Stress-induced dislocation generation in large FZ- and CZ-silicon single crystals - Numerical model and qualitative considerations

Research output: Contribution to journalConference articleResearchpeer review

Authors

  • A. Muižnieks
  • G. Raming
  • A. Mühlbauer
  • J. Virbulis
  • B. Hanna
  • W. V. Ammon

External Research Organisations

  • University of Latvia
  • Siltronic AG
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Details

Original languageEnglish
Pages (from-to)305-313
Number of pages9
JournalJournal of crystal growth
Volume230
Issue number1-2
Early online date10 Jul 2001
Publication statusPublished - Aug 2001

Abstract

When growing silicon crystals with higher diameter (presently up to 300 mm) the thermal stresses and possible dislocation generation in single crystals become a serious problem for both FZ- and CZ-methods. A two-dimensional problem oriented code for the FEM-package ANSYS has been developed to calculate the temperature field in the growing crystal considering radiation exchange with reflectors and environment and thermal stresses. Comparing calculated stresses with critical stresses, the dislocated zone is determined. A qualitative concept for the occurrence of dislocations using the metastable state is developed. In a parametric study for different thermal boundary conditions and crystal geometries, the thermal stresses are calculated and are discussed. From this, some hints on how to reduce stress and avoid dislocation generation are deduced.

Keywords

    A1. Computer simulation, A1. Stresses, A2. Czochralski method, A2. Floating zone technique, B2. Semiconducting silicon

ASJC Scopus subject areas

Cite this

Stress-induced dislocation generation in large FZ- and CZ-silicon single crystals - Numerical model and qualitative considerations. / Muižnieks, A.; Raming, G.; Mühlbauer, A. et al.
In: Journal of crystal growth, Vol. 230, No. 1-2, 08.2001, p. 305-313.

Research output: Contribution to journalConference articleResearchpeer review

Muižnieks A, Raming G, Mühlbauer A, Virbulis J, Hanna B, Ammon WV. Stress-induced dislocation generation in large FZ- and CZ-silicon single crystals - Numerical model and qualitative considerations. Journal of crystal growth. 2001 Aug;230(1-2):305-313. Epub 2001 Jul 10. doi: 10.1016/S0022-0248(01)01322-7
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abstract = "When growing silicon crystals with higher diameter (presently up to 300 mm) the thermal stresses and possible dislocation generation in single crystals become a serious problem for both FZ- and CZ-methods. A two-dimensional problem oriented code for the FEM-package ANSYS has been developed to calculate the temperature field in the growing crystal considering radiation exchange with reflectors and environment and thermal stresses. Comparing calculated stresses with critical stresses, the dislocated zone is determined. A qualitative concept for the occurrence of dislocations using the metastable state is developed. In a parametric study for different thermal boundary conditions and crystal geometries, the thermal stresses are calculated and are discussed. From this, some hints on how to reduce stress and avoid dislocation generation are deduced.",
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T1 - Stress-induced dislocation generation in large FZ- and CZ-silicon single crystals - Numerical model and qualitative considerations

AU - Muižnieks, A.

AU - Raming, G.

AU - Mühlbauer, A.

AU - Virbulis, J.

AU - Hanna, B.

AU - Ammon, W. V.

N1 - Copyright: Copyright 2007 Elsevier B.V., All rights reserved.

PY - 2001/8

Y1 - 2001/8

N2 - When growing silicon crystals with higher diameter (presently up to 300 mm) the thermal stresses and possible dislocation generation in single crystals become a serious problem for both FZ- and CZ-methods. A two-dimensional problem oriented code for the FEM-package ANSYS has been developed to calculate the temperature field in the growing crystal considering radiation exchange with reflectors and environment and thermal stresses. Comparing calculated stresses with critical stresses, the dislocated zone is determined. A qualitative concept for the occurrence of dislocations using the metastable state is developed. In a parametric study for different thermal boundary conditions and crystal geometries, the thermal stresses are calculated and are discussed. From this, some hints on how to reduce stress and avoid dislocation generation are deduced.

AB - When growing silicon crystals with higher diameter (presently up to 300 mm) the thermal stresses and possible dislocation generation in single crystals become a serious problem for both FZ- and CZ-methods. A two-dimensional problem oriented code for the FEM-package ANSYS has been developed to calculate the temperature field in the growing crystal considering radiation exchange with reflectors and environment and thermal stresses. Comparing calculated stresses with critical stresses, the dislocated zone is determined. A qualitative concept for the occurrence of dislocations using the metastable state is developed. In a parametric study for different thermal boundary conditions and crystal geometries, the thermal stresses are calculated and are discussed. From this, some hints on how to reduce stress and avoid dislocation generation are deduced.

KW - A1. Computer simulation

KW - A1. Stresses

KW - A2. Czochralski method

KW - A2. Floating zone technique

KW - B2. Semiconducting silicon

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