Details
| Original language | English |
|---|---|
| Title of host publication | ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (electronic) | 9781509007370 |
| Publication status | Published - 2016 |
| Event | 2016 IEEE Energy Conversion Congress and Exposition, ECCE 2016 - Milwaukee, United States Duration: 18 Sept 2016 → 22 Sept 2016 |
Publication series
| Name | ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings |
|---|
Abstract
IGBT modules suffer from ageing due to thermal and power cycling. Bond wire lift-off or solder layer degradation are the known failure mechanisms. For condition monitoring, an estimation of the junction temperature during operation is necessary. For this purpose, an analog measurement board consisting of simple components is presented. The turn-off delay time is evaluated for temperature estimation. Moreover, a validation of the temperature estimation with an infrared camera is performed.
ASJC Scopus subject areas
- Engineering(all)
- Control and Systems Engineering
- Engineering(all)
- Electrical and Electronic Engineering
- Energy(all)
- Energy Engineering and Power Technology
- Mathematics(all)
- Control and Optimization
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ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings. Institute of Electrical and Electronics Engineers Inc., 2016. 7855433 (ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Simple analog detection of turn-off delay time for IGBT junction temperature estimation
AU - Weber, Simon
AU - Schlüter, Michael
AU - Borowski, Daniel
AU - Mertens, Axel
PY - 2016
Y1 - 2016
N2 - IGBT modules suffer from ageing due to thermal and power cycling. Bond wire lift-off or solder layer degradation are the known failure mechanisms. For condition monitoring, an estimation of the junction temperature during operation is necessary. For this purpose, an analog measurement board consisting of simple components is presented. The turn-off delay time is evaluated for temperature estimation. Moreover, a validation of the temperature estimation with an infrared camera is performed.
AB - IGBT modules suffer from ageing due to thermal and power cycling. Bond wire lift-off or solder layer degradation are the known failure mechanisms. For condition monitoring, an estimation of the junction temperature during operation is necessary. For this purpose, an analog measurement board consisting of simple components is presented. The turn-off delay time is evaluated for temperature estimation. Moreover, a validation of the temperature estimation with an infrared camera is performed.
UR - http://www.scopus.com/inward/record.url?scp=85015410067&partnerID=8YFLogxK
U2 - 10.1109/ECCE.2016.7855433
DO - 10.1109/ECCE.2016.7855433
M3 - Conference contribution
AN - SCOPUS:85015410067
T3 - ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings
BT - ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2016 IEEE Energy Conversion Congress and Exposition, ECCE 2016
Y2 - 18 September 2016 through 22 September 2016
ER -