Details
Original language | English |
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Title of host publication | Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005 |
Pages | 353-358 |
Number of pages | 6 |
Publication status | Published - 2005 |
Event | 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005 - Berlin, Germany Duration: 18 Apr 2005 → 20 Apr 2005 |
Publication series
Name | Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005 |
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Volume | 2005 |
ASJC Scopus subject areas
- Engineering(all)
- General Engineering
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Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. 2005. p. 353-358 1502827 (Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005; Vol. 2005).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Simulation of mass flux divergence distributions for an evaluation of commercial test structures with tungsten-plugs
AU - Weide-Zaage, Kirsten
AU - Hein, Verena
N1 - Copyright: Copyright 2011 Elsevier B.V., All rights reserved.
PY - 2005
Y1 - 2005
UR - http://www.scopus.com/inward/record.url?scp=33745683883&partnerID=8YFLogxK
U2 - 10.1109/ESIME.2005.1502827
DO - 10.1109/ESIME.2005.1502827
M3 - Conference contribution
AN - SCOPUS:33745683883
SN - 0780390628
SN - 9780780390621
T3 - Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005
SP - 353
EP - 358
BT - Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005
T2 - 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005
Y2 - 18 April 2005 through 20 April 2005
ER -