Details
| Original language | English |
|---|---|
| Title of host publication | IMAPS Nordic Annual Conference 2016 Proceedings |
| Editors | Jarkko Kutilainen |
| Publisher | IMAPS-International Microelectronics and Packaging Society |
| ISBN (electronic) | 9781510827226 |
| Publication status | Published - 2016 |
| Event | IMAPS Nordic Annual Conference 2016 - Tonsberg, Norway Duration: 5 Jun 2016 → 7 Jun 2016 |
Publication series
| Name | IMAPS Nordic Annual Conference 2016 Proceedings |
|---|
Abstract
In the frame of ULSI under the requirement of higher integration, cost reduction and lower power consumption of the electronic device new package technologies become more and more of interest. Package-on-Package (PoP) is one of the interesting technologies. Normally PoP Packages consist of BGA SAC bumps. The use of needle bumps, consisting of Cooper was introduced by INVENSAS. This technology was developed for the use under high I/O rates. During high I/O rates Joule heating may occur. Furthermore supported due to the self-heating effect migration effects in the solder material can occur. The thermal-electrical calculation followed by the calculation of migration effects in needle bumps will be presented in this paper. The results will be compared with BGA bumps. Also the influence of the growth of intermetallic compounds will be discussed.
Keywords
- Electromigration, Needle bumps, Package-on-package, Reliability, Simulation
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
- Engineering(all)
- Engineering (miscellaneous)
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
Cite this
- Standard
- Harvard
- Apa
- Vancouver
- BibTeX
- RIS
IMAPS Nordic Annual Conference 2016 Proceedings. ed. / Jarkko Kutilainen. IMAPS-International Microelectronics and Packaging Society, 2016. (IMAPS Nordic Annual Conference 2016 Proceedings).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Simulation of needle bumps in a package-on-package structure
AU - Weide-Zaage, Kirsten
AU - Xu, Peiyu
N1 - Copyright: Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2016
Y1 - 2016
N2 - In the frame of ULSI under the requirement of higher integration, cost reduction and lower power consumption of the electronic device new package technologies become more and more of interest. Package-on-Package (PoP) is one of the interesting technologies. Normally PoP Packages consist of BGA SAC bumps. The use of needle bumps, consisting of Cooper was introduced by INVENSAS. This technology was developed for the use under high I/O rates. During high I/O rates Joule heating may occur. Furthermore supported due to the self-heating effect migration effects in the solder material can occur. The thermal-electrical calculation followed by the calculation of migration effects in needle bumps will be presented in this paper. The results will be compared with BGA bumps. Also the influence of the growth of intermetallic compounds will be discussed.
AB - In the frame of ULSI under the requirement of higher integration, cost reduction and lower power consumption of the electronic device new package technologies become more and more of interest. Package-on-Package (PoP) is one of the interesting technologies. Normally PoP Packages consist of BGA SAC bumps. The use of needle bumps, consisting of Cooper was introduced by INVENSAS. This technology was developed for the use under high I/O rates. During high I/O rates Joule heating may occur. Furthermore supported due to the self-heating effect migration effects in the solder material can occur. The thermal-electrical calculation followed by the calculation of migration effects in needle bumps will be presented in this paper. The results will be compared with BGA bumps. Also the influence of the growth of intermetallic compounds will be discussed.
KW - Electromigration
KW - Needle bumps
KW - Package-on-package
KW - Reliability
KW - Simulation
UR - http://www.scopus.com/inward/record.url?scp=84988028255&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84988028255
T3 - IMAPS Nordic Annual Conference 2016 Proceedings
BT - IMAPS Nordic Annual Conference 2016 Proceedings
A2 - Kutilainen, Jarkko
PB - IMAPS-International Microelectronics and Packaging Society
T2 - IMAPS Nordic Annual Conference 2016
Y2 - 5 June 2016 through 7 June 2016
ER -