Details
| Original language | English |
|---|---|
| Pages (from-to) | 100 - 107 |
| Number of pages | 8 |
| Journal | COMPEL - The International Journal for Computation and Mathematics in Electrical and Electronic Engineering |
| Volume | 39 |
| Issue number | 1 |
| Publication status | Published - 16 Dec 2019 |
Abstract
Purpose: This paper aims to deal with different induction and conduction heating approaches to realize a tailored heating of round billets for hot forming processes. In particular, this work examines the limits in which tailor-made temperature profiles can be achieved in the billet. In this way, a flow stress distribution based on the temperature field in the material can be set in a targeted manner, which is decisive for forming processes. Design/methodology/approach: For the heating of round billets by induction, the rotationally symmetric arrangement is used and a parameterized 2D finite element method model is created. The harmonic electromagnetic solution is coupled with the transient thermal solution. For heating by means of conduction, the same procedure is used only with the use of a 3D model. Findings: First results have shown that both methods can achieve very good results for billets with small diameters (d < 30 mm). For larger diameters, an adapted control of the heating process is necessary to ensure through heating of the material. Further investigations are carried out. Practical implications: Using tailored heating for forging billets, several forming steps can be achieved in one step. Among other things, higher energy efficiency and throughput rates can be achieved. Originality/value: The peculiarity of the tailored heating approach is that, in contrast to inhomogeneous heating, where only partial areas are heated, the entire component is heated to the target.
Keywords
- Conduction heating, Finite element method, Forging billet, Genetic algorithm, Induction heating, Numerical simulation, Optimal control, Optimal design, Tailor-made temperature profiles, Thermal analysis
ASJC Scopus subject areas
- Computer Science(all)
- Computer Science Applications
- Computer Science(all)
- Computational Theory and Mathematics
- Engineering(all)
- Electrical and Electronic Engineering
- Mathematics(all)
- Applied Mathematics
Sustainable Development Goals
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In: COMPEL - The International Journal for Computation and Mathematics in Electrical and Electronic Engineering, Vol. 39, No. 1, 16.12.2019, p. 100 - 107.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Tailored heating of forging billets using induction and conduction heating approaches
AU - Schulze, Martin
AU - Baake, Egbert
N1 - Publisher Copyright: © 2019, Emerald Publishing Limited.
PY - 2019/12/16
Y1 - 2019/12/16
N2 - Purpose: This paper aims to deal with different induction and conduction heating approaches to realize a tailored heating of round billets for hot forming processes. In particular, this work examines the limits in which tailor-made temperature profiles can be achieved in the billet. In this way, a flow stress distribution based on the temperature field in the material can be set in a targeted manner, which is decisive for forming processes. Design/methodology/approach: For the heating of round billets by induction, the rotationally symmetric arrangement is used and a parameterized 2D finite element method model is created. The harmonic electromagnetic solution is coupled with the transient thermal solution. For heating by means of conduction, the same procedure is used only with the use of a 3D model. Findings: First results have shown that both methods can achieve very good results for billets with small diameters (d < 30 mm). For larger diameters, an adapted control of the heating process is necessary to ensure through heating of the material. Further investigations are carried out. Practical implications: Using tailored heating for forging billets, several forming steps can be achieved in one step. Among other things, higher energy efficiency and throughput rates can be achieved. Originality/value: The peculiarity of the tailored heating approach is that, in contrast to inhomogeneous heating, where only partial areas are heated, the entire component is heated to the target.
AB - Purpose: This paper aims to deal with different induction and conduction heating approaches to realize a tailored heating of round billets for hot forming processes. In particular, this work examines the limits in which tailor-made temperature profiles can be achieved in the billet. In this way, a flow stress distribution based on the temperature field in the material can be set in a targeted manner, which is decisive for forming processes. Design/methodology/approach: For the heating of round billets by induction, the rotationally symmetric arrangement is used and a parameterized 2D finite element method model is created. The harmonic electromagnetic solution is coupled with the transient thermal solution. For heating by means of conduction, the same procedure is used only with the use of a 3D model. Findings: First results have shown that both methods can achieve very good results for billets with small diameters (d < 30 mm). For larger diameters, an adapted control of the heating process is necessary to ensure through heating of the material. Further investigations are carried out. Practical implications: Using tailored heating for forging billets, several forming steps can be achieved in one step. Among other things, higher energy efficiency and throughput rates can be achieved. Originality/value: The peculiarity of the tailored heating approach is that, in contrast to inhomogeneous heating, where only partial areas are heated, the entire component is heated to the target.
KW - Conduction heating
KW - Finite element method
KW - Forging billet
KW - Genetic algorithm
KW - Induction heating
KW - Numerical simulation
KW - Optimal control
KW - Optimal design
KW - Tailor-made temperature profiles
KW - Thermal analysis
UR - http://www.scopus.com/inward/record.url?scp=85077611193&partnerID=8YFLogxK
U2 - 10.1108/compel-05-2019-0217
DO - 10.1108/compel-05-2019-0217
M3 - Article
VL - 39
SP - 100
EP - 107
JO - COMPEL - The International Journal for Computation and Mathematics in Electrical and Electronic Engineering
JF - COMPEL - The International Journal for Computation and Mathematics in Electrical and Electronic Engineering
SN - 0332-1649
IS - 1
ER -