Details
| Translated title of the contribution | Simulation-based design and processing of piezoelectric force sensor arrays for investigation of ultrasonic wire bonding |
|---|---|
| Original language | German |
| Title of host publication | MikroSystemTechnik Kongress 2021 |
| Subtitle of host publication | Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings |
| Publisher | VDE Verlag GmbH |
| Pages | 742-745 |
| Number of pages | 4 |
| ISBN (electronic) | 9783800756575 |
| Publication status | Published - 2021 |
| Event | MikroSystemTechnik Congress 2021: Microelectronics, Microsystems Engineering and their Applications - Innovative Products for Future-Oriented Markets - Stuttgart-Ludwigsburg, Germany Duration: 8 Nov 2021 → 10 Nov 2021 |
Publication series
| Name | MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings |
|---|
Abstract
A current research topic at the Institute of Microproduction Technology (IMPT) includes a novel 4x3 force sensor array for in-situ investigations of the ultrasonic wire bonding process. The array is based on the piezoelectric ceramic lead zirconate titanate, which is first cut into individual columns using precision dicing and then filled with a polymer. In the future, the resulting sensor system will be used to measure the local tangential forces that occur at the interface between wire and substrate during wire bonding.
ASJC Scopus subject areas
- Computer Science(all)
- Hardware and Architecture
- Engineering(all)
- Electrical and Electronic Engineering
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
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MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings. VDE Verlag GmbH, 2021. p. 742-745 (MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Simulationsgestützte Auslegung und Fertigung von piezoelektrischen Kraftsensor-Arrays zur Untersuchung des Ultraschall-Drahtbondprozesses
AU - Arndt, Matthias
AU - Wurz, Marc Christopher
AU - Dencker, Folke
AU - Long, Yangyang
AU - Twiefel, Jens
PY - 2021
Y1 - 2021
N2 - A current research topic at the Institute of Microproduction Technology (IMPT) includes a novel 4x3 force sensor array for in-situ investigations of the ultrasonic wire bonding process. The array is based on the piezoelectric ceramic lead zirconate titanate, which is first cut into individual columns using precision dicing and then filled with a polymer. In the future, the resulting sensor system will be used to measure the local tangential forces that occur at the interface between wire and substrate during wire bonding.
AB - A current research topic at the Institute of Microproduction Technology (IMPT) includes a novel 4x3 force sensor array for in-situ investigations of the ultrasonic wire bonding process. The array is based on the piezoelectric ceramic lead zirconate titanate, which is first cut into individual columns using precision dicing and then filled with a polymer. In the future, the resulting sensor system will be used to measure the local tangential forces that occur at the interface between wire and substrate during wire bonding.
UR - http://www.scopus.com/inward/record.url?scp=85125203522&partnerID=8YFLogxK
M3 - Aufsatz in Konferenzband
AN - SCOPUS:85125203522
T3 - MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings
SP - 742
EP - 745
BT - MikroSystemTechnik Kongress 2021
PB - VDE Verlag GmbH
T2 - MikroSystemTechnik Kongress 2021
Y2 - 8 November 2021 through 10 November 2021
ER -