Details
| Original language | English |
|---|---|
| Title of host publication | Proceedings |
| Subtitle of host publication | IEEE 68th Electronic Components and Technology Conference, ECTC 2018 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 1396-1401 |
| Number of pages | 6 |
| ISBN (print) | 9781538649985 |
| Publication status | Published - 7 Aug 2018 |
| Event | 68th IEEE Electronic Components and Technology Conference, ECTC 2018 - San Diego, United States Duration: 29 May 2018 → 1 Jun 2018 |
Publication series
| Name | Proceedings - Electronic Components and Technology Conference |
|---|---|
| Volume | 2018-May |
| ISSN (Print) | 0569-5503 |
Abstract
A new manufacturing technique for low cost sensor production was developed at the Institute of Micro Production Technology at the Leibniz University Hanover. The herein described manufacturing technique uses common injection molding processes to pre-structure thermoplastic polymers such as Polycarbonate, which can subsequently be used as a substrate to build up sensor structures. The sensor structures are generated by sputter deposition and a following chemical mechanical polishing step. The realized sensor structure can be manufactured neglecting any lithography processes and therefore eliminates expensive clean room technology. This work investigates and optimizes injection molding parameter using design of experiment methods. Following the parameter studies, a manufacturing process designed to realize a micro technologically fabricated injection mold inlay was performed, and the performance of an electroplated Ni based injection mold master form for sensor structure manufacturing evaluated. A temperature sensor on a thermoplastic substrate (polycarbonate) prototype was realized, which was able to prove the feasibility of the manufacturing technique and the robustness of polymers as a substrate material.
Keywords
- Injection molding, Manufacturing technology, Polymer substrate, Pt sensor
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Engineering(all)
- Electrical and Electronic Engineering
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Proceedings: IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1396-1401 8429726 (Proceedings - Electronic Components and Technology Conference; Vol. 2018-May).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Structuring methods of polymers for low cost sensor manufacturing
AU - Bengsch, Sebastian
AU - Wurz, Marc Christopher
AU - Aue, Maximilian
AU - De Wall, Sascha
N1 - Funding Information: ACKNOWLEDGMENT I would like to thank the Institute of Micro Production Technology as well as the Leibniz University Hannover for the opportunity and the equipment to develop this manufacturing technique for low cost sensor production. Further thanks goes out to my co-author and supervisor Dr.-Ing. M.C. Wurz for the excellent supervision regarding this project as well as the support from Maximilian Aue, Sascha de Wall, and especially Jürgen Becker. Publisher Copyright: © 2018 IEEE. Copyright: Copyright 2018 Elsevier B.V., All rights reserved.
PY - 2018/8/7
Y1 - 2018/8/7
N2 - A new manufacturing technique for low cost sensor production was developed at the Institute of Micro Production Technology at the Leibniz University Hanover. The herein described manufacturing technique uses common injection molding processes to pre-structure thermoplastic polymers such as Polycarbonate, which can subsequently be used as a substrate to build up sensor structures. The sensor structures are generated by sputter deposition and a following chemical mechanical polishing step. The realized sensor structure can be manufactured neglecting any lithography processes and therefore eliminates expensive clean room technology. This work investigates and optimizes injection molding parameter using design of experiment methods. Following the parameter studies, a manufacturing process designed to realize a micro technologically fabricated injection mold inlay was performed, and the performance of an electroplated Ni based injection mold master form for sensor structure manufacturing evaluated. A temperature sensor on a thermoplastic substrate (polycarbonate) prototype was realized, which was able to prove the feasibility of the manufacturing technique and the robustness of polymers as a substrate material.
AB - A new manufacturing technique for low cost sensor production was developed at the Institute of Micro Production Technology at the Leibniz University Hanover. The herein described manufacturing technique uses common injection molding processes to pre-structure thermoplastic polymers such as Polycarbonate, which can subsequently be used as a substrate to build up sensor structures. The sensor structures are generated by sputter deposition and a following chemical mechanical polishing step. The realized sensor structure can be manufactured neglecting any lithography processes and therefore eliminates expensive clean room technology. This work investigates and optimizes injection molding parameter using design of experiment methods. Following the parameter studies, a manufacturing process designed to realize a micro technologically fabricated injection mold inlay was performed, and the performance of an electroplated Ni based injection mold master form for sensor structure manufacturing evaluated. A temperature sensor on a thermoplastic substrate (polycarbonate) prototype was realized, which was able to prove the feasibility of the manufacturing technique and the robustness of polymers as a substrate material.
KW - Injection molding
KW - Manufacturing technology
KW - Polymer substrate
KW - Pt sensor
UR - http://www.scopus.com/inward/record.url?scp=85051993748&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2018.00213
DO - 10.1109/ECTC.2018.00213
M3 - Conference contribution
AN - SCOPUS:85051993748
SN - 9781538649985
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1396
EP - 1401
BT - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 68th IEEE Electronic Components and Technology Conference, ECTC 2018
Y2 - 29 May 2018 through 1 June 2018
ER -