The European Project STRUCTURES: Challenges and Results

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Authors

  • Stefan Van De Beek
  • John Dawson
  • Linda Dawson
  • Ian Flintoft
  • Heyno Garbe
  • Frank Leferink
  • Benjamin Menssen
  • Nicolas Mora
  • Farhad Rachidi
  • Marco Righero
  • Marcos Rubinstein
  • Mirjana Stojilovic

Research Organisations

External Research Organisations

  • University of Twente
  • Univ. York, Dep. Comput. Sci., Non-Stand. Comput. Group
  • Thales
  • École polytechnique fédérale de Lausanne (EPFL)
  • Istituto Superiore Mario Boella (ISMB)
  • School of Engineering and Management Vaud
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Details

Original languageEnglish
Title of host publication2015 IEEE International Symposium on Electromagnetic Compatibility
Subtitle of host publicationEMC
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1095-1100
Number of pages6
ISBN (electronic)9781479966158
Publication statusPublished - 2015
EventIEEE International Symposium on Electromagnetic Compatibility, EMC 2015 - Dresden, Germany
Duration: 16 Aug 201522 Aug 2015

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
Volume2015-Septmber
ISSN (Print)1077-4076
ISSN (electronic)2158-1118

Abstract

The project STRUCTURES, funded by the European Union, started in July 2012 to study problems related to the emerging threats of electromagnetic attacks to critical infrastructures. Partners of the team have worked to list possible threats, identify the main characteristics of the critical infrastructures our way of living depends on, test current protection strategies with different simulation and measurement techniques, and condensate the results in guidelines accessible to an audience wider than the one of people working in the field. Here, we summarize the challenges, the solutions, and the results of almost three years of work.

ASJC Scopus subject areas

Cite this

The European Project STRUCTURES: Challenges and Results. / Van De Beek, Stefan; Dawson, John; Dawson, Linda et al.
2015 IEEE International Symposium on Electromagnetic Compatibility: EMC. Institute of Electrical and Electronics Engineers Inc., 2015. p. 1095-1100 7256321 (IEEE International Symposium on Electromagnetic Compatibility; Vol. 2015-Septmber).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Van De Beek, S, Dawson, J, Dawson, L, Flintoft, I, Garbe, H, Leferink, F, Menssen, B, Mora, N, Rachidi, F, Righero, M, Rubinstein, M & Stojilovic, M 2015, The European Project STRUCTURES: Challenges and Results. in 2015 IEEE International Symposium on Electromagnetic Compatibility: EMC., 7256321, IEEE International Symposium on Electromagnetic Compatibility, vol. 2015-Septmber, Institute of Electrical and Electronics Engineers Inc., pp. 1095-1100, IEEE International Symposium on Electromagnetic Compatibility, EMC 2015, Dresden, Germany, 16 Aug 2015. https://doi.org/10.1109/ISEMC.2015.7256321
Van De Beek, S., Dawson, J., Dawson, L., Flintoft, I., Garbe, H., Leferink, F., Menssen, B., Mora, N., Rachidi, F., Righero, M., Rubinstein, M., & Stojilovic, M. (2015). The European Project STRUCTURES: Challenges and Results. In 2015 IEEE International Symposium on Electromagnetic Compatibility: EMC (pp. 1095-1100). Article 7256321 (IEEE International Symposium on Electromagnetic Compatibility; Vol. 2015-Septmber). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISEMC.2015.7256321
Van De Beek S, Dawson J, Dawson L, Flintoft I, Garbe H, Leferink F et al. The European Project STRUCTURES: Challenges and Results. In 2015 IEEE International Symposium on Electromagnetic Compatibility: EMC. Institute of Electrical and Electronics Engineers Inc. 2015. p. 1095-1100. 7256321. (IEEE International Symposium on Electromagnetic Compatibility). doi: 10.1109/ISEMC.2015.7256321
Van De Beek, Stefan ; Dawson, John ; Dawson, Linda et al. / The European Project STRUCTURES : Challenges and Results. 2015 IEEE International Symposium on Electromagnetic Compatibility: EMC. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 1095-1100 (IEEE International Symposium on Electromagnetic Compatibility).
Download
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