Details
| Original language | English |
|---|---|
| Pages | 223-226 |
| Number of pages | 4 |
| Publication status | Published - 1998 |
| Event | 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging - West Point, United States Duration: 26 Oct 1998 → 28 Oct 1998 |
Conference
| Conference | 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging |
|---|---|
| Country/Territory | United States |
| City | West Point |
| Period | 26 Oct 1998 → 28 Oct 1998 |
Abstract
Since conducting substrates can significantly affect the performance of integrated circuits models have been developed to describe the influence of the substrate on the signal propagation on interconnects in a simple way. From these models easy formulas for the accurate computation of the frequency dependent line parameters are derived and compared with numerical simulations and measurements.
ASJC Scopus subject areas
- Engineering(all)
- General Engineering
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1998. 223-226 Paper presented at 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging, West Point, New York, United States.
Research output: Contribution to conference › Paper › Research › peer review
}
TY - CONF
T1 - Simple formulas to calculate the line parameters of interconnects on conducting substrates
AU - Grabinski, H.
AU - Konrad, B.
AU - Nordholz, P.
PY - 1998
Y1 - 1998
N2 - Since conducting substrates can significantly affect the performance of integrated circuits models have been developed to describe the influence of the substrate on the signal propagation on interconnects in a simple way. From these models easy formulas for the accurate computation of the frequency dependent line parameters are derived and compared with numerical simulations and measurements.
AB - Since conducting substrates can significantly affect the performance of integrated circuits models have been developed to describe the influence of the substrate on the signal propagation on interconnects in a simple way. From these models easy formulas for the accurate computation of the frequency dependent line parameters are derived and compared with numerical simulations and measurements.
UR - http://www.scopus.com/inward/record.url?scp=0032288104&partnerID=8YFLogxK
U2 - 10.1109/EPEP.1998.733992
DO - 10.1109/EPEP.1998.733992
M3 - Paper
AN - SCOPUS:0032288104
SP - 223
EP - 226
T2 - 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging
Y2 - 26 October 1998 through 28 October 1998
ER -