Details
| Original language | English |
|---|---|
| Title of host publication | 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 1-4 |
| Number of pages | 4 |
| ISBN (electronic) | 9781538630426 |
| Publication status | Published - 2 Jul 2017 |
| Event | 2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017 - Singapore, Singapore Duration: 6 Dec 2017 → 9 Dec 2017 |
Abstract
As a predominant interconnection technique, ultrasonic wire bonding has been applied in microelectronic packaging industry for decades. However, the bonding mechanisms are still unclear, especially for the oxide removal process. In this work, the whole oxide removal process was visualized by the real-time observations of artificial coated layers. An oxide layer was deposited on either the wire or the glass substrate and a high-speed observation system was focused on the wire/glass interface so that the changes of oxide layer at the interface can be observed. For the coated wire, cracks can be clearly observed after the normal force loading and concentrated at the peripheral contact region. The discretized oxides were then detached from the pure metal surface and rolled into small particles. The oxide particles were transported by the material flow and stress gradient induced compelling. The continuous plastic deformation induced material flow played an important role on the removal of substrate oxides.
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Materials Science(all)
- Metals and Alloys
- Materials Science(all)
- Polymers and Plastics
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2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1-4.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Visualization of oxide removal during ultrasonic wire bonding process
AU - Long, Yangyang
AU - Dencker, Folke
AU - Isaak, Andreas
AU - Schneider, Friedrich
AU - Hermsdorf, Jörg
AU - Wurz, Marc
AU - Twiefel, Jens
N1 - Funding Information: We gratefully acknowledge the financial support from DFG (Deutsche Forschungsgemeinschaft) programm (TW75 /8-1|WA564/40-1|WU558/11-1) and the provision of the bonding head HBK05 by Hesse Mechatronics GmbH. Publisher Copyright: © 2017 IEEE. Copyright: Copyright 2018 Elsevier B.V., All rights reserved.
PY - 2017/7/2
Y1 - 2017/7/2
N2 - As a predominant interconnection technique, ultrasonic wire bonding has been applied in microelectronic packaging industry for decades. However, the bonding mechanisms are still unclear, especially for the oxide removal process. In this work, the whole oxide removal process was visualized by the real-time observations of artificial coated layers. An oxide layer was deposited on either the wire or the glass substrate and a high-speed observation system was focused on the wire/glass interface so that the changes of oxide layer at the interface can be observed. For the coated wire, cracks can be clearly observed after the normal force loading and concentrated at the peripheral contact region. The discretized oxides were then detached from the pure metal surface and rolled into small particles. The oxide particles were transported by the material flow and stress gradient induced compelling. The continuous plastic deformation induced material flow played an important role on the removal of substrate oxides.
AB - As a predominant interconnection technique, ultrasonic wire bonding has been applied in microelectronic packaging industry for decades. However, the bonding mechanisms are still unclear, especially for the oxide removal process. In this work, the whole oxide removal process was visualized by the real-time observations of artificial coated layers. An oxide layer was deposited on either the wire or the glass substrate and a high-speed observation system was focused on the wire/glass interface so that the changes of oxide layer at the interface can be observed. For the coated wire, cracks can be clearly observed after the normal force loading and concentrated at the peripheral contact region. The discretized oxides were then detached from the pure metal surface and rolled into small particles. The oxide particles were transported by the material flow and stress gradient induced compelling. The continuous plastic deformation induced material flow played an important role on the removal of substrate oxides.
UR - http://www.scopus.com/inward/record.url?scp=85050693508&partnerID=8YFLogxK
U2 - 10.1109/EPTC.2017.8277489
DO - 10.1109/EPTC.2017.8277489
M3 - Conference contribution
AN - SCOPUS:85050693508
SP - 1
EP - 4
BT - 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017
Y2 - 6 December 2017 through 9 December 2017
ER -