The interrelationship between wood temperature, wood moisture content, and fungal decay in the field

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

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Details

Original languageEnglish
Title of host publication19th International Scientific Conference
Subtitle of host publicationWood is Good - Properties, Technology, Valorisation, Application, Proceedings
EditorsIvica Grbac, Vlatka Jirous-Rajkovic
Pages113-120
Number of pages8
ISBN (electronic)9532920048, 9789532920048
Publication statusPublished - 17 Oct 2008
Event19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application - Zagreb, Croatia
Duration: 17 Oct 200817 Oct 2008

Publication series

Name19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings

Abstract

Scots pine sapwood (Pinus sylvestris L.) and Douglas fir heartwood (Pseudotsuga menziesii Franco) specimens were exposed in double layer field trials at 23 different European test sites under different exposure conditions (in total 27 test sets). The material climate in terms of wood moisture content (MC) and wood temperature was automatically monitored over a period of up to seven years and compared with the progress of decay. The overall aim of this study was to establish dose-response relationships between climate factors and decay as a basis for service life prediction of wood. The use of the combined material climatic parameters MC and wood temperature led to a feasible dose-response function and turned out to be a useful basis for service life prediction of wood.

Keywords

    Decay factor, Dose-response function, Material climate, Scheffer Climate Index, Service life prediction

ASJC Scopus subject areas

Cite this

The interrelationship between wood temperature, wood moisture content, and fungal decay in the field. / Brischke, Christian; Rapp, Andreas O.
19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings. ed. / Ivica Grbac; Vlatka Jirous-Rajkovic. 2008. p. 113-120 (19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Brischke, C & Rapp, AO 2008, The interrelationship between wood temperature, wood moisture content, and fungal decay in the field. in I Grbac & V Jirous-Rajkovic (eds), 19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings. 19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings, pp. 113-120, 19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Zagreb, Croatia, 17 Oct 2008.
Brischke, C., & Rapp, A. O. (2008). The interrelationship between wood temperature, wood moisture content, and fungal decay in the field. In I. Grbac, & V. Jirous-Rajkovic (Eds.), 19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings (pp. 113-120). (19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings).
Brischke C, Rapp AO. The interrelationship between wood temperature, wood moisture content, and fungal decay in the field. In Grbac I, Jirous-Rajkovic V, editors, 19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings. 2008. p. 113-120. (19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings).
Brischke, Christian ; Rapp, Andreas O. / The interrelationship between wood temperature, wood moisture content, and fungal decay in the field. 19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings. editor / Ivica Grbac ; Vlatka Jirous-Rajkovic. 2008. pp. 113-120 (19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings).
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