Details
| Original language | English |
|---|---|
| Title of host publication | Electronics System Integration Technology Conference, ESTC 2010 - Proceedings |
| Publication status | Published - 2010 |
| Event | 3rd Electronics System Integration Technology Conference, ESTC 2010 - Berlin, Germany Duration: 13 Sept 2010 → 16 Sept 2010 |
Publication series
| Name | Electronics System Integration Technology Conference, ESTC 2010 - Proceedings |
|---|
Abstract
In consequence of the general densification of electronic components, the stress being submitted to the packages aggravates while the size of the internal interconnections shrinks. Against the background of an increasing reliability issue, this paper focuses on reliability aspects within PoP assemblies, submitted to high current and mechanical stress conditions. The role of underfill and molding compound (MC) on temperature management, migration phenomena and stress reduction in a ball grid array (BGA) was investigated. Therefore, thermal-electrical-mechanical finite element simulations were conducted using ANSYS® and a model of a bump chain being common for PoP structures. With the results, migration mechanisms like electro- or thermo-induced migration in bumps were calculated.
ASJC Scopus subject areas
- Engineering(all)
- Control and Systems Engineering
- Engineering(all)
- Electrical and Electronic Engineering
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Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. 2010. 5642803 (Electronics System Integration Technology Conference, ESTC 2010 - Proceedings).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Underfill and mold compound influence on PoP aging under high current and high temperature stress
AU - Meinshausen, L.
AU - Weide-Zaage, K.
AU - Frémont, H.
N1 - Copyright: Copyright 2011 Elsevier B.V., All rights reserved.
PY - 2010
Y1 - 2010
N2 - In consequence of the general densification of electronic components, the stress being submitted to the packages aggravates while the size of the internal interconnections shrinks. Against the background of an increasing reliability issue, this paper focuses on reliability aspects within PoP assemblies, submitted to high current and mechanical stress conditions. The role of underfill and molding compound (MC) on temperature management, migration phenomena and stress reduction in a ball grid array (BGA) was investigated. Therefore, thermal-electrical-mechanical finite element simulations were conducted using ANSYS® and a model of a bump chain being common for PoP structures. With the results, migration mechanisms like electro- or thermo-induced migration in bumps were calculated.
AB - In consequence of the general densification of electronic components, the stress being submitted to the packages aggravates while the size of the internal interconnections shrinks. Against the background of an increasing reliability issue, this paper focuses on reliability aspects within PoP assemblies, submitted to high current and mechanical stress conditions. The role of underfill and molding compound (MC) on temperature management, migration phenomena and stress reduction in a ball grid array (BGA) was investigated. Therefore, thermal-electrical-mechanical finite element simulations were conducted using ANSYS® and a model of a bump chain being common for PoP structures. With the results, migration mechanisms like electro- or thermo-induced migration in bumps were calculated.
UR - http://www.scopus.com/inward/record.url?scp=78651323045&partnerID=8YFLogxK
U2 - 10.1109/ESTC.2010.5642803
DO - 10.1109/ESTC.2010.5642803
M3 - Conference contribution
AN - SCOPUS:78651323045
SN - 9781424485536
T3 - Electronics System Integration Technology Conference, ESTC 2010 - Proceedings
BT - Electronics System Integration Technology Conference, ESTC 2010 - Proceedings
T2 - 3rd Electronics System Integration Technology Conference, ESTC 2010
Y2 - 13 September 2010 through 16 September 2010
ER -