Details
| Original language | English |
|---|---|
| Title of host publication | 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 |
| Publication status | Published - 2013 |
| Event | 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 - Wroclaw, Poland Duration: 14 Apr 2013 → 17 Apr 2013 |
Publication series
| Name | 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 |
|---|
Abstract
With the aim to miniaturize and to reduce the cost, the increasing demand, regarding to advanced 3D-packages as well as high performance applications, accelerates the development of 3D-silicon integrated circuits. The trend to smaller and lighter electronics has highlighted many efforts towards size reduction and increased performance in electronic products. RF performances are limited by parasitic effects due to the RLC network between the wirebond from the dies to the leadframe. The use of flip-chip bonding technology for very fine pitch packaging allows high integration and limits parasitic inductances. Electromigration (EM) and thermomigration (TM) may have serious reliability issues for fine-pitch Pb-free solder bumps in the flip-chip technology used in consumer electronic products. A possibility to extend the reliability is the use of plastic ball in the solder bumps. Bumps containing a plastic solder balls have an excellent reliability. Using a plastic ball with a low Young modulus, the solder hardness is moderated and the stress on a ball is relaxed. Due to this the stress doesn't concentrate on the solder joint which prolongs the lifetime. In this investigation the thermal-electrical-mechanical influence of electromigration on bumps containing a plastic solder is investigated.
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
- Mathematics(all)
- Modelling and Simulation
Cite this
- Standard
- Harvard
- Apa
- Vancouver
- BibTeX
- RIS
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 2013. 6529979 (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Simulation and measurement of the solder bumps with a plastic core
AU - Schlobohm, J.
AU - Weide-Zaage, K.
AU - Rongen, R.
AU - Voogt, F.
AU - Roucou, R.
N1 - Copyright: Copyright 2013 Elsevier B.V., All rights reserved.
PY - 2013
Y1 - 2013
N2 - With the aim to miniaturize and to reduce the cost, the increasing demand, regarding to advanced 3D-packages as well as high performance applications, accelerates the development of 3D-silicon integrated circuits. The trend to smaller and lighter electronics has highlighted many efforts towards size reduction and increased performance in electronic products. RF performances are limited by parasitic effects due to the RLC network between the wirebond from the dies to the leadframe. The use of flip-chip bonding technology for very fine pitch packaging allows high integration and limits parasitic inductances. Electromigration (EM) and thermomigration (TM) may have serious reliability issues for fine-pitch Pb-free solder bumps in the flip-chip technology used in consumer electronic products. A possibility to extend the reliability is the use of plastic ball in the solder bumps. Bumps containing a plastic solder balls have an excellent reliability. Using a plastic ball with a low Young modulus, the solder hardness is moderated and the stress on a ball is relaxed. Due to this the stress doesn't concentrate on the solder joint which prolongs the lifetime. In this investigation the thermal-electrical-mechanical influence of electromigration on bumps containing a plastic solder is investigated.
AB - With the aim to miniaturize and to reduce the cost, the increasing demand, regarding to advanced 3D-packages as well as high performance applications, accelerates the development of 3D-silicon integrated circuits. The trend to smaller and lighter electronics has highlighted many efforts towards size reduction and increased performance in electronic products. RF performances are limited by parasitic effects due to the RLC network between the wirebond from the dies to the leadframe. The use of flip-chip bonding technology for very fine pitch packaging allows high integration and limits parasitic inductances. Electromigration (EM) and thermomigration (TM) may have serious reliability issues for fine-pitch Pb-free solder bumps in the flip-chip technology used in consumer electronic products. A possibility to extend the reliability is the use of plastic ball in the solder bumps. Bumps containing a plastic solder balls have an excellent reliability. Using a plastic ball with a low Young modulus, the solder hardness is moderated and the stress on a ball is relaxed. Due to this the stress doesn't concentrate on the solder joint which prolongs the lifetime. In this investigation the thermal-electrical-mechanical influence of electromigration on bumps containing a plastic solder is investigated.
UR - http://www.scopus.com/inward/record.url?scp=84880978664&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE.2013.6529979
DO - 10.1109/EuroSimE.2013.6529979
M3 - Conference contribution
AN - SCOPUS:84880978664
SN - 9781467361385
T3 - 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
BT - 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
T2 - 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
Y2 - 14 April 2013 through 17 April 2013
ER -