Details
| Original language | English |
|---|---|
| Title of host publication | Proceedings - ECTC 2016 |
| Subtitle of host publication | 66th Electronic Components and Technology Conference |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 1977-1983 |
| Number of pages | 7 |
| ISBN (electronic) | 9781509012039 |
| Publication status | Published - 16 Aug 2016 |
| Event | 66th IEEE Electronic Components and Technology Conference, ECTC 2016 - Las Vegas, United States Duration: 31 May 2016 → 3 Jun 2016 |
Publication series
| Name | Proceedings - Electronic Components and Technology Conference |
|---|---|
| Volume | 2016-August |
| ISSN (Print) | 0569-5503 |
Abstract
With the constant innovation and development of the advanced materials and technologies in the field of optoelectronics, a variety of applications adopting the benefits of optoelectronics is increasingly penetrating into our daily routines. The way of packaging has a huge impact on the performance of optoelectronics in mechanical, electrical as well as optical properties. Particularly, flexible packaging is becoming a trend thanks to its compatibility to any irregular surfaces in diverse applications. By employing transparent polymer foils, such as polymethyl methacrylate (PMMA) and polyethylene terephthalate (PET), as carrier substrates for optoelectronic packaging, a greater mechanical flexibility can be achieved. Their transparency expands the range of application, for instance in optical sensing areas. In addition, they are mostly cost-effective, which enables an economical roll-To-roll manufacturing process. However, the challenge of using them is their low glass transition temperatures. In previous works, a novel optodic bonding process employing UV curable adhesives for processing these thermally sensitive polymer foils was introduced and verified as a promising technology for flexible optoelectronic packaging. In this work, we conduct further investigations of its mechanical reliability with the focus on the aspect of flexibility. FEM-based simulations for emulating various mechanical loadings including shear, bending and tensile stresses are implemented. We perform analyses of the influencing factors, particularly their degree of efficiency on the mechanical stability, e.g. The material properties of the optoelectronic components, the employed polymers as well as the bonding adhesives. These comprehensive investigations establish a constructive guideline for choosing materials for flexible optoelectronic packaging. In addition to this, we attain a convincing statement for the reliable feasibility of the optodic bonded packages with respect to a sufficient mechanical flexibility and stability.
Keywords
- FEM-simulations, Flexible substrates, Flip chip bonding, Mechanical reliability, Optoelectronic packaging, Polymer foils, UV-curing adhesives
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Engineering(all)
- Electrical and Electronic Engineering
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Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 2016. p. 1977-1983 7545694 (Proceedings - Electronic Components and Technology Conference; Vol. 2016-August).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Simulative Investigations of the Mechanical Reliability of the Flexible Optoelectronic Packaging Using Optodic Bonding
AU - Wang, Yixiao
AU - Yang, Xiaoxu
AU - Overmeyer, Ludger
PY - 2016/8/16
Y1 - 2016/8/16
N2 - With the constant innovation and development of the advanced materials and technologies in the field of optoelectronics, a variety of applications adopting the benefits of optoelectronics is increasingly penetrating into our daily routines. The way of packaging has a huge impact on the performance of optoelectronics in mechanical, electrical as well as optical properties. Particularly, flexible packaging is becoming a trend thanks to its compatibility to any irregular surfaces in diverse applications. By employing transparent polymer foils, such as polymethyl methacrylate (PMMA) and polyethylene terephthalate (PET), as carrier substrates for optoelectronic packaging, a greater mechanical flexibility can be achieved. Their transparency expands the range of application, for instance in optical sensing areas. In addition, they are mostly cost-effective, which enables an economical roll-To-roll manufacturing process. However, the challenge of using them is their low glass transition temperatures. In previous works, a novel optodic bonding process employing UV curable adhesives for processing these thermally sensitive polymer foils was introduced and verified as a promising technology for flexible optoelectronic packaging. In this work, we conduct further investigations of its mechanical reliability with the focus on the aspect of flexibility. FEM-based simulations for emulating various mechanical loadings including shear, bending and tensile stresses are implemented. We perform analyses of the influencing factors, particularly their degree of efficiency on the mechanical stability, e.g. The material properties of the optoelectronic components, the employed polymers as well as the bonding adhesives. These comprehensive investigations establish a constructive guideline for choosing materials for flexible optoelectronic packaging. In addition to this, we attain a convincing statement for the reliable feasibility of the optodic bonded packages with respect to a sufficient mechanical flexibility and stability.
AB - With the constant innovation and development of the advanced materials and technologies in the field of optoelectronics, a variety of applications adopting the benefits of optoelectronics is increasingly penetrating into our daily routines. The way of packaging has a huge impact on the performance of optoelectronics in mechanical, electrical as well as optical properties. Particularly, flexible packaging is becoming a trend thanks to its compatibility to any irregular surfaces in diverse applications. By employing transparent polymer foils, such as polymethyl methacrylate (PMMA) and polyethylene terephthalate (PET), as carrier substrates for optoelectronic packaging, a greater mechanical flexibility can be achieved. Their transparency expands the range of application, for instance in optical sensing areas. In addition, they are mostly cost-effective, which enables an economical roll-To-roll manufacturing process. However, the challenge of using them is their low glass transition temperatures. In previous works, a novel optodic bonding process employing UV curable adhesives for processing these thermally sensitive polymer foils was introduced and verified as a promising technology for flexible optoelectronic packaging. In this work, we conduct further investigations of its mechanical reliability with the focus on the aspect of flexibility. FEM-based simulations for emulating various mechanical loadings including shear, bending and tensile stresses are implemented. We perform analyses of the influencing factors, particularly their degree of efficiency on the mechanical stability, e.g. The material properties of the optoelectronic components, the employed polymers as well as the bonding adhesives. These comprehensive investigations establish a constructive guideline for choosing materials for flexible optoelectronic packaging. In addition to this, we attain a convincing statement for the reliable feasibility of the optodic bonded packages with respect to a sufficient mechanical flexibility and stability.
KW - FEM-simulations
KW - Flexible substrates
KW - Flip chip bonding
KW - Mechanical reliability
KW - Optoelectronic packaging
KW - Polymer foils
KW - UV-curing adhesives
UR - http://www.scopus.com/inward/record.url?scp=84987792895&partnerID=8YFLogxK
U2 - 10.1109/ectc.2016.216
DO - 10.1109/ectc.2016.216
M3 - Conference contribution
AN - SCOPUS:84987792895
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1977
EP - 1983
BT - Proceedings - ECTC 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 66th IEEE Electronic Components and Technology Conference, ECTC 2016
Y2 - 31 May 2016 through 3 June 2016
ER -