Stress Reduction in Sputtered Thin NiFe 81/19 Layers for Magnetic Field Sensors

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Original languageEnglish
Pages (from-to)162-168
JournalProcedia Technology
Volume26
Publication statusPublished - 1 Oct 2016

Keywords

    Flexible Substrate, Collaborative Research Center 653, stress in metallic thin films

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Stress Reduction in Sputtered Thin NiFe 81/19 Layers for Magnetic Field Sensors. / Jogschies, Lisa; Rittinger, Johannes; Klaas, Daniel et al.
In: Procedia Technology, Vol. 26, 01.10.2016, p. 162-168.

Research output: Contribution to journalConference articleResearch

Jogschies L, Rittinger J, Klaas D, Wurz M. Stress Reduction in Sputtered Thin NiFe 81/19 Layers for Magnetic Field Sensors. Procedia Technology. 2016 Oct 1;26:162-168. doi: 10.1016/j.protcy.2016.08.022
Jogschies, Lisa ; Rittinger, Johannes ; Klaas, Daniel et al. / Stress Reduction in Sputtered Thin NiFe 81/19 Layers for Magnetic Field Sensors. In: Procedia Technology. 2016 ; Vol. 26. pp. 162-168.
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title = "Stress Reduction in Sputtered Thin NiFe 81/19 Layers for Magnetic Field Sensors",
keywords = "Flexible Substrate, Collaborative Research Center 653, stress in metallic thin films",
author = "Lisa Jogschies and Johannes Rittinger and Daniel Klaas and Marc Wurz",
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TY - JOUR

T1 - Stress Reduction in Sputtered Thin NiFe 81/19 Layers for Magnetic Field Sensors

AU - Jogschies, Lisa

AU - Rittinger, Johannes

AU - Klaas, Daniel

AU - Wurz, Marc

PY - 2016/10/1

Y1 - 2016/10/1

KW - Flexible Substrate

KW - Collaborative Research Center 653

KW - stress in metallic thin films

U2 - 10.1016/j.protcy.2016.08.022

DO - 10.1016/j.protcy.2016.08.022

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JO - Procedia Technology

JF - Procedia Technology

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ER -

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