Folke Dencker - Publications | Research@Leibniz University

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Publications

Published
Simulation-based Design of a Magnetostrictive Middle Ear Actuator
Adamscheck, M., Fischer, E., Müller, E., Glukhovskoy, A., Prediger, M. S., Dencker, F. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 503-508 6 p.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Published
Novel Piezoelectric Force Sensor Array for Investigation of Ultrasonic Wire Bonding
Arndt, M., Long, Y., Dencker, F., Reimann, J., Twiefel, J. & Wurz, M. C., 2020, Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 276-283 8 p. 9159495. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Published
Novel Eddy-Current Sensor for Industrial Deep-Drawing Applications
Arndt, M., Dencker, F. & Wurz, M. C., Oct 2019, 2019 IEEE Sensors, SENSORS 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 4 p. 8956948. (Proceedings of IEEE Sensors; vol. 2019-October).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Published
Simulationsgestützte Auslegung und Fertigung von werkzeugintegrierten induktiven Sensoren
Arndt, M., Dencker, F. & Wurz, M. C., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 673-676 4 p.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Published
Simulationsgestützte Auslegung und Fertigung von piezoelektrischen Kraftsensor-Arrays zur Untersuchung des Ultraschall-Drahtbondprozesses
Arndt, M., Wurz, M. C., Dencker, F., Long, Y. & Twiefel, J., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 742-745 4 p. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Published
Manufacturing and Characterization of Piezoelectric Force Sensor Arrays for Investigation of Ultrasonic Wire Bonding
Arndt, M., Long, Y., Hu, C., Dencker, F., Twiefel, J. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 462-465 4 p.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Published
Fabrication Method and Characterization of Molded Interconnect Device Micro Transformer in Planar Form by Embedding Sintered Ferrite Cores
Bierwirth, T. N., Fischer, E. C., Prediger, M. S., Le, T. M., Dencker, F. & Wurz, M. C., Oct 2023, MikroSystemTechnik Kongress 2023: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 599-604 6 p.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
Published
Fabrication of a Low Profile Planar Transformer Using Molded Interconnect Device Technology
Bierwirth, T. N., Dencker, F., Fischer, E. C. & Wurz, M. C., Sept 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 129-133 5 p. (2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
Published
Manufacturing and Characterization of Planar Transformers as Molded Interconnect Device Technology Component for an Industrial Production
Bierwirth, T. N., Bengsch, S., Werner, M., Wachs, R., Henne, C., Bur, S., Dencker, F. & Wurz, M. C., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 2172-2177 6 p. (Proceedings - Electronic Components and Technology Conference).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Published
Novel Glass-Silicon Emitter Chip for Field Emission Applications
Buchta, A. M., Kassner, A., Voß, J., Leopold, T., Petring, J., Diekmann, L., Dencker, F. & Wurz, M. C., 27 Jul 2023, 2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC). p. 207-209 3 p. ( International Vacuum Nanoelectronics Conference).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Published
Glass-Extraction Electrode for Field Emission Applications
Buchta, A. M., Kassner, A., Dencker, F. & Wurz, M. C., 2024, 2024 37th International Vacuum Nanoelectronics Conference (IVNC). (International Vacuum Nanoelectronics Conference proceedings).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Published
Klimt artwork (Part II): material investigation by backscattering Fe-57 Mössbauer- and Raman- spectroscopy, SEM and p-XRF
Costa, B. F. O., Lehmann, R., Wengerowsky, D., Blumers, M., Sansano, A., Rull, F., Schmidt, H. J., Dencker, F., Niebur, A., Klingelhöfer, G., Sindelar, R. & Renz, F., Dec 2016, In: Hyperfine Interactions. 237, 1, 13 p., 92.
Research output: Contribution to journal › Article › Research › peer review
Published
Electrical feed through for tool integrated high temperature applications
Dencker, F., Kolodziejczyk, F. & Wurz, M. C., 2017, International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017. p. 50-56 7 p. (International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Published
Press hardening tool integrated thin film temperature sensor
Dencker, F., Schlenkrich, A. & Wurz, M. C., 2017, Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017. p. 349-350 2 p. (Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Published
An application report: Protective thin film layers for high temperature sensor technology
Dencker, F., Wurz, M., Dubrovskiy, S. & Koroleva, E., 5 Apr 2016, Proceedings of the 2016 IEEE North West Russia Section Young Researchers in Electrical and Electronic Engineering Conference, EIConRusNW 2016. Shaposhnikov, S. (ed.). Institute of Electrical and Electronics Engineers Inc., p. 32-36 5 p. 7448110
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Published
A silicone fiber coating as approach for the reduction of fibroblast growth on implant electrodes
Dencker, F., Dreyer, L., Müller, D., Zernetsch, H., Paasche, G., Sindelar, R. & Glasmacher, B., Nov 2017, In: Journal of Biomedical Materials Research - Part B Applied Biomaterials. 105, 8, p. 2574-2580 7 p.
Research output: Contribution to journal › Article › Research › peer review
Published
Verfahren zur Herstellung von Diamantspitzen
Dencker, F. (Inventor), Wurz, M. C. (Inventor) & Maier, H. J. (Inventor), 4 Mar 2021, IPC No. G01Q 70/ 16 A I, Patent No. DE102019213043, Priority date 29 Aug 2019, Priority No. DE201910213043
Research output: Patent
Published
Sensorbauteil, Halbzeug, Verfahren zur Anbringung und zur Herstellung eines Sensorbauteils
Dencker, F. (Inventor), Wurz, M. C. (Inventor), Maier, H. J. (Inventor), Ottermann, R. (Inventor), Kassner, A. (Inventor) & Klaas, D. (Inventor), 25 Feb 2021, IPC No. G01N 27/ 04 A I, Patent No. DE102019122623, Priority date 22 Aug 2019, Priority No. DE201910122623
Research output: Patent
Published
Force sensing linear rolling guides based on modified metal strain gauges
Denkena, B., Klemme, H., Kowalke, D., Korbacher, M., Ottermann, R., Dencker, F. & Wurz, M., 2023, European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 23rd International Conference and Exhibition, EUSPEN 2023. Riemer, O., Nisbet, C. & Phillips, D. (eds.). p. 207-210 4 p. (European Society for Precision Engineering and Nanotechnology, Conference Proceedings - 23rd International Conference and Exhibition, EUSPEN 2023).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Published
Mikrotechnologische Fertigung von integrierten optischen Gittern mittels Lift-Off-Prozess für den Einsatz in Atominterferometern
de Wall, S., Kassner, A., Dencker, F., Künzler, C., Diekmann, L. & Würz, M. C., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 466-468 3 p. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

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