Silicon field emitter arrays produced via wafer dicing

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

View graph of relations

Details

Original languageEnglish
Title of host publication2017 30th International Vacuum Nanoelectronics Conference (IVNC)
EditorsChristoph Langer, Robert Lawrowski
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages132-133
Number of pages2
ISBN (electronic)9781509039753, 978-1-5090-3974-6
ISBN (print)978-1-5090-3976-0
Publication statusPublished - 2017
Event30th International Vacuum Nanoelectronics Conference - Regensburg, Germany
Duration: 10 Jul 201714 Jul 2017
Conference number: 30
https://www.aconf.org/conf_92671.html

Publication series

NameInternational Vacuum Nanoelectronics Conference
PublisherIEEE
ISSN (electronic)2380-6311

Abstract

In this work, a p-Si field emitter array produced by wafer dicing is presented. Different strategies to produce a variety of shapes of the tips are shown. The resulting arrays show excellent emission characteristics compared to other field emitter, like carbon nano tubes.

Keywords

    chipping, dicing, emission, field emitter, silicon

ASJC Scopus subject areas

Cite this

Silicon field emitter arrays produced via wafer dicing. / Kusch, Alexander; Wurz, Marc; Bunert, Erik et al.
2017 30th International Vacuum Nanoelectronics Conference (IVNC). ed. / Christoph Langer; Robert Lawrowski. Institute of Electrical and Electronics Engineers Inc., 2017. p. 132-133 8051577 (International Vacuum Nanoelectronics Conference).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Kusch, A, Wurz, M, Bunert, E & Zimmermann, S 2017, Silicon field emitter arrays produced via wafer dicing. in C Langer & R Lawrowski (eds), 2017 30th International Vacuum Nanoelectronics Conference (IVNC)., 8051577, International Vacuum Nanoelectronics Conference, Institute of Electrical and Electronics Engineers Inc., pp. 132-133, 30th International Vacuum Nanoelectronics Conference, Regensburg, Baden-Württemberg, Germany, 10 Jul 2017. https://doi.org/10.1109/IVNC.2017.8051577
Kusch, A., Wurz, M., Bunert, E., & Zimmermann, S. (2017). Silicon field emitter arrays produced via wafer dicing. In C. Langer, & R. Lawrowski (Eds.), 2017 30th International Vacuum Nanoelectronics Conference (IVNC) (pp. 132-133). Article 8051577 (International Vacuum Nanoelectronics Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IVNC.2017.8051577
Kusch A, Wurz M, Bunert E, Zimmermann S. Silicon field emitter arrays produced via wafer dicing. In Langer C, Lawrowski R, editors, 2017 30th International Vacuum Nanoelectronics Conference (IVNC). Institute of Electrical and Electronics Engineers Inc. 2017. p. 132-133. 8051577. (International Vacuum Nanoelectronics Conference). doi: 10.1109/IVNC.2017.8051577
Kusch, Alexander ; Wurz, Marc ; Bunert, Erik et al. / Silicon field emitter arrays produced via wafer dicing. 2017 30th International Vacuum Nanoelectronics Conference (IVNC). editor / Christoph Langer ; Robert Lawrowski. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 132-133 (International Vacuum Nanoelectronics Conference).
Download
@inproceedings{82a5e07e88c04ac3a44ec1eb08ceef62,
title = "Silicon field emitter arrays produced via wafer dicing",
abstract = "In this work, a p-Si field emitter array produced by wafer dicing is presented. Different strategies to produce a variety of shapes of the tips are shown. The resulting arrays show excellent emission characteristics compared to other field emitter, like carbon nano tubes.",
keywords = "chipping, dicing, emission, field emitter, silicon",
author = "Alexander Kusch and Marc Wurz and Erik Bunert and Stefan Zimmermann",
year = "2017",
doi = "10.1109/IVNC.2017.8051577",
language = "English",
isbn = "978-1-5090-3976-0",
series = "International Vacuum Nanoelectronics Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "132--133",
editor = "Christoph Langer and Robert Lawrowski",
booktitle = "2017 30th International Vacuum Nanoelectronics Conference (IVNC)",
address = "United States",
note = "30th International Vacuum Nanoelectronics Conference, IVNC 2017 ; Conference date: 10-07-2017 Through 14-07-2017",
url = "https://www.aconf.org/conf_92671.html",

}

Download

TY - GEN

T1 - Silicon field emitter arrays produced via wafer dicing

AU - Kusch, Alexander

AU - Wurz, Marc

AU - Bunert, Erik

AU - Zimmermann, Stefan

N1 - Conference code: 30

PY - 2017

Y1 - 2017

N2 - In this work, a p-Si field emitter array produced by wafer dicing is presented. Different strategies to produce a variety of shapes of the tips are shown. The resulting arrays show excellent emission characteristics compared to other field emitter, like carbon nano tubes.

AB - In this work, a p-Si field emitter array produced by wafer dicing is presented. Different strategies to produce a variety of shapes of the tips are shown. The resulting arrays show excellent emission characteristics compared to other field emitter, like carbon nano tubes.

KW - chipping

KW - dicing

KW - emission

KW - field emitter

KW - silicon

UR - http://www.scopus.com/inward/record.url?scp=85032800817&partnerID=8YFLogxK

U2 - 10.1109/IVNC.2017.8051577

DO - 10.1109/IVNC.2017.8051577

M3 - Conference contribution

AN - SCOPUS:85032800817

SN - 978-1-5090-3976-0

T3 - International Vacuum Nanoelectronics Conference

SP - 132

EP - 133

BT - 2017 30th International Vacuum Nanoelectronics Conference (IVNC)

A2 - Langer, Christoph

A2 - Lawrowski, Robert

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 30th International Vacuum Nanoelectronics Conference

Y2 - 10 July 2017 through 14 July 2017

ER -

By the same author(s)