Details
| Original language | German |
|---|---|
| Publication status | Published - 2015 |
| Event | SMTA Pan Pacific Microelectronics Symposium - Kauai, Hawaii, United States Duration: 2 Feb 2015 → 5 Feb 2015 |
Conference
| Conference | SMTA Pan Pacific Microelectronics Symposium |
|---|---|
| Country/Territory | United States |
| Period | 2 Feb 2015 → 5 Feb 2015 |
Cite this
- Standard
- Harvard
- Apa
- Vancouver
- BibTeX
- RIS
Smart System Integration: Moulding of Magnetic Field Sensors into AlSi9Cu3(Fe)-Alloys. / Wurz, Marc; Klaas, Daniel; Wienecke, Anja et al.
2015. Paper presented at SMTA Pan Pacific Microelectronics Symposium, United States.
2015. Paper presented at SMTA Pan Pacific Microelectronics Symposium, United States.
Research output: Contribution to conference › Paper › Research
Wurz, M, Klaas, D, Wienecke, A, Rissing, L, Freytag, P & Maier, H-J 2015, 'Smart System Integration: Moulding of Magnetic Field Sensors into AlSi9Cu3(Fe)-Alloys', Paper presented at SMTA Pan Pacific Microelectronics Symposium, United States, 2 Feb 2015 - 5 Feb 2015.
Wurz, M., Klaas, D., Wienecke, A., Rissing, L., Freytag, P., & Maier, H.-J. (2015). Smart System Integration: Moulding of Magnetic Field Sensors into AlSi9Cu3(Fe)-Alloys. Paper presented at SMTA Pan Pacific Microelectronics Symposium, United States.
Wurz M, Klaas D, Wienecke A, Rissing L, Freytag P, Maier HJ. Smart System Integration: Moulding of Magnetic Field Sensors into AlSi9Cu3(Fe)-Alloys. 2015. Paper presented at SMTA Pan Pacific Microelectronics Symposium, United States.
Download
@conference{cae1676720a34b2fa8e88aa159617b96,
title = "Smart System Integration: Moulding of Magnetic Field Sensors into AlSi9Cu3(Fe)-Alloys",
author = "Marc Wurz and Daniel Klaas and Anja Wienecke and Lutz Rissing and Patrik Freytag and Hans-J{\"u}rgen Maier",
year = "2015",
language = "Deutsch",
note = "SMTA Pan Pacific Microelectronics Symposium ; Conference date: 02-02-2015 Through 05-02-2015",
}
Download
TY - CONF
T1 - Smart System Integration: Moulding of Magnetic Field Sensors into AlSi9Cu3(Fe)-Alloys
AU - Wurz, Marc
AU - Klaas, Daniel
AU - Wienecke, Anja
AU - Rissing, Lutz
AU - Freytag, Patrik
AU - Maier, Hans-Jürgen
PY - 2015
Y1 - 2015
M3 - Paper
T2 - SMTA Pan Pacific Microelectronics Symposium
Y2 - 2 February 2015 through 5 February 2015
ER -