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Thin Film Transferring via PVA Substrate and Contacting of Sensor inside Elastomer Matrix

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Authors

External Research Organisations

  • German Institute of Rubber Technology (DIK e.V.)
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Details

Original languageEnglish
Title of host publicationIEEE Sensors, SENSORS 2020
Subtitle of host publicationConference Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (electronic)9781728168012
ISBN (print)978-1-7281-6802-9
Publication statusPublished - 2020
Event2020 IEEE Sensors, SENSORS 2020 - Virtual, Rotterdam, Netherlands
Duration: 25 Oct 202028 Oct 2020

Publication series

NameProceedings of IEEE Sensors
Volume2020-October
ISSN (Print)1930-0395
ISSN (electronic)2168-9229

Abstract

The integration of sensor-systems into elastomer bodies or onto flexible surfaces is a challenging task. Therefore, a new approach has been developed and investigated to create thin-film-based structures via PVD (physical vapor deposition) processes on water-soluble substrates such as polyvinyl-alcohol (PVA) and subsequently transferring the sensor structures onto unvulcanized rubber substrates. A contacting method using conductive polymer composites creates a reliable technique to electrically contact transferred thin film layers within an elastomer sandwich matrix.

Keywords

    conductive rubber, flexible substrate, foil substrates, polymer, PVA, PVD, roll-to-roll, rubber, strain gauge

ASJC Scopus subject areas

Cite this

Thin Film Transferring via PVA Substrate and Contacting of Sensor inside Elastomer Matrix. / Bengsch, Sebastian; Giese, Ulrich; Fischer, Eike et al.
IEEE Sensors, SENSORS 2020: Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 2020. 9278876 (Proceedings of IEEE Sensors; Vol. 2020-October).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Bengsch, S, Giese, U, Fischer, E & Wurz, MC 2020, Thin Film Transferring via PVA Substrate and Contacting of Sensor inside Elastomer Matrix. in IEEE Sensors, SENSORS 2020: Conference Proceedings., 9278876, Proceedings of IEEE Sensors, vol. 2020-October, Institute of Electrical and Electronics Engineers Inc., 2020 IEEE Sensors, SENSORS 2020, Virtual, Rotterdam, Netherlands, 25 Oct 2020. https://doi.org/10.1109/SENSORS47125.2020.9278876
Bengsch, S., Giese, U., Fischer, E., & Wurz, M. C. (2020). Thin Film Transferring via PVA Substrate and Contacting of Sensor inside Elastomer Matrix. In IEEE Sensors, SENSORS 2020: Conference Proceedings Article 9278876 (Proceedings of IEEE Sensors; Vol. 2020-October). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SENSORS47125.2020.9278876
Bengsch S, Giese U, Fischer E, Wurz MC. Thin Film Transferring via PVA Substrate and Contacting of Sensor inside Elastomer Matrix. In IEEE Sensors, SENSORS 2020: Conference Proceedings. Institute of Electrical and Electronics Engineers Inc. 2020. 9278876. (Proceedings of IEEE Sensors). doi: 10.1109/SENSORS47125.2020.9278876
Bengsch, Sebastian ; Giese, Ulrich ; Fischer, Eike et al. / Thin Film Transferring via PVA Substrate and Contacting of Sensor inside Elastomer Matrix. IEEE Sensors, SENSORS 2020: Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 2020. (Proceedings of IEEE Sensors).
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