Details
Original language | English |
---|---|
Pages (from-to) | 162-168 |
Journal | Procedia Technology |
Volume | 26 |
Publication status | Published - 1 Oct 2016 |
Keywords
- Flexible Substrate, Collaborative Research Center 653, stress in metallic thin films
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In: Procedia Technology, Vol. 26, 01.10.2016, p. 162-168.
Research output: Contribution to journal › Conference article › Research
}
TY - JOUR
T1 - Stress Reduction in Sputtered Thin NiFe 81/19 Layers for Magnetic Field Sensors
AU - Jogschies, Lisa
AU - Rittinger, Johannes
AU - Klaas, Daniel
AU - Wurz, Marc
PY - 2016/10/1
Y1 - 2016/10/1
KW - Flexible Substrate
KW - Collaborative Research Center 653
KW - stress in metallic thin films
U2 - 10.1016/j.protcy.2016.08.022
DO - 10.1016/j.protcy.2016.08.022
M3 - Conference article
VL - 26
SP - 162
EP - 168
JO - Procedia Technology
JF - Procedia Technology
SN - 2212-0173
ER -