Thermal modeling and decentralized control of mold temperature for a vulcanization test bench

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Authors

  • Steffen Bosselmann
  • Tobias Frank
  • Mark Wielitzka
  • Matthias Dagen
  • Tobias Ortmaier

Research Organisations

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Details

Original languageEnglish
Title of host publication1st Annual IEEE Conference on Control Technology and Applications, CCTA 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages377-382
Number of pages6
ISBN (electronic)9781509021826
Publication statusPublished - 6 Oct 2017
Event1st Annual IEEE Conference on Control Technology and Applications, CCTA 2017 - Kohala Coast, United States
Duration: 27 Aug 201730 Aug 2017

Abstract

Mold temperature is a decisive process parameter during vulcanization of rubber articles. Hence, ensuring a homogeneous temperature distribution over the entire mold surface throughout the curing process is a crucial requirement. Therefore, we present a model-based approach to analyze heat propagation within the mold and to design a controller for mold surface temperature. The thermal model of the process was build by means of the heat equation utilizing spatial discretization. Simulations indicated, that the order of the resulting model can be reduced by moment-matching methods maintaining sufficient accuracy. Subsequently, a decentralized PI-controller was designed based on the reduced thermal process model. Reference tracking and disturbance rejection were investigated in simulation and experiment for a vulcanization test bench. The evaluated controller setup allows for fast wide range reference changes and proper compensation of disturbances and eventually, desired homogeneity in mold surface temperature distribution is achieved.

ASJC Scopus subject areas

Cite this

Thermal modeling and decentralized control of mold temperature for a vulcanization test bench. / Bosselmann, Steffen; Frank, Tobias; Wielitzka, Mark et al.
1st Annual IEEE Conference on Control Technology and Applications, CCTA 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 377-382.

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Bosselmann, S, Frank, T, Wielitzka, M, Dagen, M & Ortmaier, T 2017, Thermal modeling and decentralized control of mold temperature for a vulcanization test bench. in 1st Annual IEEE Conference on Control Technology and Applications, CCTA 2017. Institute of Electrical and Electronics Engineers Inc., pp. 377-382, 1st Annual IEEE Conference on Control Technology and Applications, CCTA 2017, Kohala Coast, United States, 27 Aug 2017. https://doi.org/10.1109/ccta.2017.8062491
Bosselmann, S., Frank, T., Wielitzka, M., Dagen, M., & Ortmaier, T. (2017). Thermal modeling and decentralized control of mold temperature for a vulcanization test bench. In 1st Annual IEEE Conference on Control Technology and Applications, CCTA 2017 (pp. 377-382). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ccta.2017.8062491
Bosselmann S, Frank T, Wielitzka M, Dagen M, Ortmaier T. Thermal modeling and decentralized control of mold temperature for a vulcanization test bench. In 1st Annual IEEE Conference on Control Technology and Applications, CCTA 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 377-382 doi: 10.1109/ccta.2017.8062491
Bosselmann, Steffen ; Frank, Tobias ; Wielitzka, Mark et al. / Thermal modeling and decentralized control of mold temperature for a vulcanization test bench. 1st Annual IEEE Conference on Control Technology and Applications, CCTA 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 377-382
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abstract = "Mold temperature is a decisive process parameter during vulcanization of rubber articles. Hence, ensuring a homogeneous temperature distribution over the entire mold surface throughout the curing process is a crucial requirement. Therefore, we present a model-based approach to analyze heat propagation within the mold and to design a controller for mold surface temperature. The thermal model of the process was build by means of the heat equation utilizing spatial discretization. Simulations indicated, that the order of the resulting model can be reduced by moment-matching methods maintaining sufficient accuracy. Subsequently, a decentralized PI-controller was designed based on the reduced thermal process model. Reference tracking and disturbance rejection were investigated in simulation and experiment for a vulcanization test bench. The evaluated controller setup allows for fast wide range reference changes and proper compensation of disturbances and eventually, desired homogeneity in mold surface temperature distribution is achieved.",
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note = "Funding information: ACKNOWLEDGMENT The authors would like to thank the German Federal Ministry for Economic Affairs and Energy (BMWi) as well as Continental Tire Division for funding this project.; 1st Annual IEEE Conference on Control Technology and Applications, CCTA 2017 ; Conference date: 27-08-2017 Through 30-08-2017",
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