Two-level Metallization and Module Integration of Point-contacted Solar Cells

Research output: Contribution to journalConference articleResearchpeer review

Authors

  • Henning Schulte-Huxel
  • Udo Römer
  • Susanne Blankemeyer
  • Agnes Merkle
  • Yevgeniya Larionova
  • Verena Steckenreiter
  • Robby Peibst
  • Sarah Kajari-Schroeder
  • Rolf Brendel

Research Organisations

External Research Organisations

  • Institute for Solar Energy Research (ISFH)
View graph of relations

Details

Original languageEnglish
Pages (from-to)361-368
Number of pages8
JournalEnergy Procedia
Volume55
Early online date19 Sept 2014
Publication statusPublished - 2014
Event4th International Conference on Crystalline Silicon Photovoltaics, SiliconPV 2014 - Hertogenbosch, Netherlands
Duration: 25 Mar 201427 Mar 2014

Abstract

We present a module integration process for back junction back contact (BJBC) solar cells featuring point contacts to the back surface field (BSF). We apply two metallization layers. A first metal layer of aluminum is deposited onto the rear side of the cell and carries the current extracted from the polarity with the larger surface area fraction, e.g. from the emitter. The second metallization layer is an Al layer on a transparent substrate that we laser-weld to the small and point-shaped regions of the other polarity, e.g. the BSF region. We use a polymer for insulation between the two metal layers. The Al layer on the substrate also serves for cell interconnection, i.e., it enables module integration. Such an interconnection structure halves the fill factor losses due to the metallization. First proof-of-principle modules show a shunt free interconnection, no laser-induced damage, and an energy conversion efficiency of up to 20.7%.

Keywords

    Al metallization, Back junction back contact, Cell interconnection, Laser micro welding, Module integration, Point contact solar cells

ASJC Scopus subject areas

Cite this

Two-level Metallization and Module Integration of Point-contacted Solar Cells. / Schulte-Huxel, Henning; Römer, Udo; Blankemeyer, Susanne et al.
In: Energy Procedia, Vol. 55, 2014, p. 361-368.

Research output: Contribution to journalConference articleResearchpeer review

Schulte-Huxel, H, Römer, U, Blankemeyer, S, Merkle, A, Larionova, Y, Steckenreiter, V, Peibst, R, Kajari-Schroeder, S & Brendel, R 2014, 'Two-level Metallization and Module Integration of Point-contacted Solar Cells', Energy Procedia, vol. 55, pp. 361-368. https://doi.org/10.1016/j.egypro.2014.08.104, https://doi.org/10.15488/937
Schulte-Huxel, H., Römer, U., Blankemeyer, S., Merkle, A., Larionova, Y., Steckenreiter, V., Peibst, R., Kajari-Schroeder, S., & Brendel, R. (2014). Two-level Metallization and Module Integration of Point-contacted Solar Cells. Energy Procedia, 55, 361-368. https://doi.org/10.1016/j.egypro.2014.08.104, https://doi.org/10.15488/937
Schulte-Huxel H, Römer U, Blankemeyer S, Merkle A, Larionova Y, Steckenreiter V et al. Two-level Metallization and Module Integration of Point-contacted Solar Cells. Energy Procedia. 2014;55:361-368. Epub 2014 Sept 19. doi: 10.1016/j.egypro.2014.08.104, 10.15488/937
Schulte-Huxel, Henning ; Römer, Udo ; Blankemeyer, Susanne et al. / Two-level Metallization and Module Integration of Point-contacted Solar Cells. In: Energy Procedia. 2014 ; Vol. 55. pp. 361-368.
Download
@article{ecf11d3fa98a49caada0831f85de55c2,
title = "Two-level Metallization and Module Integration of Point-contacted Solar Cells",
abstract = "We present a module integration process for back junction back contact (BJBC) solar cells featuring point contacts to the back surface field (BSF). We apply two metallization layers. A first metal layer of aluminum is deposited onto the rear side of the cell and carries the current extracted from the polarity with the larger surface area fraction, e.g. from the emitter. The second metallization layer is an Al layer on a transparent substrate that we laser-weld to the small and point-shaped regions of the other polarity, e.g. the BSF region. We use a polymer for insulation between the two metal layers. The Al layer on the substrate also serves for cell interconnection, i.e., it enables module integration. Such an interconnection structure halves the fill factor losses due to the metallization. First proof-of-principle modules show a shunt free interconnection, no laser-induced damage, and an energy conversion efficiency of up to 20.7%.",
keywords = "Al metallization, Back junction back contact, Cell interconnection, Laser micro welding, Module integration, Point contact solar cells",
author = "Henning Schulte-Huxel and Udo R{\"o}mer and Susanne Blankemeyer and Agnes Merkle and Yevgeniya Larionova and Verena Steckenreiter and Robby Peibst and Sarah Kajari-Schroeder and Rolf Brendel",
year = "2014",
doi = "10.1016/j.egypro.2014.08.104",
language = "English",
volume = "55",
pages = "361--368",
note = "4th International Conference on Crystalline Silicon Photovoltaics, SiliconPV 2014 ; Conference date: 25-03-2014 Through 27-03-2014",

}

Download

TY - JOUR

T1 - Two-level Metallization and Module Integration of Point-contacted Solar Cells

AU - Schulte-Huxel, Henning

AU - Römer, Udo

AU - Blankemeyer, Susanne

AU - Merkle, Agnes

AU - Larionova, Yevgeniya

AU - Steckenreiter, Verena

AU - Peibst, Robby

AU - Kajari-Schroeder, Sarah

AU - Brendel, Rolf

PY - 2014

Y1 - 2014

N2 - We present a module integration process for back junction back contact (BJBC) solar cells featuring point contacts to the back surface field (BSF). We apply two metallization layers. A first metal layer of aluminum is deposited onto the rear side of the cell and carries the current extracted from the polarity with the larger surface area fraction, e.g. from the emitter. The second metallization layer is an Al layer on a transparent substrate that we laser-weld to the small and point-shaped regions of the other polarity, e.g. the BSF region. We use a polymer for insulation between the two metal layers. The Al layer on the substrate also serves for cell interconnection, i.e., it enables module integration. Such an interconnection structure halves the fill factor losses due to the metallization. First proof-of-principle modules show a shunt free interconnection, no laser-induced damage, and an energy conversion efficiency of up to 20.7%.

AB - We present a module integration process for back junction back contact (BJBC) solar cells featuring point contacts to the back surface field (BSF). We apply two metallization layers. A first metal layer of aluminum is deposited onto the rear side of the cell and carries the current extracted from the polarity with the larger surface area fraction, e.g. from the emitter. The second metallization layer is an Al layer on a transparent substrate that we laser-weld to the small and point-shaped regions of the other polarity, e.g. the BSF region. We use a polymer for insulation between the two metal layers. The Al layer on the substrate also serves for cell interconnection, i.e., it enables module integration. Such an interconnection structure halves the fill factor losses due to the metallization. First proof-of-principle modules show a shunt free interconnection, no laser-induced damage, and an energy conversion efficiency of up to 20.7%.

KW - Al metallization

KW - Back junction back contact

KW - Cell interconnection

KW - Laser micro welding

KW - Module integration

KW - Point contact solar cells

UR - http://www.scopus.com/inward/record.url?scp=84922322172&partnerID=8YFLogxK

U2 - 10.1016/j.egypro.2014.08.104

DO - 10.1016/j.egypro.2014.08.104

M3 - Conference article

AN - SCOPUS:84922322172

VL - 55

SP - 361

EP - 368

JO - Energy Procedia

JF - Energy Procedia

SN - 1876-6102

T2 - 4th International Conference on Crystalline Silicon Photovoltaics, SiliconPV 2014

Y2 - 25 March 2014 through 27 March 2014

ER -