 2018, In: Journal of Materials Processing Technology. 258, p. 58-66 9 p.

    Research output: Contribution to journal › Article › Research › peer review

  16. Published

    Revealing of ultrasonic wire bonding mechanisms via metal-glass bonding

    Long, Y., Dencker, F., Isaak, A., Li, C., Schneider, F., Hermsdorf, J., Wurz, M., Twiefel, J. & Wallaschek, J., Oct 2018, In: Materials Science and Engineering B: Solid-State Materials for Advanced Technology. 236-237, p. 189-196 8 p.

    Research output: Contribution to journal › Article › Research › peer review

  17. 2019

  18. Published

    Atomchips mit integrierten optischen Gittern zur Erzeugung von Bose-Einstein-Kondensaten

    Kassner, A., Dencker, F., Künzler, C., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M. & Wurz, M., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 541-544 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  19. Published

    Simulationsgestützte Auslegung und Fertigung von werkzeugintegrierten induktiven Sensoren

    Arndt, M., Dencker, F. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 673-676 4 p.

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  20. Published

    Novel Eddy-Current Sensor for Industrial Deep-Drawing Applications

    Arndt, M., Dencker, F. & Wurz, M. C., Oct 2019, 2019 IEEE Sensors, SENSORS 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 4 p. 8956948. (Proceedings of IEEE Sensors; vol. 2019-October).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  21. 2020

  22. Published

    Direct Deposition of Thin-Film Strain Gauges with a New Coating System for Elevated Temperatures

    Ottermann, R., Klaas, D., Dencker, F., Wurz, M. C., Hoheisel, D., Rottengatter, P. & Kruspe, T., 2020, IEEE Sensors, SENSORS 2020: Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 9278661

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  23. Published

    Mikrotechnologische Fertigung von integrierten optischen Gittern für den Einsatz in Atominterferometern

    de Wall, S., Kassner, A., Dencker, F., Künzler, C., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M. & Wurz, M. C., 2020, GMM-Fb. 97: Mikro-Nano-Integration. Berlin: VDE Verlag GmbH, p. 56-59 4 p. (GMM-Fachberichte).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  24. Published

    Novel Piezoelectric Force Sensor Array for Investigation of Ultrasonic Wire Bonding

    Arndt, M., Long, Y., Dencker, F., Reimann, J., Twiefel, J. & Wurz, M. C., 2020, Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 276-283 8 p. 9159495. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  25. Published

    Development, characterisation and high-temperature suitability of thin-film strain gauges directly deposited with a new sputter coating system

    Klaas, D., Ottermann, R., Dencker, F. & Wurz, M. C., 10 Jun 2020, In: Sensors (Switzerland). 20, 11, p. 1-15 15 p., 3294.

    Research output: Contribution to journal › Article › Research › peer review

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