Thermal stability of pt/epitaxial Gd2O3/Si stacks

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Authors

  • E. Lipp
  • M. Eizenberg
  • M. Czernohorsky
  • H. J. Osten

External Research Organisations

  • Technion-Israel Institute of Technology
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Details

Original languageEnglish
Title of host publicationMaterials Research Society Symposium Proceedings - Characterization of Oxide/Semiconductor Interfaces for CMOS Technologies
Pages64-69
Number of pages6
Publication statusPublished - 2007
EventCharacterization of Oxide/Semiconductor Interfaces for CMOS Technologies - 2007 MRS Spring Meeting - San Francisco, CA, United States
Duration: 9 Apr 200713 Apr 2007

Publication series

NameMaterials Research Society Symposium Proceedings
Volume996
ISSN (Print)0272-9172

Abstract

The thermal stability of Pt/ epitaxial Gd2O3/ Si(100) stacks is studied as function of temperature in the range 400-650°C. Following 30min anneal at 600□ C, a significant increase in oxide leakage current is measured. We show that oxide degradation is not accompanied by chemical reactions at the oxide/Si or metal/ oxide interfaces but is rather induced by formation of Gd vacancies, due to Gd out diffusion through the grain boundaries of the Pt layer. Secondary ion mass spectrometry (SMS) measurements show that the stack is stable up to 500□ C, and that significant diffusion of Gd occurs only after 30min at 550□C. A quantitative analysis of the diffusion kinetics between 550□C and 650□C is presented, based on the SMS data. The pre-exponential term and activation energy for grain boundary diffusion of Gd are calculated to be (5±2)-10-10 cm2/sec and (0.67+0.04) eV respectively

ASJC Scopus subject areas

Cite this

Thermal stability of pt/epitaxial Gd2O3/Si stacks. / Lipp, E.; Eizenberg, M.; Czernohorsky, M. et al.
Materials Research Society Symposium Proceedings - Characterization of Oxide/Semiconductor Interfaces for CMOS Technologies. 2007. p. 64-69 (Materials Research Society Symposium Proceedings; Vol. 996).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Lipp, E, Eizenberg, M, Czernohorsky, M & Osten, HJ 2007, Thermal stability of pt/epitaxial Gd2O3/Si stacks. in Materials Research Society Symposium Proceedings - Characterization of Oxide/Semiconductor Interfaces for CMOS Technologies. Materials Research Society Symposium Proceedings, vol. 996, pp. 64-69, Characterization of Oxide/Semiconductor Interfaces for CMOS Technologies - 2007 MRS Spring Meeting, San Francisco, CA, United States, 9 Apr 2007.
Lipp, E., Eizenberg, M., Czernohorsky, M., & Osten, H. J. (2007). Thermal stability of pt/epitaxial Gd2O3/Si stacks. In Materials Research Society Symposium Proceedings - Characterization of Oxide/Semiconductor Interfaces for CMOS Technologies (pp. 64-69). (Materials Research Society Symposium Proceedings; Vol. 996).
Lipp E, Eizenberg M, Czernohorsky M, Osten HJ. Thermal stability of pt/epitaxial Gd2O3/Si stacks. In Materials Research Society Symposium Proceedings - Characterization of Oxide/Semiconductor Interfaces for CMOS Technologies. 2007. p. 64-69. (Materials Research Society Symposium Proceedings).
Lipp, E. ; Eizenberg, M. ; Czernohorsky, M. et al. / Thermal stability of pt/epitaxial Gd2O3/Si stacks. Materials Research Society Symposium Proceedings - Characterization of Oxide/Semiconductor Interfaces for CMOS Technologies. 2007. pp. 64-69 (Materials Research Society Symposium Proceedings).
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@inproceedings{f12445ec4f9b4961bd87cf348e069cee,
title = "Thermal stability of pt/epitaxial Gd2O3/Si stacks",
abstract = "The thermal stability of Pt/ epitaxial Gd2O3/ Si(100) stacks is studied as function of temperature in the range 400-650°C. Following 30min anneal at 600□ C, a significant increase in oxide leakage current is measured. We show that oxide degradation is not accompanied by chemical reactions at the oxide/Si or metal/ oxide interfaces but is rather induced by formation of Gd vacancies, due to Gd out diffusion through the grain boundaries of the Pt layer. Secondary ion mass spectrometry (SMS) measurements show that the stack is stable up to 500□ C, and that significant diffusion of Gd occurs only after 30min at 550□C. A quantitative analysis of the diffusion kinetics between 550□C and 650□C is presented, based on the SMS data. The pre-exponential term and activation energy for grain boundary diffusion of Gd are calculated to be (5±2)-10-10 cm2/sec and (0.67+0.04) eV respectively",
author = "E. Lipp and M. Eizenberg and M. Czernohorsky and Osten, {H. J.}",
year = "2007",
language = "English",
isbn = "9781605604282",
series = "Materials Research Society Symposium Proceedings",
pages = "64--69",
booktitle = "Materials Research Society Symposium Proceedings - Characterization of Oxide/Semiconductor Interfaces for CMOS Technologies",
note = "Characterization of Oxide/Semiconductor Interfaces for CMOS Technologies - 2007 MRS Spring Meeting ; Conference date: 09-04-2007 Through 13-04-2007",

}

Download

TY - GEN

T1 - Thermal stability of pt/epitaxial Gd2O3/Si stacks

AU - Lipp, E.

AU - Eizenberg, M.

AU - Czernohorsky, M.

AU - Osten, H. J.

PY - 2007

Y1 - 2007

N2 - The thermal stability of Pt/ epitaxial Gd2O3/ Si(100) stacks is studied as function of temperature in the range 400-650°C. Following 30min anneal at 600□ C, a significant increase in oxide leakage current is measured. We show that oxide degradation is not accompanied by chemical reactions at the oxide/Si or metal/ oxide interfaces but is rather induced by formation of Gd vacancies, due to Gd out diffusion through the grain boundaries of the Pt layer. Secondary ion mass spectrometry (SMS) measurements show that the stack is stable up to 500□ C, and that significant diffusion of Gd occurs only after 30min at 550□C. A quantitative analysis of the diffusion kinetics between 550□C and 650□C is presented, based on the SMS data. The pre-exponential term and activation energy for grain boundary diffusion of Gd are calculated to be (5±2)-10-10 cm2/sec and (0.67+0.04) eV respectively

AB - The thermal stability of Pt/ epitaxial Gd2O3/ Si(100) stacks is studied as function of temperature in the range 400-650°C. Following 30min anneal at 600□ C, a significant increase in oxide leakage current is measured. We show that oxide degradation is not accompanied by chemical reactions at the oxide/Si or metal/ oxide interfaces but is rather induced by formation of Gd vacancies, due to Gd out diffusion through the grain boundaries of the Pt layer. Secondary ion mass spectrometry (SMS) measurements show that the stack is stable up to 500□ C, and that significant diffusion of Gd occurs only after 30min at 550□C. A quantitative analysis of the diffusion kinetics between 550□C and 650□C is presented, based on the SMS data. The pre-exponential term and activation energy for grain boundary diffusion of Gd are calculated to be (5±2)-10-10 cm2/sec and (0.67+0.04) eV respectively

UR - http://www.scopus.com/inward/record.url?scp=70349935135&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:70349935135

SN - 9781605604282

T3 - Materials Research Society Symposium Proceedings

SP - 64

EP - 69

BT - Materials Research Society Symposium Proceedings - Characterization of Oxide/Semiconductor Interfaces for CMOS Technologies

T2 - Characterization of Oxide/Semiconductor Interfaces for CMOS Technologies - 2007 MRS Spring Meeting

Y2 - 9 April 2007 through 13 April 2007

ER -