Details
| Original language | English |
|---|---|
| Title of host publication | Magnetic Materials Processes and Devices 14 |
| Editors | C. Bonhote, G. Zangari, Y. Kitamoto, T. Osaka, H. H. Gatzen |
| Publisher | Electrochemical Society, Inc. |
| Pages | 67-73 |
| Number of pages | 7 |
| Volume | 75 |
| Edition | 2 |
| ISBN (electronic) | 9781607685395 |
| Publication status | Published - 2016 |
| Event | Symposium on Magnetic Materials Processes and Devices 14 - PRiME 2016/230th ECS Meeting - Honolulu, United States Duration: 2 Oct 2016 → 7 Oct 2016 |
Publication series
| Name | MAGNETIC MATERIALS PROCESSES AND DEVICES 14 |
|---|---|
| ISSN (Print) | 1938-5862 |
Abstract
New approaches of packaging of integrated circuits show the need of flexible and cheap materials. Polymers offer possibilities regarding the flexibility and mass production opportunities in terms of roll to roll production for foil technology based substrates, as well the use of injection molding for more complex threedimensional housings, circuits, electronics and even sensor actor arrays (2,3,4,5). A new manufacturing strategy to produce pre-structured wafer substrates which can be used for electroplating processes without the need of photolithography is developed. Important process steps are injection molding, sputter deposition, electroplating, chemical mechanical polishing and micro end milling. These manufacturing processes are not in the need of clean room technology and abstain from any lithography processes. Therefore this idea can be interesting for low cost production systems which exclude expensive clean room technology and expensive substrate materials without functionalized properties.
ASJC Scopus subject areas
- Engineering(all)
- General Engineering
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Magnetic Materials Processes and Devices 14. ed. / C. Bonhote; G. Zangari; Y. Kitamoto; T. Osaka; H. H. Gatzen. Vol. 75 2. ed. Electrochemical Society, Inc., 2016. p. 67-73 (MAGNETIC MATERIALS PROCESSES AND DEVICES 14).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Structuring methods of plastic substrates for electroplating applications
AU - Bengsch, Sebastian
AU - Rechel, Mathias
AU - Asadi, Esmail
AU - Wurz, Marc Christopher
PY - 2016
Y1 - 2016
N2 - New approaches of packaging of integrated circuits show the need of flexible and cheap materials. Polymers offer possibilities regarding the flexibility and mass production opportunities in terms of roll to roll production for foil technology based substrates, as well the use of injection molding for more complex threedimensional housings, circuits, electronics and even sensor actor arrays (2,3,4,5). A new manufacturing strategy to produce pre-structured wafer substrates which can be used for electroplating processes without the need of photolithography is developed. Important process steps are injection molding, sputter deposition, electroplating, chemical mechanical polishing and micro end milling. These manufacturing processes are not in the need of clean room technology and abstain from any lithography processes. Therefore this idea can be interesting for low cost production systems which exclude expensive clean room technology and expensive substrate materials without functionalized properties.
AB - New approaches of packaging of integrated circuits show the need of flexible and cheap materials. Polymers offer possibilities regarding the flexibility and mass production opportunities in terms of roll to roll production for foil technology based substrates, as well the use of injection molding for more complex threedimensional housings, circuits, electronics and even sensor actor arrays (2,3,4,5). A new manufacturing strategy to produce pre-structured wafer substrates which can be used for electroplating processes without the need of photolithography is developed. Important process steps are injection molding, sputter deposition, electroplating, chemical mechanical polishing and micro end milling. These manufacturing processes are not in the need of clean room technology and abstain from any lithography processes. Therefore this idea can be interesting for low cost production systems which exclude expensive clean room technology and expensive substrate materials without functionalized properties.
UR - http://www.scopus.com/inward/record.url?scp=84991720951&partnerID=8YFLogxK
U2 - 10.1149/07502.0067ecst
DO - 10.1149/07502.0067ecst
M3 - Conference contribution
AN - SCOPUS:84991720951
VL - 75
T3 - MAGNETIC MATERIALS PROCESSES AND DEVICES 14
SP - 67
EP - 73
BT - Magnetic Materials Processes and Devices 14
A2 - Bonhote, C.
A2 - Zangari, G.
A2 - Kitamoto, Y.
A2 - Osaka, T.
A2 - Gatzen, H. H.
PB - Electrochemical Society, Inc.
T2 - Symposium on Magnetic Materials Processes and Devices 14 - PRiME 2016/230th ECS Meeting
Y2 - 2 October 2016 through 7 October 2016
ER -