Strain relaxation of thin Ge films on Si(001) grown by carbon-mediated epitaxy

Research output: Contribution to journalArticleResearchpeer review

Authors

  • D. Tetzlaff
  • T. F. Wietler
  • E. Bugiel
  • H. J. Osten
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Details

Original languageEnglish
Pages (from-to)254-258
Number of pages5
JournalJournal of crystal growth
Volume378
Early online date3 Jan 2013
Publication statusPublished - 1 Sept 2013

Abstract

Strain relaxation of thin Ge layers grown by carbon-mediated epitaxy at 50 °C on Si(001) was investigated for a multi-step growth procedure. Additionally, the impact of the post-growth annealing temperature on the strain relaxation obtained for a single carbon-mediated growth step was analyzed. The degree of relaxation was monitored in situ by reflection high energy electron diffraction and ex situ by high-resolution x-ray diffraction and transmission electron microscopy. For multi-step growth, relaxation occurs mainly during the first cycle (growth and annealing). Full relaxation is already achieved after 3-4 cycles. The relaxation process during a single growth cycle can be divided into three sections: annealing up to 200 °C is sufficient to trigger most of the strain relaxation. After annealing up to 450 °C, the film lattice parameter already equals the Ge bulk value, though the layer shows a rough surface. Only an annealing step up to 650 °C results in a smooth surface and interface. Smooth and fully relaxed Ge films of only 26 nm thicknesses were obtained by carbon-mediated growth.

Keywords

    Characterization, Diffraction, Molecular beam epitaxy, Reflection high energy electron, Semiconducting germanium, Stresses

ASJC Scopus subject areas

Cite this

Strain relaxation of thin Ge films on Si(001) grown by carbon-mediated epitaxy. / Tetzlaff, D.; Wietler, T. F.; Bugiel, E. et al.
In: Journal of crystal growth, Vol. 378, 01.09.2013, p. 254-258.

Research output: Contribution to journalArticleResearchpeer review

Tetzlaff D, Wietler TF, Bugiel E, Osten HJ. Strain relaxation of thin Ge films on Si(001) grown by carbon-mediated epitaxy. Journal of crystal growth. 2013 Sept 1;378:254-258. Epub 2013 Jan 3. doi: 10.1016/j.jcrysgro.2012.12.087
Tetzlaff, D. ; Wietler, T. F. ; Bugiel, E. et al. / Strain relaxation of thin Ge films on Si(001) grown by carbon-mediated epitaxy. In: Journal of crystal growth. 2013 ; Vol. 378. pp. 254-258.
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AU - Tetzlaff, D.

AU - Wietler, T. F.

AU - Bugiel, E.

AU - Osten, H. J.

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AB - Strain relaxation of thin Ge layers grown by carbon-mediated epitaxy at 50 °C on Si(001) was investigated for a multi-step growth procedure. Additionally, the impact of the post-growth annealing temperature on the strain relaxation obtained for a single carbon-mediated growth step was analyzed. The degree of relaxation was monitored in situ by reflection high energy electron diffraction and ex situ by high-resolution x-ray diffraction and transmission electron microscopy. For multi-step growth, relaxation occurs mainly during the first cycle (growth and annealing). Full relaxation is already achieved after 3-4 cycles. The relaxation process during a single growth cycle can be divided into three sections: annealing up to 200 °C is sufficient to trigger most of the strain relaxation. After annealing up to 450 °C, the film lattice parameter already equals the Ge bulk value, though the layer shows a rough surface. Only an annealing step up to 650 °C results in a smooth surface and interface. Smooth and fully relaxed Ge films of only 26 nm thicknesses were obtained by carbon-mediated growth.

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KW - Diffraction

KW - Molecular beam epitaxy

KW - Reflection high energy electron

KW - Semiconducting germanium

KW - Stresses

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