Silicon surface passivation by atomic layer deposited Al2 O 3

Research output: Contribution to journalArticleResearchpeer review

Authors

  • B. Hoex
  • J. Schmidt
  • P. Pohl
  • M. C.M. Van De Sanden
  • W. M.M. Kessels

External Research Organisations

  • Eindhoven University of Technology (TU/e)
  • Institute for Solar Energy Research (ISFH)
View graph of relations

Details

Original languageEnglish
Article number044903
JournalJournal of applied physics
Volume104
Issue number4
Publication statusPublished - 2008
Externally publishedYes

Abstract

Thin Al2 O3 films with a thickness of 7-30 nm synthesized by plasma-assisted atomic layer deposition (ALD) were used for surface passivation of crystalline silicon (c-Si) of different doping concentrations. The level of surface passivation in this study was determined by techniques based on photoconductance, photoluminescence, and infrared emission. Effective surface recombination velocities of 2 and 6 cm/s were obtained on 1.9 Ω cm n -type and 2.0 Ω cm p -type c-Si, respectively. An effective surface recombination velocity below 1 cm/s was unambiguously obtained for nearly intrinsic c-Si passivated by Al2 O3. A high density of negative fixed charges was detected in the Al2 O3 films and its impact on the level of surface passivation was demonstrated experimentally. The negative fixed charge density results in a flat injection level dependence of the effective lifetime on p -type c-Si and explains the excellent passivation of highly B-doped c-Si by Al2 O3. Furthermore, a brief comparison is presented between the surface passivations achieved for thermal and plasma-assisted ALD Al2 O3 films prepared in the same ALD reactor.

ASJC Scopus subject areas

Cite this

Silicon surface passivation by atomic layer deposited Al2 O 3. / Hoex, B.; Schmidt, J.; Pohl, P. et al.
In: Journal of applied physics, Vol. 104, No. 4, 044903, 2008.

Research output: Contribution to journalArticleResearchpeer review

Hoex, B, Schmidt, J, Pohl, P, Van De Sanden, MCM & Kessels, WMM 2008, 'Silicon surface passivation by atomic layer deposited Al2 O 3', Journal of applied physics, vol. 104, no. 4, 044903. https://doi.org/10.1063/1.2963707
Hoex, B., Schmidt, J., Pohl, P., Van De Sanden, M. C. M., & Kessels, W. M. M. (2008). Silicon surface passivation by atomic layer deposited Al2 O 3. Journal of applied physics, 104(4), Article 044903. https://doi.org/10.1063/1.2963707
Hoex B, Schmidt J, Pohl P, Van De Sanden MCM, Kessels WMM. Silicon surface passivation by atomic layer deposited Al2 O 3. Journal of applied physics. 2008;104(4):044903. doi: 10.1063/1.2963707
Download
@article{d3d1ae16cb4f4dfeab64dfbee5f24754,
title = "Silicon surface passivation by atomic layer deposited Al2 O 3",
abstract = "Thin Al2 O3 films with a thickness of 7-30 nm synthesized by plasma-assisted atomic layer deposition (ALD) were used for surface passivation of crystalline silicon (c-Si) of different doping concentrations. The level of surface passivation in this study was determined by techniques based on photoconductance, photoluminescence, and infrared emission. Effective surface recombination velocities of 2 and 6 cm/s were obtained on 1.9 Ω cm n -type and 2.0 Ω cm p -type c-Si, respectively. An effective surface recombination velocity below 1 cm/s was unambiguously obtained for nearly intrinsic c-Si passivated by Al2 O3. A high density of negative fixed charges was detected in the Al2 O3 films and its impact on the level of surface passivation was demonstrated experimentally. The negative fixed charge density results in a flat injection level dependence of the effective lifetime on p -type c-Si and explains the excellent passivation of highly B-doped c-Si by Al2 O3. Furthermore, a brief comparison is presented between the surface passivations achieved for thermal and plasma-assisted ALD Al2 O3 films prepared in the same ALD reactor.",
author = "B. Hoex and J. Schmidt and P. Pohl and {Van De Sanden}, {M. C.M.} and Kessels, {W. M.M.}",
year = "2008",
doi = "10.1063/1.2963707",
language = "English",
volume = "104",
journal = "Journal of applied physics",
issn = "0021-8979",
publisher = "American Institute of Physics",
number = "4",

}

Download

TY - JOUR

T1 - Silicon surface passivation by atomic layer deposited Al2 O 3

AU - Hoex, B.

AU - Schmidt, J.

AU - Pohl, P.

AU - Van De Sanden, M. C.M.

AU - Kessels, W. M.M.

PY - 2008

Y1 - 2008

N2 - Thin Al2 O3 films with a thickness of 7-30 nm synthesized by plasma-assisted atomic layer deposition (ALD) were used for surface passivation of crystalline silicon (c-Si) of different doping concentrations. The level of surface passivation in this study was determined by techniques based on photoconductance, photoluminescence, and infrared emission. Effective surface recombination velocities of 2 and 6 cm/s were obtained on 1.9 Ω cm n -type and 2.0 Ω cm p -type c-Si, respectively. An effective surface recombination velocity below 1 cm/s was unambiguously obtained for nearly intrinsic c-Si passivated by Al2 O3. A high density of negative fixed charges was detected in the Al2 O3 films and its impact on the level of surface passivation was demonstrated experimentally. The negative fixed charge density results in a flat injection level dependence of the effective lifetime on p -type c-Si and explains the excellent passivation of highly B-doped c-Si by Al2 O3. Furthermore, a brief comparison is presented between the surface passivations achieved for thermal and plasma-assisted ALD Al2 O3 films prepared in the same ALD reactor.

AB - Thin Al2 O3 films with a thickness of 7-30 nm synthesized by plasma-assisted atomic layer deposition (ALD) were used for surface passivation of crystalline silicon (c-Si) of different doping concentrations. The level of surface passivation in this study was determined by techniques based on photoconductance, photoluminescence, and infrared emission. Effective surface recombination velocities of 2 and 6 cm/s were obtained on 1.9 Ω cm n -type and 2.0 Ω cm p -type c-Si, respectively. An effective surface recombination velocity below 1 cm/s was unambiguously obtained for nearly intrinsic c-Si passivated by Al2 O3. A high density of negative fixed charges was detected in the Al2 O3 films and its impact on the level of surface passivation was demonstrated experimentally. The negative fixed charge density results in a flat injection level dependence of the effective lifetime on p -type c-Si and explains the excellent passivation of highly B-doped c-Si by Al2 O3. Furthermore, a brief comparison is presented between the surface passivations achieved for thermal and plasma-assisted ALD Al2 O3 films prepared in the same ALD reactor.

UR - http://www.scopus.com/inward/record.url?scp=50849137808&partnerID=8YFLogxK

U2 - 10.1063/1.2963707

DO - 10.1063/1.2963707

M3 - Article

AN - SCOPUS:50849137808

VL - 104

JO - Journal of applied physics

JF - Journal of applied physics

SN - 0021-8979

IS - 4

M1 - 044903

ER -

By the same author(s)