Verification of Hygrothermal Simulations Using Silicone Encapsulated Climate Sensors in Continuously Operated IGBT Power Modules

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Authors

  • Soren Frohling
  • Benedikt Kostka
  • Johannes C. Wenzel
  • Katharina Fischer
  • Michael Hanf
  • Christian Zorn
  • Kirsten Dehning
  • Stefan Zimmermann
  • Nando Kaminski
  • Axel Mertens
  • Jan-Hendrik Peters

External Research Organisations

  • Fraunhofer Institute for Wind Energy Systems (IWES)
  • University of Bremen
View graph of relations

Details

Original languageEnglish
Title of host publicationICPE 2023-ECCE Asia
Subtitle of host publication11th International Conference on Power Electronics - Green World with Power Electronics
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1361-1369
Number of pages9
ISBN (electronic)9788957083505
ISBN (print)979-8-3503-3620-7
Publication statusPublished - 2023
Event11th International Conference on Power Electronics - ECCE Asia, ICPE 2023-ECCE Asia - Jeju, Korea, Republic of
Duration: 22 May 202325 May 2023

Publication series

NameInternational Conference on Power Electronics
ISSN (Print)2150-6078
ISSN (electronic)2150-6086

Abstract

This paper presents measurements of temperature and humidity conditions in a power module during continuous pulse-width modulation (PWM) operation. Based on the results, a developed hygrothermal simulation model is validated. This can subsequently be used later to identify critical operating conditions which can create lifetime-reducing microclimates on the chip level. This approach enables the implementation of a condition monitoring system based on the microclimate inside the power module.

Keywords

    Degradation, IGBT, Reliability, Silicone gel

ASJC Scopus subject areas

Cite this

Verification of Hygrothermal Simulations Using Silicone Encapsulated Climate Sensors in Continuously Operated IGBT Power Modules. / Frohling, Soren; Kostka, Benedikt; Wenzel, Johannes C. et al.
ICPE 2023-ECCE Asia : 11th International Conference on Power Electronics - Green World with Power Electronics. Institute of Electrical and Electronics Engineers Inc., 2023. p. 1361-1369 (International Conference on Power Electronics).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Frohling, S, Kostka, B, Wenzel, JC, Fischer, K, Hanf, M, Zorn, C, Dehning, K, Zimmermann, S, Kaminski, N, Mertens, A & Peters, J-H 2023, Verification of Hygrothermal Simulations Using Silicone Encapsulated Climate Sensors in Continuously Operated IGBT Power Modules. in ICPE 2023-ECCE Asia : 11th International Conference on Power Electronics - Green World with Power Electronics. International Conference on Power Electronics, Institute of Electrical and Electronics Engineers Inc., pp. 1361-1369, 11th International Conference on Power Electronics - ECCE Asia, ICPE 2023-ECCE Asia, Jeju, Korea, Republic of, 22 May 2023. https://doi.org/10.23919/ICPE2023-ECCEAsia54778.2023.10213687
Frohling, S., Kostka, B., Wenzel, J. C., Fischer, K., Hanf, M., Zorn, C., Dehning, K., Zimmermann, S., Kaminski, N., Mertens, A., & Peters, J.-H. (2023). Verification of Hygrothermal Simulations Using Silicone Encapsulated Climate Sensors in Continuously Operated IGBT Power Modules. In ICPE 2023-ECCE Asia : 11th International Conference on Power Electronics - Green World with Power Electronics (pp. 1361-1369). (International Conference on Power Electronics). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICPE2023-ECCEAsia54778.2023.10213687
Frohling S, Kostka B, Wenzel JC, Fischer K, Hanf M, Zorn C et al. Verification of Hygrothermal Simulations Using Silicone Encapsulated Climate Sensors in Continuously Operated IGBT Power Modules. In ICPE 2023-ECCE Asia : 11th International Conference on Power Electronics - Green World with Power Electronics. Institute of Electrical and Electronics Engineers Inc. 2023. p. 1361-1369. (International Conference on Power Electronics). doi: 10.23919/ICPE2023-ECCEAsia54778.2023.10213687
Frohling, Soren ; Kostka, Benedikt ; Wenzel, Johannes C. et al. / Verification of Hygrothermal Simulations Using Silicone Encapsulated Climate Sensors in Continuously Operated IGBT Power Modules. ICPE 2023-ECCE Asia : 11th International Conference on Power Electronics - Green World with Power Electronics. Institute of Electrical and Electronics Engineers Inc., 2023. pp. 1361-1369 (International Conference on Power Electronics).
Download
@inproceedings{cce5ee80006947f78a18fa30dc497a9c,
title = "Verification of Hygrothermal Simulations Using Silicone Encapsulated Climate Sensors in Continuously Operated IGBT Power Modules",
abstract = "This paper presents measurements of temperature and humidity conditions in a power module during continuous pulse-width modulation (PWM) operation. Based on the results, a developed hygrothermal simulation model is validated. This can subsequently be used later to identify critical operating conditions which can create lifetime-reducing microclimates on the chip level. This approach enables the implementation of a condition monitoring system based on the microclimate inside the power module.",
keywords = "Degradation, IGBT, Reliability, Silicone gel",
author = "Soren Frohling and Benedikt Kostka and Wenzel, {Johannes C.} and Katharina Fischer and Michael Hanf and Christian Zorn and Kirsten Dehning and Stefan Zimmermann and Nando Kaminski and Axel Mertens and Jan-Hendrik Peters",
note = "Funding Information: This work is part of the project ReCoWind and was funded by the Federal Ministry for Economic Affairs and Climate Action on the basis of a decision by the German Bundestag. Grant number: 0324336A/C/E. ; 11th International Conference on Power Electronics - ECCE Asia, ICPE 2023-ECCE Asia ; Conference date: 22-05-2023 Through 25-05-2023",
year = "2023",
doi = "10.23919/ICPE2023-ECCEAsia54778.2023.10213687",
language = "English",
isbn = "979-8-3503-3620-7",
series = "International Conference on Power Electronics",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1361--1369",
booktitle = "ICPE 2023-ECCE Asia",
address = "United States",

}

Download

TY - GEN

T1 - Verification of Hygrothermal Simulations Using Silicone Encapsulated Climate Sensors in Continuously Operated IGBT Power Modules

AU - Frohling, Soren

AU - Kostka, Benedikt

AU - Wenzel, Johannes C.

AU - Fischer, Katharina

AU - Hanf, Michael

AU - Zorn, Christian

AU - Dehning, Kirsten

AU - Zimmermann, Stefan

AU - Kaminski, Nando

AU - Mertens, Axel

AU - Peters, Jan-Hendrik

N1 - Funding Information: This work is part of the project ReCoWind and was funded by the Federal Ministry for Economic Affairs and Climate Action on the basis of a decision by the German Bundestag. Grant number: 0324336A/C/E.

PY - 2023

Y1 - 2023

N2 - This paper presents measurements of temperature and humidity conditions in a power module during continuous pulse-width modulation (PWM) operation. Based on the results, a developed hygrothermal simulation model is validated. This can subsequently be used later to identify critical operating conditions which can create lifetime-reducing microclimates on the chip level. This approach enables the implementation of a condition monitoring system based on the microclimate inside the power module.

AB - This paper presents measurements of temperature and humidity conditions in a power module during continuous pulse-width modulation (PWM) operation. Based on the results, a developed hygrothermal simulation model is validated. This can subsequently be used later to identify critical operating conditions which can create lifetime-reducing microclimates on the chip level. This approach enables the implementation of a condition monitoring system based on the microclimate inside the power module.

KW - Degradation

KW - IGBT

KW - Reliability

KW - Silicone gel

UR - http://www.scopus.com/inward/record.url?scp=85170650964&partnerID=8YFLogxK

U2 - 10.23919/ICPE2023-ECCEAsia54778.2023.10213687

DO - 10.23919/ICPE2023-ECCEAsia54778.2023.10213687

M3 - Conference contribution

AN - SCOPUS:85170650964

SN - 979-8-3503-3620-7

T3 - International Conference on Power Electronics

SP - 1361

EP - 1369

BT - ICPE 2023-ECCE Asia

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 11th International Conference on Power Electronics - ECCE Asia, ICPE 2023-ECCE Asia

Y2 - 22 May 2023 through 25 May 2023

ER -

By the same author(s)