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Publications

  1. 2024
  2. Published

    Miniaturized Rubidium Source for Generating Vapor Phase Atoms for Magneto Optical Traps

    Koch, J., Diekmann, L. F., Kassner, A., Dencker, F. & Wurz, M. C., 15 Jul 2024, 2024 37th International Vacuum Nanoelectronics Conference, IVNC 2024. Institute of Electrical and Electronics Engineers Inc., (International Vacuum Nanoelectronics Conference).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  3. Published

    Modification of glass by a laser for the use in micro-electric systems and quantum devices

    Keinert, L., Koch, J. (Contributor), Künzler, C. (Contributor), Dehning, K. J. (Contributor), Kassner, A. (Contributor), Dencker, F. (Contributor), Zimmermann, S. (Contributor) & Wurz, M. (Contributor), 11 Mar 2024, Book of abstracts for the EQTC 2023. Schnitger, A., Husemann, R. & Liebisch, T. (eds.). Hannover, p. 91

    Research output: Chapter in book/report/conference proceedingConference abstractResearch

  4. Published

    Glass-Extraction Electrode for Field Emission Applications

    Buchta, A. M., Kassner, A., Dencker, F. & Wurz, M. C., 2024, 2024 37th International Vacuum Nanoelectronics Conference (IVNC). (International Vacuum Nanoelectronics Conference proceedings).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  5. Published

    Silicon-based membrane pressure sensor for inline monitoring of pressure and hermeticity of small-volume bonded packages

    Koch, J., Brinkmann, L. M., Kassner, A., Dencker, F. & Wurz, M. C., 2024, 2024 IEEE 74th Electronic Components and Technology Conference : (ECTC). Institute of Electrical and Electronics Engineers Inc., p. 193-200 8 p. (Proceedings - Electronic Components and Technology Conference).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  6. 2023
  7. Published

    Novel Glass-Silicon Emitter Chip for Field Emission Applications

    Buchta, A. M., Kassner, A., Voß, J., Leopold, T., Petring, J., Diekmann, L., Dencker, F. & Wurz, M. C., 27 Jul 2023, 2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC). p. 207-209 3 p. ( International Vacuum Nanoelectronics Conference).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  8. Published

    Micro-integrated optical systems and qualification of adhesive integration technologies for cold atomic quantum sensors

    Christ, M., Stiekel, A., Stölmacker, C., Zimmermann, C., Kassner, A., Wurz, M. & Krutzik, M., 12 Jul 2023, International Conference on Space Optics, ICSO 2022. Minoglou, K., Karafolas, N. & Cugny, B. (eds.). SPIE, 1277718. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12777).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  9. Published

    Microtechnological Production of Integrated Optical Gratings Using Laser Beam Lithography for Atomic Interferometers

    de Wall, S., Kassner, A., Dencker, F. & Wurz, M., 2023, Tagungsband MikroSystemTechnik Kongress 2023. 3 p.

    Research output: Chapter in book/report/conference proceedingConference contributionResearch

  10. Published

    Miniaturized quantum systems for inertial measurement units

    Kassner, A., Diekmann, L., Künzler, C., Petring, J., Droese, N., Dencker, F., Heine, H., Abend, S., Gersemann, M., Rasel, E. M., Herr, W., Schubert, C. & Wurz, M. C., 2023, 2023 DGON Inertial Sensors and Systems (ISS). Hecker, P. (ed.). (International Symposium on Inertial Sensors and Systems).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  11. Published

    Setup of an ultra-high vacuum bonder for the encapsulation of quantum systems

    Droese, N., Petring, J., Hadeler, S., Kassner, A., Dencker, F. & Wurz, M. C., 2023, MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, p. 763-766 4 p.

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  12. 2022
  13. Published

    Nonevaporable getter-MEMS for generating UHV conditions in small volumina

    Diekmann, L. F., Kassner, A., Dencker, F. & Wurz, M. C., Sept 2022, In: Journal of Vacuum Science and Technology B. 40, 5, 054202.

    Research output: Contribution to journalArticleResearchpeer review

  14. Published

    Approaches for a Solely Electroless Metallization of Through-Glass Vias

    Zawacka, A. M., Prediger, M. S., Kassner, A., Dencker, F. E. & Wurz, M., 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). p. 889-897 9 p. (Proceedings - Electronic Components and Technology Conference; vol. 2022-May).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  15. 2021
  16. Published

    Sensorbauteil, Halbzeug, Verfahren zur Anbringung und zur Herstellung eines Sensorbauteils

    Dencker, F. (Inventor), Wurz, M. C. (Inventor), Maier, H. J. (Inventor), Ottermann, R. (Inventor), Kassner, A. (Inventor) & Klaas, D. (Inventor), 25 Feb 2021, IPC No. G01N 27/ 04 A I, Patent No. DE102019122623, Priority date 22 Aug 2019, Priority No. DE201910122623

    Research output: Patent

  17. Published

    Mikrotechnologische Fertigung von integrierten optischen Gittern mittels Lift-Off-Prozess für den Einsatz in Atominterferometern

    de Wall, S., Kassner, A., Dencker, F., Künzler, C., Diekmann, L. & Würz, M. C., 2021, MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, p. 466-468 3 p. (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  18. 2020
  19. Published

    Mikrotechnologische Fertigung von integrierten optischen Gittern für den Einsatz in Atominterferometern

    de Wall, S., Kassner, A., Dencker, F., Künzler, C., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M. & Wurz, M. C., 2020, GMM-Fb. 97: Mikro-Nano-Integration. Berlin: VDE Verlag GmbH, p. 56-59 4 p. (GMM-Fachberichte).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  20. 2019
  21. Published

    Integrated atomic quantum technologies in demanding environments: development and qualification of miniaturized optical setups and integration technologies for UHV and space operation

    Christ, M., Kassner, A., Smol, R., Bawamia, A., Heine, H., Herr, W., Peters, A., Wurz, M. C., Rasel, E. M., Wicht, A. & Krutzik, M., 1 Dec 2019, In: CEAS Space Journal. 11, 4, p. 561-566 6 p.

    Research output: Contribution to journalArticleResearchpeer review

  22. Published

    Integrated Atomic Quantum Technologies in Demanding Environments:: Development and Qualification of Miniaturized Optical Setups and Integration Technologies for UHV and Space Operation

    Christ, M., Kassner, A., Smol, R., Bawamia, A. I., Peters, A., Wurz, M. C., Rasel, E. M., Wicht, A. & Krutzik, M., 12 Jul 2019, International Conference on Space Optics, ICSO 2018: Proceedings. Sodnik, Z., Karafolas, N. & Cugny, B. (eds.). SPIE, 8 p. 1118088. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 11180).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  23. Published

    Atomchips mit integrierten optischen Gittern zur Erzeugung von Bose-Einstein-Kondensaten

    Kassner, A., Dencker, F., Künzler, C., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M. & Wurz, M., 2019, MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings. VDE Verlag GmbH, p. 541-544 4 p.

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  24. Published

    Atom chip technology for use under UHV conditions

    Kassner, A., Rechel, M., Heine, H., Herr, W., Christ, M., Krutzik, M., Rasel, E. M. & Wurz, M. C., 2019, Smart Systems Integration 2019: International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2019. Otto, T. (ed.). VDE Verlag GmbH, p. 69-75 7 p.

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  25. 2018
  26. Published

    Next Generation Atom Chip Development

    Wurz, M. C., Papakonstantinou, A., Heine, H., Kassner, A., Rechel, M., Herr, W., Ertmer, W., Rasel, E. M. & Le Gonidec, M., 2018.

    Research output: Contribution to conferencePaperResearch

  27. 2017
  28. Published

    Atom-Chip based BEC sources for compact and transportable experiments

    Wurz, M. C., Heine, H., Matthias, J., Grove, N., Sahelgozin, M., Kassner, A., Rechel, M., Abend, S., Seidel, S. T., Herr, W., Wurz, M. C., Müller, J., Ertmer, W. & Rasel, E. M., 2017.

    Research output: Contribution to conferencePosterResearch

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