Details
| Original language | English |
|---|---|
| Pages (from-to) | 1206-1211 |
| Number of pages | 6 |
| Journal | Microelectronics reliability |
| Volume | 54 |
| Issue number | 6-7 |
| Publication status | Published - 2014 |
Abstract
With the aim to miniaturize and to reduce the cost, the increasing demand, regarding to advanced 3D-packages as well as high performance applications, accelerates the development of 3D-silicon integrated circuits. The trend to smaller and lighter electronics has highlighted many efforts towards size reduction and increased performance in electronic products. The radio frequency (RF) performances are limited by parasitic effects due to the resistor-inductor-capacitor (RLC) network, between the wire bond connections from the dies to the lead frame. The use of flip-chip bonding technology for very fine pitch packaging allows high integration and limits parasitic inductances. Electromigration (EM) and thermomigration (TM) may have serious reliability issues for fine-pitch Pb-free solder bumps in the flip-chip technology used in consumer electronic products. A possibility to extend the reliability is the use of plastic ball in the solder bumps. Bumps containing a plastic solder balls have an excellent reliability. Using a plastic ball with a low Young modulus, the solder hardness is moderated and the stress on a ball is relaxed. Due to this, the stress does not concentrate on the solder joint which prolongs the lifetime. In this investigation, the thermal-electrical-mechanical coupling of electromigration on bumps containing a plastic solder is studied.
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Physics and Astronomy(all)
- Atomic and Molecular Physics, and Optics
- Engineering(all)
- Safety, Risk, Reliability and Quality
- Physics and Astronomy(all)
- Condensed Matter Physics
- Materials Science(all)
- Surfaces, Coatings and Films
- Engineering(all)
- Electrical and Electronic Engineering
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In: Microelectronics reliability, Vol. 54, No. 6-7, 2014, p. 1206-1211.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core
AU - Weide-Zaage, K.
AU - Schlobohm, J.
AU - Rongen, R. T.H.
AU - Voogt, F. C.
AU - Roucou, R.
N1 - Copyright: Copyright 2014 Elsevier B.V., All rights reserved.
PY - 2014
Y1 - 2014
N2 - With the aim to miniaturize and to reduce the cost, the increasing demand, regarding to advanced 3D-packages as well as high performance applications, accelerates the development of 3D-silicon integrated circuits. The trend to smaller and lighter electronics has highlighted many efforts towards size reduction and increased performance in electronic products. The radio frequency (RF) performances are limited by parasitic effects due to the resistor-inductor-capacitor (RLC) network, between the wire bond connections from the dies to the lead frame. The use of flip-chip bonding technology for very fine pitch packaging allows high integration and limits parasitic inductances. Electromigration (EM) and thermomigration (TM) may have serious reliability issues for fine-pitch Pb-free solder bumps in the flip-chip technology used in consumer electronic products. A possibility to extend the reliability is the use of plastic ball in the solder bumps. Bumps containing a plastic solder balls have an excellent reliability. Using a plastic ball with a low Young modulus, the solder hardness is moderated and the stress on a ball is relaxed. Due to this, the stress does not concentrate on the solder joint which prolongs the lifetime. In this investigation, the thermal-electrical-mechanical coupling of electromigration on bumps containing a plastic solder is studied.
AB - With the aim to miniaturize and to reduce the cost, the increasing demand, regarding to advanced 3D-packages as well as high performance applications, accelerates the development of 3D-silicon integrated circuits. The trend to smaller and lighter electronics has highlighted many efforts towards size reduction and increased performance in electronic products. The radio frequency (RF) performances are limited by parasitic effects due to the resistor-inductor-capacitor (RLC) network, between the wire bond connections from the dies to the lead frame. The use of flip-chip bonding technology for very fine pitch packaging allows high integration and limits parasitic inductances. Electromigration (EM) and thermomigration (TM) may have serious reliability issues for fine-pitch Pb-free solder bumps in the flip-chip technology used in consumer electronic products. A possibility to extend the reliability is the use of plastic ball in the solder bumps. Bumps containing a plastic solder balls have an excellent reliability. Using a plastic ball with a low Young modulus, the solder hardness is moderated and the stress on a ball is relaxed. Due to this, the stress does not concentrate on the solder joint which prolongs the lifetime. In this investigation, the thermal-electrical-mechanical coupling of electromigration on bumps containing a plastic solder is studied.
UR - http://www.scopus.com/inward/record.url?scp=84901610005&partnerID=8YFLogxK
U2 - 10.1016/j.microrel.2014.02.021
DO - 10.1016/j.microrel.2014.02.021
M3 - Article
AN - SCOPUS:84901610005
VL - 54
SP - 1206
EP - 1211
JO - Microelectronics reliability
JF - Microelectronics reliability
SN - 0026-2714
IS - 6-7
ER -