Details
| Original language | English |
|---|---|
| Title of host publication | 2016 18th European Conference on Power Electronics and Applications, EPE 2016 ECCE Europe |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (electronic) | 9789075815245 |
| Publication status | Published - 25 Oct 2016 |
| Event | 18th European Conference on Power Electronics and Applications, EPE 2016 ECCE Europe - Karlsruhe, Germany Duration: 5 Sept 2016 → 9 Sept 2016 |
Publication series
| Name | 2016 18th European Conference on Power Electronics and Applications, EPE 2016 ECCE Europe |
|---|
Abstract
The detection of the junction temperature of power electronic devices during operation plays a central role in reliability and thermal management strategies. The on-state voltage as a TSEP (temperature sensitive electrical parameters) has advantages in terms of applicability and sensitivity to other approaches but it is influenced by the terminal connection voltage. This paper will develop a real-time model for the mean temperature of wire bondings.
Keywords
- bonding wire, device modeling, real time simulation, temperature estimation, thermal management
ASJC Scopus subject areas
- Energy(all)
- Energy Engineering and Power Technology
- Engineering(all)
- Electrical and Electronic Engineering
Cite this
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2016 18th European Conference on Power Electronics and Applications, EPE 2016 ECCE Europe. Institute of Electrical and Electronics Engineers Inc., 2016. 7695579 (2016 18th European Conference on Power Electronics and Applications, EPE 2016 ECCE Europe).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Temperature estimation for wire bondings in power semiconductor devices
AU - Ullrich, Bernhard
AU - Mertens, Axel
PY - 2016/10/25
Y1 - 2016/10/25
N2 - The detection of the junction temperature of power electronic devices during operation plays a central role in reliability and thermal management strategies. The on-state voltage as a TSEP (temperature sensitive electrical parameters) has advantages in terms of applicability and sensitivity to other approaches but it is influenced by the terminal connection voltage. This paper will develop a real-time model for the mean temperature of wire bondings.
AB - The detection of the junction temperature of power electronic devices during operation plays a central role in reliability and thermal management strategies. The on-state voltage as a TSEP (temperature sensitive electrical parameters) has advantages in terms of applicability and sensitivity to other approaches but it is influenced by the terminal connection voltage. This paper will develop a real-time model for the mean temperature of wire bondings.
KW - bonding wire
KW - device modeling
KW - real time simulation
KW - temperature estimation
KW - thermal management
UR - http://www.scopus.com/inward/record.url?scp=84996836199&partnerID=8YFLogxK
U2 - 10.1109/EPE.2016.7695579
DO - 10.1109/EPE.2016.7695579
M3 - Conference contribution
AN - SCOPUS:84996836199
T3 - 2016 18th European Conference on Power Electronics and Applications, EPE 2016 ECCE Europe
BT - 2016 18th European Conference on Power Electronics and Applications, EPE 2016 ECCE Europe
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 18th European Conference on Power Electronics and Applications, EPE 2016 ECCE Europe
Y2 - 5 September 2016 through 9 September 2016
ER -