Details
| Original language | English |
|---|---|
| Title of host publication | EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems |
| Publication status | Published - 2008 |
| Event | EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Freiburg im Breisgau, Germany Duration: 20 Apr 2008 → 23 Apr 2008 |
Publication series
| Name | EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems |
|---|
Abstract
Due to miniaturisation, higher performance and higher integration, the width of conductive lines as well as the diameter of the solder joints decreases; 3-dimensional packaging like "Package-on-Package" (PoP) is used in compact applications. The density of solder bumps increases, while pitches become finer. This may lead to an increase of the current density in the solder bump. At present for these packages only Finite-Element-simulations concerning the warpage were carried out. For the characterisation of PoP reliability, the migration behaviour of the bumps as well as the traces in the substrate were investigated by finite element simulations. The purpose of this paper is an investigation of the via fill in, ambient temperature, reference temperature of the stress free state as well as the influence of delamination in the interconnections of the PoPs before degradation out of migration effects occur, to find out possible risk for PoPs with smaller bumps and traces.
ASJC Scopus subject areas
- Computer Science(all)
- Computer Science Applications
- Engineering(all)
- Electrical and Electronic Engineering
- Engineering(all)
- Control and Systems Engineering
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EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems. 2008. 4525074 (EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Simulation of migration effects in PoP
AU - Weide-Zaage, Kirsten
AU - Fremont, Helene
AU - Wang, Linyan
N1 - Copyright: Copyright 2008 Elsevier B.V., All rights reserved.
PY - 2008
Y1 - 2008
N2 - Due to miniaturisation, higher performance and higher integration, the width of conductive lines as well as the diameter of the solder joints decreases; 3-dimensional packaging like "Package-on-Package" (PoP) is used in compact applications. The density of solder bumps increases, while pitches become finer. This may lead to an increase of the current density in the solder bump. At present for these packages only Finite-Element-simulations concerning the warpage were carried out. For the characterisation of PoP reliability, the migration behaviour of the bumps as well as the traces in the substrate were investigated by finite element simulations. The purpose of this paper is an investigation of the via fill in, ambient temperature, reference temperature of the stress free state as well as the influence of delamination in the interconnections of the PoPs before degradation out of migration effects occur, to find out possible risk for PoPs with smaller bumps and traces.
AB - Due to miniaturisation, higher performance and higher integration, the width of conductive lines as well as the diameter of the solder joints decreases; 3-dimensional packaging like "Package-on-Package" (PoP) is used in compact applications. The density of solder bumps increases, while pitches become finer. This may lead to an increase of the current density in the solder bump. At present for these packages only Finite-Element-simulations concerning the warpage were carried out. For the characterisation of PoP reliability, the migration behaviour of the bumps as well as the traces in the substrate were investigated by finite element simulations. The purpose of this paper is an investigation of the via fill in, ambient temperature, reference temperature of the stress free state as well as the influence of delamination in the interconnections of the PoPs before degradation out of migration effects occur, to find out possible risk for PoPs with smaller bumps and traces.
UR - http://www.scopus.com/inward/record.url?scp=49349105284&partnerID=8YFLogxK
U2 - 10.1109/ESIME.2008.4525074
DO - 10.1109/ESIME.2008.4525074
M3 - Conference contribution
AN - SCOPUS:49349105284
SN - 9781424421282
T3 - EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
BT - EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
T2 - EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
Y2 - 20 April 2008 through 23 April 2008
ER -