Transformer diagnostic and assessment methodology

Research output: Contribution to journal › Conference article › Research › peer review

Authors

  • X. Zhang
  • E. Gockenbach

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Details

Original languageEnglish
Article number4570295
Pages (from-to)128-131
Number of pages4
JournalConference Record of IEEE International Symposium on Electrical Insulation
Publication statusPublished - 18 Jul 2008
Event2008 IEEE International Symposium on Electrical Insulation, ISEI 2008 - Vancouver, BC, Canada
Duration: 9 Jun 2008 → 12 Jun 2008

Abstract

In this paper a methodology has been developed to use information derived from condition monitoring and diagnostics for rehabilitation purposes of transformers. The interpretation and understanding of the test data are obtained from the International Standards. In particular, the standardization of diagnostic and analysis techniques are being improved that will enable regular staff to more easily use the test results and will reduce the need for interpretation by experts.

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Cite this

Transformer diagnostic and assessment methodology. / Zhang, X.; Gockenbach, E.
In: Conference Record of IEEE International Symposium on Electrical Insulation, 18.07.2008, p. 128-131.

Research output: Contribution to journal › Conference article › Research › peer review

Zhang, X & Gockenbach, E 2008, 'Transformer diagnostic and assessment methodology', Conference Record of IEEE International Symposium on Electrical Insulation, pp. 128-131. https://doi.org/10.1109/ELINSL.2008.4570295
Zhang, X., & Gockenbach, E. (2008). Transformer diagnostic and assessment methodology. Conference Record of IEEE International Symposium on Electrical Insulation, 128-131. Article 4570295. https://doi.org/10.1109/ELINSL.2008.4570295
Zhang X, Gockenbach E. Transformer diagnostic and assessment methodology. Conference Record of IEEE International Symposium on Electrical Insulation. 2008 Jul 18;128-131. 4570295. doi: 10.1109/ELINSL.2008.4570295
Zhang, X. ; Gockenbach, E. / Transformer diagnostic and assessment methodology. In: Conference Record of IEEE International Symposium on Electrical Insulation. 2008 ; pp. 128-131.
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