When are substrate effects important for on-chip interconnects?

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Authors

  • M. Faïez Ktata
  • Hartmut Grabinski
  • Gabriel Gad
  • Helmut Fischer

Research Organisations

External Research Organisations

  • Infineon Technologies AG
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Details

Original languageEnglish
Title of host publicationElectrical Performance of Electronic Packaging
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages265-268
Number of pages4
ISBN (electronic)0780381289, 9780780381285
Publication statusPublished - 2003
EventElectrical Performance of Electronic Packaging, 2003 - Princeton, United States
Duration: 27 Oct 2003 → 29 Oct 2003

Publication series

NameElectrical Performance of Electronic Packaging

Abstract

In this paper, we investigate the effects of floating and grounded substrates with different conductivities of 100 S/m (medium) and 10.000 S/m (high) on on-chip interconnections in the frequency range from 1 Hz up to 40 GHz. We show that the frequency dependency of line parameters, especially the inductance and resistance per unit length, depends strongly on whether the substrate is grounded or floating, on the relative position of the ground line with respect to the signal lines, and on the substrate conductivity.

ASJC Scopus subject areas

Cite this

When are substrate effects important for on-chip interconnects? / Ktata, M. Faïez; Grabinski, Hartmut; Gad, Gabriel et al.
Electrical Performance of Electronic Packaging. Institute of Electrical and Electronics Engineers Inc., 2003. p. 265-268 1250046 (Electrical Performance of Electronic Packaging).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Ktata, MF, Grabinski, H, Gad, G & Fischer, H 2003, When are substrate effects important for on-chip interconnects? in Electrical Performance of Electronic Packaging., 1250046, Electrical Performance of Electronic Packaging, Institute of Electrical and Electronics Engineers Inc., pp. 265-268, Electrical Performance of Electronic Packaging, 2003, Princeton, United States, 27 Oct 2003. https://doi.org/10.1109/EPEP.2003.1250046
Ktata, M. F., Grabinski, H., Gad, G., & Fischer, H. (2003). When are substrate effects important for on-chip interconnects? In Electrical Performance of Electronic Packaging (pp. 265-268). Article 1250046 (Electrical Performance of Electronic Packaging). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEP.2003.1250046
Ktata MF, Grabinski H, Gad G, Fischer H. When are substrate effects important for on-chip interconnects? In Electrical Performance of Electronic Packaging. Institute of Electrical and Electronics Engineers Inc. 2003. p. 265-268. 1250046. (Electrical Performance of Electronic Packaging). doi: 10.1109/EPEP.2003.1250046
Ktata, M. Faïez ; Grabinski, Hartmut ; Gad, Gabriel et al. / When are substrate effects important for on-chip interconnects?. Electrical Performance of Electronic Packaging. Institute of Electrical and Electronics Engineers Inc., 2003. pp. 265-268 (Electrical Performance of Electronic Packaging).
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@inproceedings{9dbc46ed6166407e81cfba93166ff74f,
title = "When are substrate effects important for on-chip interconnects?",
abstract = "In this paper, we investigate the effects of floating and grounded substrates with different conductivities of 100 S/m (medium) and 10.000 S/m (high) on on-chip interconnections in the frequency range from 1 Hz up to 40 GHz. We show that the frequency dependency of line parameters, especially the inductance and resistance per unit length, depends strongly on whether the substrate is grounded or floating, on the relative position of the ground line with respect to the signal lines, and on the substrate conductivity.",
author = "Ktata, {M. Fa{\"i}ez} and Hartmut Grabinski and Gabriel Gad and Helmut Fischer",
year = "2003",
doi = "10.1109/EPEP.2003.1250046",
language = "English",
series = "Electrical Performance of Electronic Packaging",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "265--268",
booktitle = "Electrical Performance of Electronic Packaging",
address = "United States",
note = "Electrical Performance of Electronic Packaging, 2003 ; Conference date: 27-10-2003 Through 29-10-2003",

}

Download

TY - GEN

T1 - When are substrate effects important for on-chip interconnects?

AU - Ktata, M. Faïez

AU - Grabinski, Hartmut

AU - Gad, Gabriel

AU - Fischer, Helmut

PY - 2003

Y1 - 2003

N2 - In this paper, we investigate the effects of floating and grounded substrates with different conductivities of 100 S/m (medium) and 10.000 S/m (high) on on-chip interconnections in the frequency range from 1 Hz up to 40 GHz. We show that the frequency dependency of line parameters, especially the inductance and resistance per unit length, depends strongly on whether the substrate is grounded or floating, on the relative position of the ground line with respect to the signal lines, and on the substrate conductivity.

AB - In this paper, we investigate the effects of floating and grounded substrates with different conductivities of 100 S/m (medium) and 10.000 S/m (high) on on-chip interconnections in the frequency range from 1 Hz up to 40 GHz. We show that the frequency dependency of line parameters, especially the inductance and resistance per unit length, depends strongly on whether the substrate is grounded or floating, on the relative position of the ground line with respect to the signal lines, and on the substrate conductivity.

UR - http://www.scopus.com/inward/record.url?scp=84855884289&partnerID=8YFLogxK

U2 - 10.1109/EPEP.2003.1250046

DO - 10.1109/EPEP.2003.1250046

M3 - Conference contribution

AN - SCOPUS:84855884289

T3 - Electrical Performance of Electronic Packaging

SP - 265

EP - 268

BT - Electrical Performance of Electronic Packaging

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - Electrical Performance of Electronic Packaging, 2003

Y2 - 27 October 2003 through 29 October 2003

ER -