Details
| Translated title of the contribution | Cutting tool comprises a base body having substrate hardness, a clamping surface layer, preferably clamping surface coating, a clamping surface and a clearance surface, which is formed at the base body |
|---|---|
| Original language | German |
| Patent number | DE102010020074 |
| IPC | C23C 16/ 34 A I |
| Priority date | 10 May 2010 |
| Publication status | Published - 10 Nov 2011 |
Abstract
Cutting tool (10) comprises: (a) a base body (12) having a substrate hardness; (b) a clamping surface layer (14), preferably clamping surface coating, where a clamping surface (16) exhibits a surface layer hardness, which is greater than the substrate hardness; (c) a clamping surface; and (d) a clearance surface (20), which is formed at the base body. An independent claim is also included for cutting a work-piece made of a material using the cutting tool, comprising contacting the cutting tool with the work-piece for cutting the material initially with the clamping surface layer, and contacting the uncoated clearance surface, where the base body exhibits a substrate-wear resistance against the material, and clamping surface layer, preferably clamping surface coating has a surface layer wear-resistance against the material, which is larger than the substrate-wear resistance.
Cite this
- Standard
- Harvard
- Apa
- Vancouver
- BibTeX
- RIS
Patent No.: DE102010020074. Nov 10, 2011.
Research output: Patent
}
TY - PAT
T1 - Zerspanwerkzeug und Verfahren zum Zerspanen
AU - Denkena, Berend
AU - Meyer, Roland
PY - 2011/11/10
Y1 - 2011/11/10
N2 - Die Erfindung betrifft ein Zerspanwerkzeug (10) mi (h12), einer Spanflächen-Deckschicht (14), insbesondere Spanflächen-Beschichtung, der Spanfläche (16) mit einer Deckschicht-Härte (h14), die größer ist als die Substrat-Härte (h12), einer Spanfläche (16) und einer Freifläche (20), wobei die Freifläche (20) am Grundkörper (12) ausgebildet ist.
AB - Die Erfindung betrifft ein Zerspanwerkzeug (10) mi (h12), einer Spanflächen-Deckschicht (14), insbesondere Spanflächen-Beschichtung, der Spanfläche (16) mit einer Deckschicht-Härte (h14), die größer ist als die Substrat-Härte (h12), einer Spanfläche (16) und einer Freifläche (20), wobei die Freifläche (20) am Grundkörper (12) ausgebildet ist.
M3 - Patent
M1 - DE102010020074
ER -