Details
| Original language | English |
|---|---|
| Title of host publication | Thermal Spray 2022 |
| Subtitle of host publication | Proceedings from the International Thermal Spray Conference |
| Place of Publication | Düsseldorf |
| Number of pages | 6 |
| Publication status | Published - 2022 |
| Event | Thermal Spray 2022 (ITSC 2022) - Wien, Austria Duration: 4 May 2022 → 6 May 2022 |
Publication series
| Name | Thermal spray proceedings |
|---|---|
| ISSN (Print) | 2768-1491 |
| ISSN (electronic) | 2768-1505 |
Abstract
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Thermal Spray 2022: Proceedings from the International Thermal Spray Conference. Düsseldorf, 2022. itsc2022p0939 (Thermal spray proceedings).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
}
TY - GEN
T1 - Yttria coatings as wear protection layer in the semiconductor industry
AU - Nicolaus, Martin
AU - Maier, Hans Jürgen
AU - Walther, Ralf
A2 - Dukat, Mareike
A2 - Möhwald, Kai
N1 - © 2022 DVS Media GmbH. All rights reserved.
PY - 2022
Y1 - 2022
N2 - In the semiconductor industry, plasma etching processes are widely used. Process chamber parts that are located in the plasma etching system are also exposed to the harsh environmental conditions. Thus, parts located close to the process area are typically coated with yttria to increase service life, and thus process performance. However, such yttria coatings are usually porous, and thus can be attacked by fluorine containing plasma. In order to increase the lifetime of the components in the plasma etching system, this research project aimed to improve the protective yttria layer by reducing the porosity of the protective layer. Specifically, a design of experiment was employed in which the porosity was the target value. The main effects of the coating parameters and their interactions including the surface treatment before the coating process were determined. Furthermore, the bonding of the protective coating to the component to be protected, as well as the element distribution and the coating morphology were investigated. The results and their ramifications with respect to the envisaged application will be discussed.
AB - In the semiconductor industry, plasma etching processes are widely used. Process chamber parts that are located in the plasma etching system are also exposed to the harsh environmental conditions. Thus, parts located close to the process area are typically coated with yttria to increase service life, and thus process performance. However, such yttria coatings are usually porous, and thus can be attacked by fluorine containing plasma. In order to increase the lifetime of the components in the plasma etching system, this research project aimed to improve the protective yttria layer by reducing the porosity of the protective layer. Specifically, a design of experiment was employed in which the porosity was the target value. The main effects of the coating parameters and their interactions including the surface treatment before the coating process were determined. Furthermore, the bonding of the protective coating to the component to be protected, as well as the element distribution and the coating morphology were investigated. The results and their ramifications with respect to the envisaged application will be discussed.
U2 - 10.31399/asm.cp.itsc2022p0939
DO - 10.31399/asm.cp.itsc2022p0939
M3 - Conference contribution
T3 - Thermal spray proceedings
BT - Thermal Spray 2022
CY - Düsseldorf
T2 - Thermal Spray 2022 (ITSC 2022)
Y2 - 4 May 2022 through 6 May 2022
ER -