Details
| Original language | English |
|---|---|
| Title of host publication | 2024 IEEE 74th Electronic Components and Technology Conference |
| Subtitle of host publication | (ECTC) |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 193-200 |
| Number of pages | 8 |
| ISBN (electronic) | 9798350375985 |
| ISBN (print) | 979-8-3503-7599-2 |
| Publication status | Published - 2024 |
| Event | 74th IEEE Electronic Components and Technology Conference, ECTC 2024 - Denver, United States Duration: 28 May 2024 → 31 May 2024 |
Publication series
| Name | Proceedings - Electronic Components and Technology Conference |
|---|---|
| ISSN (Print) | 0569-5503 |
Abstract
Hermetic Packages are of great importance for the recent miniaturization of quantum systems to secure a defined vacuum and gas species. In this work, a silicon membrane pressure sensor based on platinum strain gauge structures to measure the pressure dependent deflection of the membrane is shown. The pressure sensors are used for inline monitoring of pressure and hermeticity of small-volume bonded packages. For this purpose, the sensors are fabricated by silicon microtechnology, characterized in a developed calibration setup and finally the pressure monitoring and hermeticity test of bonded packages were carried out.
Keywords
- hermetic packages, hermeticity monitoring, pressure sensor
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Engineering(all)
- Electrical and Electronic Engineering
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2024 IEEE 74th Electronic Components and Technology Conference : (ECTC). Institute of Electrical and Electronics Engineers Inc., 2024. p. 193-200 (Proceedings - Electronic Components and Technology Conference).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Silicon-based membrane pressure sensor for inline monitoring of pressure and hermeticity of small-volume bonded packages
AU - Koch, Jannik
AU - Brinkmann, Levin Marten
AU - Kassner, Alexander
AU - Dencker, Folke
AU - Wurz, Marc Christopher
N1 - Publisher Copyright: © 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Hermetic Packages are of great importance for the recent miniaturization of quantum systems to secure a defined vacuum and gas species. In this work, a silicon membrane pressure sensor based on platinum strain gauge structures to measure the pressure dependent deflection of the membrane is shown. The pressure sensors are used for inline monitoring of pressure and hermeticity of small-volume bonded packages. For this purpose, the sensors are fabricated by silicon microtechnology, characterized in a developed calibration setup and finally the pressure monitoring and hermeticity test of bonded packages were carried out.
AB - Hermetic Packages are of great importance for the recent miniaturization of quantum systems to secure a defined vacuum and gas species. In this work, a silicon membrane pressure sensor based on platinum strain gauge structures to measure the pressure dependent deflection of the membrane is shown. The pressure sensors are used for inline monitoring of pressure and hermeticity of small-volume bonded packages. For this purpose, the sensors are fabricated by silicon microtechnology, characterized in a developed calibration setup and finally the pressure monitoring and hermeticity test of bonded packages were carried out.
KW - hermetic packages
KW - hermeticity monitoring
KW - pressure sensor
UR - http://www.scopus.com/inward/record.url?scp=85197679206&partnerID=8YFLogxK
U2 - 10.1109/ECTC51529.2024.00040
DO - 10.1109/ECTC51529.2024.00040
M3 - Conference contribution
AN - SCOPUS:85197679206
SN - 979-8-3503-7599-2
T3 - Proceedings - Electronic Components and Technology Conference
SP - 193
EP - 200
BT - 2024 IEEE 74th Electronic Components and Technology Conference
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 74th IEEE Electronic Components and Technology Conference, ECTC 2024
Y2 - 28 May 2024 through 31 May 2024
ER -